NXP Semiconductors
Data Sheet: Technical Data
KE1xZP100M72SF0
Rev. 3, 07/2018
Kinetis KE1xZ with up to 256 KB
Flash
Up to 72 MHz ARM® Cortex®-M0+ Based Microcontroller
Kinetis KE1xZ256 MCUs are the leading parts for the KE1xZ
familiy based on ARM
®
Cortex
®
-M0+ core. Providing up to 256
KB flash, up to 32 KB RAM, and the complete set of analog/
digital features, KE1xZ extends Kinetis E family to higher
performance and broader scalability. Robust TSI provides high-
level stability and accuracy to customer's HMI system. 1 Msps
ADC and FlexTimer help build a perfect solution for BLDC motor
control systems.
MKE1xZ256VLL7
MKE1xZ256VLH7
MKE1xZ128VLL7
MKE1xZ128VLH7
100 LQFP (LL)
14x14x1.4 mm P 0.5
64 LQFP (LH)
10x10x1.4 mm P 0.5
Core Processor and System
• ARM
®
Cortex
®
-M0+ core, supports up to 72 MHz
frequency
• ARM Core based on the ARMv6 Architecture and
Thumb
®
-2 ISA
• Configurable Nested Vectored Interrupt Controller
(NVIC)
• Memory-Mapped Divide and Square Root module
(MMDVSQ)
• 8-channel DMA controller extended up to 63 channels
with DMAMUX
Reliability, safety and security
• Flash Access Control (FAC)
• Cyclic Redundancy Check (CRC) generator module
• 128-bit unique identification (ID) number
• Internal watchdog (WDOG) with independent clock
source
• External watchdog monitor (EWM) module
• ADC self calibration feature
• On-chip clock loss monitoring
Human-machine interface (HMI)
• Supports up to 32 interrupt request (IRQ) sources
• Up to 89 GPIO pins with interrupt functionality
• Touch sensing input (TSI) module
Memory and memory interfaces
• Up to 256 KB program flash
• Up to 32 KB SRAM
• 32 KB FlexNVM for data flash and with EEPROM
emulation
• 2 KB FlexRAM for EEPROM emulation
• 128 Bytes flash cache
• Boot ROM with built in bootloader
Mixed-signal analog
• 2× 12-bit analog-to-digital converter (ADC) with up
to 16 channel analog inputs per module, up to 1
Msps
• 2× high-speed analog comparators (CMP) with
internal 8-bit digital to analog converter (DAC); the
8-bit DAC of CMP0 supports an output option to pad
with a buffer
Timing and control
• 3× Flex Timers (FTM) for PWM generation, offering
up to 8 standard channels
• 1× 16-bit Low-Power Timer (LPTMR) with flexible
wake up control
• 1× Programmable Delay Block (PDB) with flexible
trigger system
• 1× 32-bit Low-power Periodic Interrupt Timer (LPIT)
with 4 channels
• Real timer clock (RTC)
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Clock interfaces
Connectivity and communications interfaces
• 4 - 40 MHz fast external oscillator (OSC)
• 3× low-power universal asynchronous receiver/
• 32 kHz slow external oscillator (OSC32)
transmitter (LPUART) modules with DMA support
• 48 - 60 MHz high-accuracy (up to ±1%) fast internal
and low power availability
reference clock (FIRC) for normal Run
• 2× low-power serial peripheral interface (LPSPI)
• 8 MHz / 2 MHz high-accuracy (up to ±3%) slow internal
modules with DMA support and low power
reference clock (SIRC) for low-speed Run
availability
• 128 kHz low power oscillator (LPO)
• 2× low-power inter-integrated circuit (LPI2C)
• Low-power FLL (LPFLL)
modules with DMA support and low power
• Up to 60 MHz DC external square wave input clock
availability
• System clock generator (SCG)
• FlexIO module for flexible and high performance
• Real time counter (RTC)
serial interfaces
Power management
Debug functionality
• Low-power ARM Cortex-M0+ core with excellent
• Serial Wire Debug (SWD) debug interface
energy efficiency
• Debug Watchpoint and Trace (DWT)
• Power management controller (PMC) with multiple
• Micro Trace Buffer (MTB)
power modes: Run, Wait, Stop, VLPR, VLPW and
Operating Characteristics
VLPS
• Voltage range: 2.7 to 5.5 V
• Supports clock gating for unused modules, and specific
• Ambient temperature range: –40 to 105 °C
peripherals remain working in low power modes
• POR, LVD/LVR
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Chip Errata
Package
drawing
Description
The Solution Advisor is a web-based tool that features interactive
application wizards and a dynamic product selector.
