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1N5383Be3-TR13

产品描述Zener Diodes Zener Voltage Regulator Diode
产品类别半导体    分立半导体   
文件大小384KB,共6页
制造商Microsemi
官网地址https://www.microsemi.com
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1N5383Be3-TR13概述

Zener Diodes Zener Voltage Regulator Diode

1N5383Be3-TR13规格参数

参数名称属性值
产品种类
Product Category
Zener Diodes
制造商
Manufacturer
Microsemi
RoHSDetails
安装风格
Mounting Style
Through Hole
封装 / 箱体
Package / Case
T-18-2
系列
Packaging
Cut Tape
系列
Packaging
Reel
工厂包装数量
Factory Pack Quantity
1250
单位重量
Unit Weight
0.002469 oz

文档预览

下载PDF文档
1N5333B thru 1N5388B
Available
Silicon 5 Watt Zener Diodes
DESCRIPTION
The 1N5333B through 1N5388B JEDEC registered series of axial-leaded 5.0 watt Zeners
provides a selection from 3.3 to 200 volts with different tolerances as identified by specific
suffix letter on the part number. These plastic encapsulated Zeners have a moisture
classification of “Level 1” with no dry pack required. They may be operated at high maximum
dc currents with adequate heat sinking due to their comparatively low thermal resistance
design. Microsemi also offers numerous other Zener products to meet higher and lower
power applications.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
JEDEC registered 1N5333 thru 1N5388 series.
Zener voltage available 3.3 V to 200 V.
Plus/minus 10%, 5% and 2% voltage tolerances are available.
(See
part nomenclature
block.)
RoHS compliant versions available.
T-18 Package
Also available in:
G-bend Package
(surface mount)
SMBJ5333 – SMBJ5388
APPLICATIONS / BENEFITS
Regulates voltage over broad operating current and temperature ranges.
Wide selection from 3.3 to 200 V.
Flexible axial-lead mounting terminals.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Withstands high surge stresses.
Minimal changes of voltage versus current.
High specified maximum current (I
ZM
) with adequate heat sinking.
Moisture classification is “Level 1” per IPC/JEDEC J-STD-020B with no dry pack required.
Gull wing Package
(surface mount)
SMBG5333 – SMBG5388
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
(1)
Thermal Resistance Junction-to-Lead
(2)
Thermal Resistance Junction-to-Ambient
o (3)
Off-State Power Dissipation @ 25 C
Forward Voltage @ 1.0 A
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +150
25
85
5.0
1.2
260
Unit
C
C/W
o
C/W
W
V
o
C
o
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. At 3/8 (10 mm) lead length from body.
2. When mounted on FR4 PC board (1oz Cu) with 4 mm
2
copper pads and track width 1 mm, length 25
mm.
o
º
3. 5 watts at T
L
< 25 C 3/8 inch (10 mm) from body, or 1.47 watts at T
A
= 25 C when mounted on FR4 PC
described for thermal resistance (also see
Figure 1).
T4-LDS-0246, Rev. 1 (120180)
©2012 Microsemi Corporation
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