All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLB150 / PLB150S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLB150 / PLB150S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
e
3
R05
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3
I
NTEGRATED
C
IRCUITS
D
IVISION
Mechanical Dimensions
PLB150
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
7.239 TYP
(0.285 TYP)
PLB150
PCB Hole Pattern
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
Dimensions
mm
(inches)
PLB150S
8.382 ± 0.381
(0.330 ± 0.015)
0.635 ± 0.127
(0.025 ± 0.005)
2.54 ± 0.127
(0.100 ± 0.005)
PCB Land Pattern
2.54
(0.10)
9.524 ± 0.508
(0.375 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
1.65
(0.0649)
8.90
(0.3503)
Pin 1
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
0.65
(0.0255)
Dimensions
mm
(inches)
4
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R05
I
NTEGRATED
C
IRCUITS
D
IVISION
PLB150
PLB150STR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B
0
= 10.10
(0.398)
K
0
= 4.90
(0.19)
K
1
= 3.80
(0.15)
Embossed
Carrier
P = 12.00
(0.472)
A
0
= 10.10
(0.398)
Dimensions
mm
(inches)
User Direction of Feed
Embossment
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
随着阅读器与标签价格的降低和全球市场的扩大，射频标识 RFID(以下简称RFID)的应用与日俱增。标签既可由阅读器供电(无源标签)，也可以由标签的板上电源供电(半有源标签和有源标签)。由于亚微型无源 CMOS 标签的成本降低，库存和其他应用迅速增加。一些评估表明，随着无源标签的价格持续下降，几乎每一个售出产品的内部都将有一个 RFID 标签。由于无源 RFID 标签的重要性及其独特的工程实现...[详细]
xi 在国际测试大会上，英特尔公司副总裁兼副总经理Gadi Singer在题为“应对频谱纳米技术和千兆复杂性的挑战”的演讲中指出，从1940年以来，每立方英尺MIPS或每磅MIPS数每10年就增加100倍。虽然在平滑的曲线上一直是以指数规律变化，但是，在那个时期仍然有许多不连续性和变形点。 “目前，四个不同的趋势正延伸在所有方向中的曲线，”Singer说道。首先，IC复杂性和多样性...[详细]
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