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Resource
Solution Advisor
KE1xZ256PB
1
KE1xZP100M72SF0RM
1
This document:
KE1xZP100M72SF0
The chip mask set Errata provides additional or corrective information for Kinetis_E_1N36S
1
a particular device mask set.
Package dimensions are provided in package drawings.
100-LQFP:
98ASS23308W
64-LQFP:
98ASS23234W
1. To find the associated resource, go to
http://www.nxp.com
and perform a search using this term.
2
NXP Semiconductors
Kinetis KE1xZ with up to 256 KB Flash, Rev. 3, 07/2018
Kinetis KE1xZ Sub-Family
ARM
®
Cortex
®
-M0+
Core
System
eDMA
DMAMUX
TRGMUX
LPFLL
WDOG
EWM
OSC32
LPO
Memories and Memory Interfaces
Program
flash
FlexMemory
RAM
Clocks
OSC
FIRC
Debug
interfaces
Interrupt
controller
MMDVSQ
Boot ROM
SIRC
and Integrity
CRC
Security
Analog
12-bit ADC
x2
Timers
FlexTimer
8ch x1
4ch x2
PDB x1
Communication Interfaces
LPI
C
x2
LPUART
x3
LPSPI
x2
2
Human-Machine
Interface (HMI)
GPIO
upto 58
High drive
I/O (8 pins)
Digital filters
(port E)
TSI, 36ch
(optional)
FAC
CMP x2
8-bit DAC x1
(within CMP0,
output capable)
LPIT, 4ch
LPTMR
SRTC
PWT
PMC
FlexIO
Figure 1. Functional block diagram
Kinetis KE1xZ with up to 256 KB Flash, Rev. 3, 07/2018
3
NXP Semiconductors
Table of Contents
1 Ordering information............................................................... 5
2 Overview................................................................................. 5
2.1 System features...............................................................6
2.1.1
2.1.2
2.1.3
ARM Cortex-M0+ core...................................... 6
NVIC..................................................................7
AWIC.................................................................7
5.1.3
5.1.4
5.1.5
Typical-value conditions....................................41
Relationship between ratings and operating
requirements..................................................... 41
Guidelines for ratings and operating
requirements..................................................... 42
5.2 Ratings............................................................................ 42
5.2.1
Thermal handling ratings...................................42
5.2.2
Moisture handling ratings.................................. 43
5.2.3
ESD handling ratings........................................ 43
5.2.4
Voltage and current operating ratings............... 43
5.3 General............................................................................ 44
5.3.1
Nonswitching electrical specifications............... 44
5.3.2
Switching specifications.................................... 54
5.3.3
Thermal specifications...................................... 57
5.4 Peripheral operating requirements and behaviors...........60
5.4.1
System modules................................................60
5.4.2
Clock interface modules....................................60
5.4.3
Memories and memory interfaces.....................67
5.4.4
Security and integrity modules.......................... 69
5.4.5
Analog............................................................... 70
5.4.6
Communication interfaces.................................76
5.4.7
Human-machine interfaces (HMI)..................... 80
5.4.8
Debug modules................................................. 80
6 Design considerations.............................................................81
6.1 Hardware design considerations..................................... 82
6.1.1
Printed circuit board recommendations.............82
6.1.2
Power delivery system...................................... 82
6.1.3
6.1.4
6.1.5
Analog design................................................... 82
Digital design.....................................................83
Crystal oscillator................................................86
2.1.4
Memory............................................................. 8
2.1.5
Reset and boot..................................................8
2.1.6
Clock options.....................................................10
2.1.7
