IRF614, SiHF614
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
()
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
8.2
1.8
4.5
Single
D
FEATURES
250
2.0
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Compliant to RoHS Directive 2002/95/EC
Available
RoHS*
COMPLIANT
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The TO-220AB package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the TO-220AB contribute to its
wide acceptance throughout the industry.
TO-220AB
G
G
D
S
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
TO-220AB
IRF614PbF
SiHF614-E3
IRF614
SiHF614
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
a
Linear Derating Factor
Single Pulse Avalanche Energy
b
Repetitive Avalanche Current
a
Repetitive Avalanche
Peak Diode Recovery
Energy
a
T
C
= 25 °C
dV/dt
c
for 10 s
6-32 or M3 screw
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Mounting Torque
E
AS
I
AR
E
AR
P
D
dV/dt
T
J
, T
stg
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
LIMIT
250
± 20
2.7
1.7
8.0
0.29
61
2.7
3.6
36
4.8
- 55 to + 150
300
d
10
1.1
W/°C
mJ
A
mJ
W
V/ns
°C
lbf · in
N·m
A
UNIT
V
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V, starting T
J
= 25 °C, L = 13 mH, R
g
= 25
,
I
AS
= 2.7 A (see fig. 12).
c. I
SD
2.7 A, dI/dt
65 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91025
S11-0510-Rev. B, 21-Mar-11
www.vishay.com
1
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRF614, SiHF614
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient
Case-to-Sink, Flat, Greased Surface
Maximum Junction-to-Case (Drain)
SYMBOL
R
thJA
R
thCS
R
thJC
TYP.
-
0.50
-
MAX.
62
-
3.5
°C/W
UNIT
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DS
V
DS
/T
J
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
V
GS
= 0 V, I
D
= 250 μA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 μA
V
GS
= ± 20 V
V
DS
= 250 V, V
GS
= 0 V
V
DS
= 200 V, V
GS
= 0 V, T
J
= 125 °C
V
GS
= 10 V
I
D
= 1.6 A
b
V
DS
= 50 V, I
D
= 1.6 A
b
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
I
D
= 2.7 A, V
DS
= 200 V
see fig. 6 and 13
b
250
-
2.0
-
-
-
-
0.90
-
0.39
-
-
-
-
-
-
-
-
4.0
± 100
25
250
2.0
-
V
V/°C
V
nA
μA
S
-
-
-
-
140
42
9.6
-
-
-
7.0
7.6
16
7.0
4.5
7.5
-
-
-
8.2
1.8
4.5
-
-
-
-
-
nH
-
ns
nC
pF
V
GS
= 10 V
-
-
-
V
DD
= 125 V, I
D
= 2.7 A ,
R
g
= 24
,
R
D
= 45, see fig. 10
b
Between lead,
6 mm (0.25") from
package and center of
die contact
-
-
-
D
-
-
G
S
-
-
-
-
-
190
0.64
2.7
A
8.0
2.0
390
1.3
V
ns
μC
G
S
T
J
= 25 °C, I
S
= 2.7 A, V
GS
= 0 V
b
T
J
= 25 °C, I
F
= 2.7 A, dI/dt = 100 A/μs
b
-
-
-
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width
300 μs; duty cycle
2 %.
www.vishay.com
2
Document Number: 91025
S11-0510-Rev. B, 21-Mar-11
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRF614, SiHF614
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
I
D
, Drain Current (A)
I
D
, Drain Current (A)
10
0
V
GS
15 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom 4.5 V
Top
10
0
150
°
C
25
°
C
10
-1
10
-1
4.5 V
20 µs Pulse Width
T
C
=
25 °C
10
0
10
1
10
-2
10
-2
10
-1
91025_01
20 µs Pulse Width
V
DS
=
50 V
4
5
6
7
8
9
10
V
DS
, Drain-to-Source Voltage (V)
91025_03
V
GS,
Gate-to-Source Voltage (V)
Fig. 3 - Typical Transfer Characteristics
Fig. 1 - Typical Output Characteristics, T
C
= 25 °C
R
DS(on)
, Drain-to-Source On Resistance
(Normalized)
I
D
, Drain Current (A)
10
0
V
GS
15 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom 4.5 V
Top
3.0
2.5
2.0
1.5
1.0
0.5
I
D
= 2.7 A
V
GS
= 10 V
4.5 V
10
-1
10
-2
10
-1
91025_02
20 µs Pulse Width
T
C
=
150 °C
10
0
10
1
V
DS,
Drain-to-Source Voltage (V)
91025_04
0.0
- 60 - 40 - 20 0
20 40 60 80 100 120 140 160
T
J,
Junction Temperature (°C)
Fig. 2 - Typical Output Characteristics, T
C
= 150 °C
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91025
S11-0510-Rev. B, 21-Mar-11
www.vishay.com
3
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRF614, SiHF614
Vishay Siliconix
300
250
200
C
iss
150
100
50
0
10
0
10
1
I
SD
, Reverse Drain Current (A)
Capacitance (pF)
V
GS
= 0 V, f = 1 MHz
C
iss
= C
gs
+ C
gd
, C
ds
Shorted
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
10
1
150
°
C
10
0
25
°
C
C
oss
C
rss
V
GS
= 0 V
0.5
91025_07
0.7
0.9
1.1
1.3
1.5
91025_05
V
DS,
Drain-to-Source Voltage (V)
V
SD
, Source-to-Drain Voltage (V)
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 7 - Typical Source-Drain Diode Forward Voltage
20
V
GS
, Gate-to-Source Voltage (V)
I
D
= 2.7 A
V
DS
= 200 V
V
DS
= 125 V
10
2
5
16
I
D
, Drain Current (A)
2
Operation in this area limited
by R
DS(on)
10
5
12
V
DS
= 50 V
100
µs
2
8
1
5
1
ms
T
C
= 25
°C
T
J
= 150
°C
Single Pulse
1
2
5
4
For test circuit
see figure 13
10
ms
2
0
0
91025_06
0.1
10
2
4
6
8
91025_08
2
5
10
2
2
5
10
3
Q
G
, Total Gate Charge (nC)
V
DS
, Drain-to-Source Voltage (V)
Fig. 8 - Maximum Safe Operating Area
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
www.vishay.com
4
Document Number: 91025
S11-0510-Rev. B, 21-Mar-11
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRF614, SiHF614
Vishay Siliconix
R
D
V
DS
3.0
2.5
V
GS
R
G
D.U.T.
+
-
V
DD
I
D
, Drain Current (A)
10 V
2.0
1.5
Pulse width
≤
1 µs
Duty factor
≤
0.1 %
Fig. 10a - Switching Time Test Circuit
1.0
0.5
0.0
25
50
75
100
125
150
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
V
DS
90 %
91025_09
T
C
, Case Temperature (°C)
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10b - Switching Time Waveforms
10
Thermal Response (Z
thJC
)
0
−
0.5
1
0.2
0.1
0.05
0.02
0.01
P
DM
Single Pulse
(Thermal Response)
t
1
t
2
Notes:
1. Duty Factor, D = t
1
/t
2
2. Peak T
j
= P
DM
x Z
thJC
+ T
C
10
-5
10
-4
10
-3
10
-2
0.1
1
10
0.1
10
-2
91025_11
t
1
, Rectangular Pulse Duration (s)
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Document Number: 91025
S11-0510-Rev. B, 21-Mar-11
www.vishay.com
5
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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