OCL: Open Circuit Inductance test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. OCL@-40 °C can
be lower than OCL@+20 °C by 15% max.
2)
Irms: DC current for an approximate DT of 40 °C without core loss. Derating is necessary for
AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat
generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed
+125
°C under worst case operating conditions verified in
the end application.
3)
Isat1: Amperes Peak for approximately 30% rolloff (@+25 °C)
4)
Isat2: Amperes Peak for approximately 30% rolloff (@+125 °C)
5) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I
B p-p:(mT), K: (K factor from table), L: (Inductance in µH),
∆I
(Peak to peak ripple current in
Amps).
Part number definition:
HCF1305-XXX-R
HCF1305 = Product code and size
XXX = Inductance value in uH.
R = Decimal point. If no R is present, third character = #of zeros -R suffix
indicates RoHS compliant
Dimensions-
mm
TOP V IEW
A
BOTTOM VI EW
F
FRONT VIEW
DIMENSION TABLE
RECOMMENDED PCBLAYOU T
L
SCHEMAT IC
1
HCF1305-XXX
wwllyy R
B
2
D
C
3
A: 12.5max
G: 4.00 Ref
.
B: 12.5max
H: 5.40 Ref.
C: 5.0max
I: 3.00 Ref.
D: 2.00 ref
J: 4.00 Ref.
E: 2.40 +/- 0.10 K: 4.00 Ref.
F: 6.90 +/- 0.30 L: 3.4 Ref.
K
H
G
J
1
2
wwllyy=Date code, R=Revision Level
I
I
E
Do not route traces or vias underneath the inductor
Packaging
information
- mm
1.5 dia
+0.1/-0.0
2.0
4.0
1.5 dia
min
A
1.75
11.5
24.0
+/-0.3
HCF 1305-X X X
wwlly y-R
B0
K0
A0
16.00
A
SECTION A-A
A0= 12.60 mm
B0= 12.60 mm
K0= 5.50 m
m
User direction of feed
Parts packaged on a 13" Diameter reel.
600 parts per reel.
2
www.eaton.com/electronics
HCF1305
High frequency, high current power inductor
Temperature rise
vs
total loss
Technical Data
4133
Effective
July
2017
100
Temperature Rise (ºC)
80
60
40
20
0
0
0.4
0.8
1.2
1.6
2
Total Pow er Loss (W)
Core
loss
vs Bp-p
10
1 MHz
500
kHz
300
kHz
200
kHz
100 kHz
Core Loss (W)
1
0.1
0.01
0.001
0.0001
1
10
Bp-p (m T)
100
1000
Inductance characteristics
Normalized Rollo Curves at 25 Deg. C
100.0%
100.0%
90.0%
80.0%
70.0%
60.0%
50.0%
40.0%
30.0%
0.0%
R47, 1R0, 1R8 , 3R0 and 4R0
R56, 1R2 and 2R2
3R3 and 4R7
Normali
Curves at 125 Deg. C
90.0%
80.0%
% of OC L
70.0%
R47, 1R0, 1R8, 3R0 and 4R0
R56, 1R2 and 2R2
3R3 and 4R7
60.0%
50.0%
40.0%
0.0%
% of OCL
20.0%
40.0%
20.0%
40.0%
60.0%
80.0%
% of I
SAT1
100.0%
120.0%
140.0%
60.0%
80.0%
% of I
SAT2
100.0%
120.0%
140.0%
www.eaton.com/electronics
3
Technical Data
4133
Effective
July
2017
HCF1305
High frequency, high current power inductor
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
T
able
2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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