TB6633FNG/AFNG
TOSHIBA Bi-CD Integrated Circuit
Silicon Monolithic
TB6633FNG/AFNG
3-Phase Full-Wave PWM Driver for Sensorless DC Motors
The TB6633FNG/AFNG is a three-phase full-wave PWM driver
for sensorless brushless DC (BLDC) motors. It controls motor
rotation speed by changing the PWM duty cycle, based on the
voltage of an analo control input.
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Sensorless drive in three-phase full-wave mode
PWM chopper control
Controls the PWM duty cycle based on an analog input
(7-bit ADC)
Output current: I
OUT
= 0.6 A typ. (1 A max)
Forward and reverse rotation
Power supply: VM = 4.5 V to 22 V (25 V max)
Lead angle control (0°, 15° and 30°)
Overlapping commutation (120°, 135° and 150°)
Selectable duty cycle modulation period upon state transitions of phase signals
Adjustable startup settings
Selectable PWM frequency
Restart feature
Rotation speed detecting signal (FG_OUT, TB6633FNG:3ppr, TB6633AFNG:1ppr)
Forced commutation frequency control (f
osc
/(6
×
2
17
), f
osc
/(6
×
2
18
) and f
osc
/(6
×
2
19
))
Overcurrent protection (ISD)
Thermal shutdown (TSD)
Current limiter
Short brake control
Undervoltage lockout (LVD)
Note2: The following conditions apply to solderability:
About solderability, following conditions were confirmed
(1) Use of Sn-37Pb solder Bath
•
solder bath temperature: 230°C
•
dipping time: 5 seconds
•
the number of times: once
•
use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
•
solder bath temperature: 245°C
•
dipping time: 5 seconds
•
the number of times: once
•
use of R-type flux
Do
Note1: 8 pin (IR) of this product is sensitive to electrostatic discharge. When handling this product, protect the
environment to avoid electrostatic discharge.
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Features
Weight: 0.136 g (typ.)
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2011-9-5
TB6633FNG/AFNG
Absolute Maximum Ratings
(Note) (Ta = 25°C)
Characteristics
Power supply voltage
Input voltage
Symbol
VM
V
IN1
(Note 1)
V
IN2
(Note 2)
Output voltage
V
OUT1
(Note 3)
V
OUT2
(Note 4)
I
OUT1
(Note 5)
Output current
I
OUT2
(Note 6)
I
OUT3
(Note 7)
Power dissipation
Operating temperature
Storage temperature
P
D
Rating
25
−0.3
to 6.0
−0.3
to 25
25
6.0
1 (Note 8)
5
5
0.78 (Note 9)
−40
to 85
Unit
V
V
V
V
V
A
mA
mA
W
Note: The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
Please use the TB6633FNG/AFNG within the specified operating ranges.
Note 1: V
IN1
is applicable to the voltage at the following pins: FPWM, VSP, CW_CCW, LA, OC, SEL_LAP, FST,
BRAKE and SLOP
Note 2: V
IN2
is applicable to the voltage at the COM pin.
Note 3: V
OUT1
is applicable to the voltage at the following pins: U, V and W
Note 4: V
OUT2
is applicable to the voltage at the FG_OUT pin.
Note 5: I
OUT1
is applicable to the current at the following pins: U, V and W
Note 6: I
OUT2
is applicable to the current at the FG_OUT pin.
Note 7: I
OUT3
is applicable to the current at the VREF pin.
Note 8: Output current may be limited by the ambient temperature or the device implementation.
The maximum junction temperature should not exceed T
jmax
= 150°C
Note 9: Measured for the IC only. (Ta = 25°C)
Operating Ranges
Characteristics
Power supply voltage 1
Power supply voltage 2
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T
opr
T
stg
°C
−55
to 150
°C
Symbol
VM
opr1
VM
opr2
Min
5.5
4.5
Typ.
12
5
Max
22
5.5
Unit
V
V
2
2011-9-5
TB6633FNG/AFNG
Application Circuit Example
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
0.1
μF
VREF
Reference voltage circuit
VM
BRAKE
Speed control input
(analog voltage)
VREF
VSP
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pr
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MCU
Short brake
control
Startup
circuit
7-bit AD
converter
U
V
W
Pre-driver
VST
DC
excitation
TIP
VREF/2
VREF
FST
IR
Forced commutation
frequency
TSD
ISD
VREF/2
VREF
LA
Lead angle
control
Control
logic
Current limit
circuit
OC
VREF/2
VREF
SLOP
Modulation control
Position detection
VREF
CW_CCW
Forward/
reverse
rotation
control
COM
VREF
SEL_LAP
Overlap
commutation
control
FG_OUT
0.1
μF
MOTOR
MCU
VREF
FPWM
PWM control
Do
Clock
generation
OSC_C
68 pF
Re-start OFF time control
OSC_R
20 kΩ
TRE
PGND
SGND
10
μF
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2011-9-5
TB6633FNG/AFNG
Package Dimensions
Pin No.
1
2
3
4
5
6
7
8
Symbol
VM
FPWM
CW_CCW
SEL_LAP
U
V
W
IR
PGND
OC
COM
SGND
FG_OUT
BRAKE
OSC_C
OSC_R
VSP
VST
TIP
TRE
FST
LA
SLOP
VREF
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9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Weight: 0.136 g (typ.)
Do
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2011-9-5
TB6633FNG/AFNG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
(1)
Notes on handling of ICs
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
(2)
(3)
(4)
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4. Application Circuits
5
2011-9-5
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