EEPROM 2K (256 X 8) SPI, 1.8V
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | SOF |
| 包装说明 | HVSON, SOLCC8,.11,20 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 最大时钟频率 (fCLK) | 5 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 内存密度 | 2048 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.6 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 5e-7 A |
| 最大压摆率 | 0.01 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 2 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE/SOFTWARE |
| AT25020B-MAHL-T | AT25010B-SSHL-B | AT25020B-SSHL-B | AT25020B-SSHL-T | AT25040B-XHL-B | AT25040B-WWU11L | AT25040B-MAHL-T | |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM 2K (256 X 8) SPI, 1.8V | EEPROM 1K (128 X 8) SPI, 1.8V | EEPROM 2K (256 X 8) SPI, 1.8V | EEPROM 2K (256 X 8) SPI, 1.8V | EEPROM 4K (512 X 8) SPI, 1.8V | EEPROM SEEPROM, 4K, SPI - 20MHz, Ind Tmp , 11mil Unsawn Wafer | EEPROM 4K (512 X 8) SPI, 1.8V |
| 零件包装代码 | SOF | SOIC | SOIC | SOIC | TSSOP | DIE | SOF |
| 包装说明 | HVSON, SOLCC8,.11,20 | SOP, SOP8,.25 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 | 0.150 INCH, GREEN, PLASTIC, MS-012AA, SOIC-8 | TSSOP, TSSOP8,.25 | DIE, | HVSON, SOLCC8,.11,20 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | unknown | unknown | compliant | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | X-XUUC-N | R-PDSO-N8 |
| 内存密度 | 2048 bit | 1024 bit | 2048 bit | 2048 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 128 words | 256 words | 256 words | 512 words | 512 words | 512 words |
| 字数代码 | 256 | 128 | 256 | 256 | 512 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256X8 | 128X8 | 256X8 | 256X8 | 512X8 | 512X8 | 512X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | HVSON | SOP | SOP | SOP | TSSOP | DIE | HVSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | UNCASED CHIP | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 |
| 厂商名称 | Atmel (Microchip) | - | - | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | - | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - | e4 |
| 长度 | 3 mm | 4.925 mm | 4.925 mm | 4.925 mm | 4.4 mm | - | 3 mm |
| 湿度敏感等级 | 3 | 3 | 1 | 1 | 3 | - | 3 |
| 封装等效代码 | SOLCC8,.11,20 | SOP8,.25 | SOP8,.25 | SOP8,.25 | TSSOP8,.25 | - | SOLCC8,.11,20 |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 250 | - | 260 |
| 电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | - | 2/5 V |
| 座面最大高度 | 0.6 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.2 mm | - | 0.6 mm |
| 最大待机电流 | 5e-7 A | 5e-7 A | 5e-7 A | 5e-7 A | 5e-7 A | - | 5e-7 A |
| 最大压摆率 | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | - | 0.01 mA |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD |
| 端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | - | 0.5 mm |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | - | 40 |
| 宽度 | 2 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3 mm | - | 2 mm |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE |
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