Operating Temperature Range ........................ -40NC to +85NC
Junction Temperature .................................................. +150NC
Storage Temperature Range ......................... -65NC to +150NC
Lead Temperature (soldering 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ............8NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................1NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V+ = +3.0V to +3.6V, T
A
= T
J
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V+ = +3.3V, T
A
= +25NC.) (Note 2)
PARAMETER
POWER SUPPLIES
Operating Power-Supply Range
ANALOG SWITCH
On-Resistance
On-Resistance AUX Switches
On-Resistance Match
Between Channels
On-Resistance Flatness
Off-Leakage Current
On-Leakage Current
SWITCH AC PERFORMANCE
Insertion Loss
Return Loss
Crosstalk
SWITCH AC CHARACTERISTICS
-3dB Bandwidth
Off-Capacitance
On-Capacitance
2
BW
C
OFF
C
ON
R
S
= R
L
= 50I, unbalanced
f = 1MHz, COM_ _
f = 1MHz, COM_ _
650
3.5
8
MHz
pF
pF
I
LOS
R
LOS
V
CT1
V
CT2
R
S
= R
L
= 50I, unbalanced, f = 1MHz,
(Note 3)
f = 100MHz
Any switch to any switch;
R
S
= R
L
= 50I,
unbalanced, Figure 1
f = 25MHz
f = 125MHz
0.6
-23
-50
-26
dB
dB
dB
R
ON
R
ONAUX
DR
ON
R
FLAT(ON)
I
LCOM_
_(OFF)
SYMBOL
V+
CONDITIONS
MIN
+3.0
TYP
MAX
+3.6
UNITS
V
V+ = 3V, I
COM_ _
= -40mA,
V
COM_ _
= 0V, 1.5V, 3V
T
A
= +25NC
T
MIN
to T
MAX
4
5.5
6.5
40
I
I
I
I
V+ = 3V, I
AUX0_
= -40mA, V
AUX0_
= 0V,
1.5V, 3V
V+ = 3V, I
COM_ _
= -40mA,
V
COM_ _
= 0V, 3V (Note 3)
V+ = 3V, I
COM_ _
= -40mA,
V
COM_ _
= 0V, 1.5V
V+ = 3.6V, V
COM_ _
= 0.3V, 3.3V;
V
NC_ _
or V
NO_ _
= 3.3V, 0.3V
V+ = 3.6V, V
COM_ _
= 0.3V, 3.3V; V
NC_ _
or V
NO_ _
= 3.3V, 0.3V or unconnected
-1
-1
T
A
= +25NC
T
MIN
to T
MAX
0.01
0.5
1.5
2
+1
+1
FA
FA
I
LCOM_
_(ON)
High-Bandwidth, ±15kV ESD Protection
LVDS Switch
ELECTRICAL CHARACTERISTICS (continued)
(V+ = +3.0V to +3.6V, T
A
= T
J
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V+ = +3.3V, T
A
= +25NC.) (Note 2)
PARAMETER
Turn-On Time
Turn-Off Time
Propagation Delay
Output Skew Between Ports
SWITCH LOGIC
Input-Voltage Low
Input-Voltage High
Input-Logic Hysteresis
Input Leakage Current
Quiescent Supply Current
ESD PROTECTION
ESD Protection
All Other Pins
COM_ _, NC_ _, NO_ _
HBM (spec MIL-STD-883, Method 3015)
HBM (spec MIL-STD-883, Method 3015)
Q15
Q2
kV
kV
V
IL
V
IH
V
HYST
I
SEL
I+
V+ = 3.0V
V+ = 3.6V
V+ = 3.3V
V+ = 3.6V, V
SEL
= 0V or V+
V+ = 3.6V, V
SEL
= 0V or V+
-5
280
2.0
100
+5
450
0.8
V
V
mV
FA
FA
SYMBOL
t
ON
t
OFF
t
PLH
, t
PHL
t
SK(o)
CONDITIONS
V
COM_ _
= 1V, R
L
= 100I, Figure 2
V
COM_ _
= 1V, R
L
= 100I, Figure 2
R
S
= R
L
= 50I, unbalanced, Figure 3
Skew between any two ports, Figure 4
0.1
0.01
MIN
TYP
MAX
50
50
UNITS
ns
ns
ns
ns
MAX14979E
Note 2:
Specifications at TA = -40NC are guaranteed by design.
Note 3:
Guaranteed by design.
MAX14979E
SINGLE-ENDED BANDWIDTH
NETWORK
ANALYZER
50Ω TRACE
COM0+
36
NC0+
31
50Ω TRACE
NETWORK
ANALYZER
SINGLE-ENDED CROSSTALK
NETWORK
ANALYZER
50Ω TRACE
COM1+
2
NC1+
26
R13
49.9Ω
NETWORK
ANALYZER
50Ω TRACE
COM1-
3
NC1-
25
R14
49.9Ω
SINGLE-ENDED OFF-ISOLATION
NETWORK
ANALYZER
50Ω TRACE
R15
49.9Ω
COM2+
7
NC2+
22
50Ω TRACE
NETWORK
ANALYZER
Figure 1. Single-Ended Bandwidth, Crosstalk, and Off-Isolation
据国外媒体报道，英特尔将处理器价格最高下调31%，但降价整体来说是有限的。 根据英特尔7月20日的新定价单来看，Core 2 Duo E8500(3.16GHz)价格降幅最高，从266美元下调至183美元，降幅达31%；Core 2 Duo E7200 (2.53GHz)次之，从133美元下调至113美元，降幅15%。 其他降价处理器还有四核Q6600(2.4GHz)，从224美...[详细]
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
