8-bit Microcontrollers - MCU Dual CAN High-Speed
| 参数名称 | 属性值 |
| 产品种类 Product Category | 8-bit Microcontrollers - MCU |
| 制造商 Manufacturer | Maxim(美信半导体) |
| 安装风格 Mounting Style | SMD/SMT |
| 封装 / 箱体 Package / Case | LQFP-64 |
| Core | 8051 |
| Data Bus Width | 8 bit |
| Maximum Clock Frequency | 40 MHz |
| Program Memory Size | 4 kB |
| Data RAM Size | 4 kB |
| ADC Resolution | No ADC |
| Number of I/Os | 32 I/O |
| 工作电源电压 Operating Supply Voltage | 3.85 V to 5.5 V |
| 最大工作温度 Maximum Operating Temperature | + 70 C |
| 接口类型 Interface Type | CAN, IrDA |
| 系列 Packaging | Tube |
| Data RAM Type | SRAM |
| 高度 Height | 1.4 mm |
| 长度 Length | 10 mm |
| 最小工作温度 Minimum Operating Temperature | 0 C |
| Moisture Sensitive | Yes |
| Number of Timers/Counters | 3 Timer |
| Processor Series | DS80C390 |
| Program Memory Type | SRAM |
| 工厂包装数量 Factory Pack Quantity | 1 |
| 电源电压-最大 Supply Voltage - Max | 5.5 V |
| 电源电压-最小 Supply Voltage - Min | 3.85 V |
| 宽度 Width | 10 mm |
| 单位重量 Unit Weight | 0.012088 oz |
| DS80C390-FCR | DS80C390-QNR | DS80C390-FNR | |
|---|---|---|---|
| 描述 | 8-bit Microcontrollers - MCU Dual CAN High-Speed | 8-bit Microcontrollers - MCU Dual CAN High-Speed | 8-bit Microcontrollers - MCU Dual CAN High-Speed |
| 是否无铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | - | LCC | QFP |
| 包装说明 | - | PLASTIC, LCC-68 | LQFP-64 |
| 针数 | - | 68 | 64 |
| Reach Compliance Code | - | not_compliant | not_compliant |
| ECCN代码 | - | EAR99 | EAR99 |
| Factory Lead Time | - | 1 week | 1 week |
| 具有ADC | - | NO | NO |
| 地址总线宽度 | - | 20 | 20 |
| 位大小 | - | 8 | 8 |
| CPU系列 | - | 8051 | 8051 |
| 最大时钟频率 | - | 40 MHz | 40 MHz |
| DAC 通道 | - | NO | NO |
| DMA 通道 | - | NO | NO |
| 外部数据总线宽度 | - | 8 | 8 |
| JESD-30 代码 | - | S-PQCC-J68 | S-PQFP-G64 |
| JESD-609代码 | - | e0 | e0 |
| 长度 | - | 24.23 mm | 10 mm |
| 湿度敏感等级 | - | 3 | 3 |
| I/O 线路数量 | - | 32 | 32 |
| 端子数量 | - | 68 | 64 |
| 最高工作温度 | - | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C |
| PWM 通道 | - | NO | NO |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | QCCJ | LFQFP |
| 封装等效代码 | - | LDCC68,1.0SQ | QFP64,.47SQ,20 |
| 封装形状 | - | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | - | 240 | 245 |
| 电源 | - | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified |
| RAM（字节） | - | 4096 | 4096 |
| ROM可编程性 | - | MROM | MROM |
| 座面最大高度 | - | 4.57 mm | 1.6 mm |
| 速度 | - | 100 MHz | 100 MHz |
| 最大压摆率 | - | 150 mA | 150 mA |
| 最大供电电压 | - | 5.5 V | 5.5 V |
| 最小供电电压 | - | 4.35 V | 4.35 V |
| 标称供电电压 | - | 5 V | 5 V |
| 表面贴装 | - | YES | YES |
| 技术 | - | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | J BEND | GULL WING |
| 端子节距 | - | 1.27 mm | 0.5 mm |
| 端子位置 | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | 20 | NOT SPECIFIED |
| 宽度 | - | 24.23 mm | 10 mm |
| uPs/uCs/外围集成电路类型 | - | MICROCONTROLLER | MICROCONTROLLER |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
