BCX17LT1G, PNP
BCX18LT1G, PNP
BCX19LT1G, NPN
SBCX19LT1G, NPN
General Purpose
Transistors
Voltage and Current are Negative for
PNP Transistors
Features
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AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
SOT−23
(TO−236)
CASE 318−08
STYLE 6
PNP
COLLECTOR
3
1
BASE
2
EMITTER
1
BASE
2
EMITTER
NPN
COLLECTOR
3
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Collector
−
Emitter Voltage
BCX17, BCX19
BCX18
Collector
−
Base Voltage
BCX17, BCX19
BCX18
Emitter
−
Base Voltage
Collector Current
−
Continuous
Symbol
V
CEO
Value
45
25
Vdc
50
30
5.0
500
Vdc
mAdc
Unit
Vdc
V
CBO
MARKING DIAGRAM
V
EBO
I
C
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR− 5 Board
(Note 1), T
A
= 25C
Derate above 25C
Thermal Resistance,
Junction−to−Ambient
Total Device Dissipation Alumina
Substrate, (Note 2) T
A
= 25C
Derate above 25C
Thermal Resistance,
Junction−to−Ambient
Junction and Storage Temperature
Symbol
P
D
Max
225
1.8
R
qJA
P
D
556
300
2.4
417
−55
to +150
Unit
mW
mW/C
C/W
mW
mW/C
C/W
C
XX
M
G
XX M
G
G
1
= T1, T2 or U1
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
R
qJA
T
J
, T
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0
0.75
0.062 in.
2. Alumina = 0.4
0.3
0.024 in 99.5% alumina.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
November, 2011
−
Rev. 7
1
Publication Order Number:
BCX17LT1/D
BCX17LT1G, PNP BCX18LT1G, PNP BCX19LT1G, NPN SBCX19LT1G, NPN
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
(I
C
= 10 mAdc, I
B
= 0)
BCX17, BCX19, SBCX19
BCX18
Collector−Emitter Breakdown Voltage
(I
C
= 10
mAdc,
I
C
= 0)
BCX17, BCX19, SBCX19
BCX18
Collector Cutoff Current
(V
CB
= 20 Vdc, I
E
= 0)
(V
CB
= 20 Vdc, I
E
= 0, T
A
= 150C)
Emitter Cutoff Current
(V
EB
= 5.0 Vdc, I
C
= 0)
ON CHARACTERISTICS
DC Current Gain
(I
C
= 100 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 300 mAdc, V
CE
= 1.0 Vdc)
(I
C
= 500 mAdc, V
CE
= 1.0 Vdc)
Collector−Emitter Saturation Voltage
(I
C
= 500 mAdc, I
B
= 50 mAdc)
Base−Emitter On Voltage
(I
C
= 500 mAdc, V
CE
= 1.0 Vdc)
h
FE
−
100
70
40
−
−
−
−
−
−
−
600
−
−
Vdc
0.62
Vdc
1.2
V
(BR)CEO
45
25
V
(BR)CES
50
30
I
CBO
−
−
−
−
−
−
−
−
−
−
100
5.0
10
nAdc
mAdc
mAdc
−
−
−
−
Vdc
Vdc
Symbol
Min
Typ
Max
Unit
I
EBO
V
CE(sat)
V
BE(on)
ORDERING INFORMATION
Device
BCX17LT1G
BCX18LT1G
BCX19LT1G
SBCX19LT1G
Specific Marking
T1
T2
U1
U1
Package
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
Shipping
†
3,000 / Tape & Reel
3,000 / Tape & Reel
3,000 / Tape & Reel
3,000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
BCX17LT1G, PNP BCX18LT1G, PNP BCX19LT1G, NPN SBCX19LT1G, NPN
1000
V
CE
= 1 V
T
J
= 25C
hFE, DC CURRENT GAIN
100
10
0.1
1.0
10
100
I
C
, COLLECTOR CURRENT (mA)
1000
Figure 1. DC Current Gain
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
1.0
T
J
= 25C
0.8
V, VOLTAGE (VOLTS)
1.0
T
A
= 25C
0.8
V
BE(on)
@ V
CE
= 1 V
0.6
V
BE(sat)
@ I
C
/I
B
= 10
0.6
I
C
= 10 mA
100 mA
300 mA
500 mA
0.4
0.4
0.2
0
0.01
0.2
V
CE(sat)
@ I
C
/I
B
= 10
0
0.1
1
I
B
, BASE CURRENT (mA)
10
100
1
10
100
I
C
, COLLECTOR CURRENT (mA)
1000
Figure 2. Saturation Region
Figure 3. “On” Voltages
V, TEMPERATURE COEFFICIENTS (mV/
C)
+1
q
VC
for V
CE(sat)
0
C, CAPACITANCE (pF)
100
C
ib
10
-1
-2
q
VB
for V
BE
C
ob
1
10
100
I
C
, COLLECTOR CURRENT (mA)
1000
1
0.1
1
10
V
R
, REVERSE VOLTAGE (VOLTS)
100
Figure 4. Temperature Coefficients
Figure 5. Capacitances
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3
BCX17LT1G, PNP BCX18LT1G, PNP BCX19LT1G, NPN SBCX19LT1G, NPN
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
D
SEE VIEW C
3
E
1
2
HE
c
e
b
q
0.25
DIM
A
A1
b
c
D
E
e
L
L1
H
E
q
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0
A
A1
L
L1
VIEW C
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm
inches
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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4
BCX17LT1/D