dual power SCR outputs. This device features Rapid
Turn-On (non-zero-cross) control of the output SCRs,
which makes it ideal for precisely switching AC loads
independent of the load voltage phase.
The optically coupled input and output circuits
provide 5000V
rms
of isolation and noise immunity
between the control and load circuits. As a result, the
CPC1964BX6 is well suited for industrial environments
where electromagnetic interference would disrupt the
operation of plant facility communication and control
systems.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Load Current up to 1.5A
rms
600V
P
Blocking Voltage
High Surge Current: 15A
Rapid Turn-On (Non-Zero-Cross Turn-On)
5mA Sensitivity
Creepage Distance: 0.220" on Output Pins
12.5mm External Creepage Distance
DC Control, AC Output
Optically Isolated
TTL and CMOS Compatible
Low EMI and RFI Generation
High Noise Immunity
Machine Insertable, Wave Solderable
Approvals
•
UL Recognized Component: File E69938
•
CSA Certified Component: Certificate 1172007
Ordering Information
Part #
CPC1964BX6
Description
8-Pin Power SOIC (25/Tube)
Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
HVAC Control (Heating, Ventilation, Air Conditioning)
Lighting
Programmable Control
Process Control
Power Control Panels
Remote Switching
Gas Pump Electronics
Contactors
Large Relays
Solenoids
Motors
Heaters
Meters
Pin Configuration
AC Load
8
7
AC Load
6
5
R
1
N/C
2
+ LED
3
– LED
4
N/C
Rapid Turn-On (Non Zero-Cross) Waveforms
Control
AC Load
Voltage
Load
Current
Voltage
Across
Relay
DS-CPC1964BX6-R01
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage (V
DRM
)
Reverse Input Voltage
Input Control Current
Peak (10ms)
di/dt Critical Rate of Rise
of On-State Current
Input Power Dissipation
1
Total Power Dissipation
2
ESD, Human Body Model
i
2
t Fusing Current (1/2 Sine Wave, 60Hz)
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
CPC1964BX6
Ratings
600
5
50
1
20
150
2400
4
2
5000
-40 to +85
-40 to +125
Units
V
P
V
mA
A
A/s
mW
mW
kV
A
2
s
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 20 mW / ºC
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current, Continuous
Maximum Surge Current
Off State Leakage Current
On-State Voltage Drop
Off-State dV/dt
Switching Speeds
Turn-on
Turn-off
Holding Current
Latching Current
Operating Frequency
Input Characteristics
Input Control Current to Activate
1
Input Drop-out Voltage
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
Conditions
V
L
=20-240V
rms
t < 16ms
V
DRM
I
L
=1.5A
P
-
I
F
= 5mA, Resistive
V
L
=20V, 60Hz
-
-
-
60Hz
-
I
F
=5mA
V
R
=5V
-
Symbol
I
L
I
P
I
LEAK
-
dV/dt
t
on
t
off
I
H
I
L
Min
0.07
-
-
-
1000
-
-
-
-
20
-
0.8
0.9
-
-
Typ
-
-
-
1.21
-
20
-
44
48
-
-
-
1.2
-
-
Max
1.5
15
100
1.4
-
500
0.5
75
75
500
5
-
1.4
10
3
Units
A
rms
A
A
P
V
P
V/s
s
cycles
mA
mA
Hz
mA
V
V
A
pF
I
F
-
V
F
I
R
C
I/O
For high-noise environments, or for high-frequency operation, use I
F
> 10mA.
2
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
On-State Forward Voltage Drop
(N=50, I
F
=5mA, I
L
=1.5A)
30
25
Device Count (N)
20
15
10
5
1.200 1.205 1.210 1.215 1.220 1.225 1.230
Forward Voltage (V
P
)
CPC1964BX6
35
30
Device Count (N)
35
30
Device Count (N)
25
20
15
10
5
0
Typical I
F
for Switch Operation
Resistive Load
(N=50, I
L
=1.5A, V
L
=120V
AC
60Hz)
25
20
15
10
5
0
1.25
1.26
1.27
1.28
1.29
LED Forward Voltage (V)
1.30
0
1.5
1.7
1.9
2.1
2.3
LED Current (mA)
2.5
2.7
Typical Blocking Voltage Distribution
(N=50)
25
20
15
10
5
0
747
750
753 756 759 762 765
Blocking Voltage (V
P
)
768
Typical LED Forward Voltage Drop
vs. Temperature
1.6
LED Forward Voltage (V)
1.5
1.4
1.3
1.2
1.1
-40
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
70
60
Turn-On Time ( s)
Device Count (N)
Typical Turn-On Time
vs. LED Forward Current
20
Turn-On Time ( s)
Turn-On Time vs. Temperature
I
F
=5mA
50
40
30
20
10
0
0
10
20
30
40
LED Forward Current (mA)
50
15
I
F
=10mA
10
5
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
2.9
LED Forward Current (mA)
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
-40
Typical I
F
for Switch Operation
Resistive Load
(I
L
=350mA, 60Hz)
-20
0
20
40
60
Temperature (ºC)
80
100
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R01
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
Holding Current
(R
L
=1.9 )
On-State Voltage (V
P
)
CPC1964BX6
On-State Voltage vs. Temperature
1.25
1.20
1.15
1.10
1.05
1.00
0.95
I
L
=0.5A
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
I
L
=1.5A
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-1.5
80
Holding current (mA)
70
60
50
40
30
20
-40
-20
Typical Load Current
vs. Load Voltage
(I
F
=5mA)
@ 85ºC
@ 25ºC
@ -40ºC
I
L
=1A
0
20
40
60
Temperature (ºC)
80
100
-1.0
-0.5
0.0
0.5
1.0
1.5
Load Voltage (V)
1.75
Load Current (A
rms
)
1.50
1.25
1.00
0.75
0.50
-40
Maximum Load Current
vs. Temperature
(I
F
=5mA)
Blocking Voltage (V
P
)
Blocking Voltage vs. Temperature
950
900
850
800
750
700
Leakage Current ( A)
10
Typical Leakage Current
vs. Temperature
1
V
L
=600V
V
L
=300V
0.1
0.01
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.001
-40
-20
0
20
40
60
Temperature (ºC)
80
100
20
Maximum Surge Current vs. Time
T
J
=50ºC Before Surge
Load Current (A
P
)
15
10
5
0
100 s
1ms
10ms 100ms
1s
Time (ms)
10s
100s
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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Manufacturing Information
Moisture Sensitivity
CPC1964BX6
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1964BX6
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC1964BX6
Maximum Temperature x Time
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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