Security............................................................. 11
2.1.8
Power management.......................................... 12
2.1.9
Debug controller................................................13
2.2 Peripheral features.......................................................... 13
2.2.1
eDMA and DMAMUX........................................ 13
2.2.2
FTM...................................................................14
2.2.3
ADC...................................................................14
2.2.4
CMP.................................................................. 15
2.2.5
RTC...................................................................16
2.2.6
LPIT...................................................................16
2.2.7
PDB...................................................................16
2.2.8
LPTMR.............................................................. 17
2.2.9
CRC.................................................................. 17
2.2.10 LPUART............................................................ 18
2.2.11
2.2.12
2.2.13
2.2.14
LPSPI................................................................ 18
LPI2C................................................................ 19
FlexIO................................................................20
Port control and GPIO.......................................20
3 Memory map........................................................................... 22
4 Pinouts.................................................................................... 24
4.1 KE1xZ Signal Multiplexing and Pin Assignments............ 24
4.2 Port control and interrupt summary................................. 27
4.3 Module Signal Description Tables................................... 28
4.4 Pinout diagram................................................................ 33
4.5 Package dimensions....................................................... 35
5 Electrical characteristics..........................................................40
5.1 Terminology and guidelines.............................................40
5.1.1
5.1.2
Definitions......................................................... 40
Examples.......................................................... 40
6.2 Software considerations.................................................. 87
7 Part identification.....................................................................88
7.1 Description.......................................................................88
7.2 Format............................................................................. 88
7.3 Fields............................................................................... 88
7.4 Example...........................................................................89
8 Revision history.......................................................................89
4
NXP Semiconductors
Kinetis KE1xZ with up to 256 KB Flash, Rev. 3, 07/2018
Ordering information
1 Ordering information
The following chips are available for ordering.
Table 1. Ordering information
Product
Part number
Marking
(Line1/Line2)
MKE15Z256VLL
7
MKE15Z256VL
H7
MKE15Z128VLL
7
MKE15Z128VL
H7
MKE14Z256VLL
7
MKE14Z256VL
H7
MKE14Z128VLL
7
MKE14Z128VL
H7
MKE15Z256 /
VLL7
MKE15Z256 /
VLH7
MKE15Z128 /
VLL7
MKE15Z128 /
VLH7
MKE14Z256 /
VLL7
MKE14Z256 /
VLH7
MKE14Z128 /
VLL7
MKE14Z128 /
VLH7
Flash
(KB)
256
256
128
128
256
256
128
128
Memory
SRAM
(KB)
32
32
16
16
32
32
16
16
FlexNVM/
FlexRAM
(KB)
32/2
32/2
32/2
32/2
32/2
32/2
32/2
32/2
Package
Pin
count
100
64
100
64
100
64
100
64
Packa
ge
LQFP
LQFP
LQFP
LQFP
LQFP
LQFP
LQFP
LQFP
IO and ADC channel
GPIOs GPIOs ADC
(INT/H chann
D)
1
els
89
58
89
58
89
58
89
58
89/8
58/8
89/8
58/8
89/8
58/8
89/8
58/8
16
16
16
16
16
16
16
16
HMI
TSI
Yes
Yes
Yes
Yes
No
No
No
No
1. INT: interrupt pin numbers; HD: high drive pin numbers
2 Overview
The following figure shows the system diagram of this device.
Kinetis KE1xZ with up to 256 KB Flash, Rev. 3, 07/2018
5
NXP Semiconductors
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