NXP Semiconductors
Data Sheet: Advance Information
Document Number: MC12XS6D2
Rev. 1.0, 8/2016
10 mOhm and 25 mOhm high-side
switches
The 12XS6 is the latest achievement in automotive lighting drivers. It is an
expanding family that controls and diagnoses incandescent lamps and light-
emitting diodes (LEDs) with enhanced precision. It combines flexibility through
daisy chainable SPI 5.0 MHz, extended digital and analog feedbacks, safety, and
robustness.
Output edge shaping helps to improve electromagnetic performance. To avoid
shutting off the device upon inrush current, while still being able to closely track
the load current, a dynamic overcurrent threshold profile is featured. Current of
each channel can be sensed with a programmable sensing ratio. Whenever
communication with the external microcontroller is lost, the device enters a Fail
operation mode, but remains operational, controllable, and protected.
This new generation of high-side switch products family 12XS6 facilitates ECU
design due to compatible MCU software and PCB foot prints for each device
variant.
This family is in an End of Life Vehicles directive compliant package.
Features
• Dual and triple high-side switches with high transient current capability
• 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including
PWM duty-cycles, output-ON and -OFF open load detections, thermal shut-
down and prewarning, and fault reporting
• Output current monitoring with programmable synchronization signal and
battery voltage feedback
• Limp Home mode
• External smart power switch control
• Operating voltage is 7.0 V to 18 V with sleep current < 5.0 µA, extended mode
from 6.0 V to 28 V
• -16 V reverse polarity and ground disconnect protections
• Compatible PCB foot print and SPI software driver among the family
V
BAT
VBAT
VCC
12XS6D2
HIGH-SIDE SWITCH
EK SUFFIX (PB-FREE)
98ASA00368D
32-PIN SOICW-EP
Applications
• Low-voltage automotive lighting
• Halogen lamps
• Incandescent bulbs
• Light-emitting diodes (LEDs)
• HID Xenon ballasts
V
BAT
5.0 V
Regulator
GND
VCC
SO
CSB
SCLK
SI
RSTB
CLK
A/D1
TRG1
PORT
PORT
PORT
PORT
PORT
A/D2
25XS6300
VBAT
VCC
SI
CP
CSB
OUT1
SCLK
SO
OUT2
RSTB
CLK
OUT3
CSNS
SYNCB
LIMP
IN1
IN2
IN3
IN4
GND OUT6
Main
MCU
IN
GND
VBAT OUT
Smart Power
CSNS GND
Figure 1. Triple 25 mΩ simplified application diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© 2016 NXP B.V.
1
Orderable parts
This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are provided
on the web. To determine the orderable part numbers for this device, go to
http://www.nxp.com
and perform a part number search for the
following device numbers.
Table 1. Orderable part variations
Part number
MC10XS6200EK
MC10XS6225EK
MC10XS6325EK
MC25XS6300EK
(1)
Notes
Temperature
(T
A
)
Package
OUT1, R
DS(on)
–
OUT2, R
DS(on)
–
–
–
25 mΩ
OUT3, R
DS(on)
10 mΩ
10 mΩ
10 mΩ
25 mΩ
OUT4, R
DS(on)
10 mΩ
–
10 mΩ
–
OUT6
Yes
Yes
Yes
Yes
-40 to 125 °C
SOIC 32-pin
exposed pad
25 mΩ
25 mΩ
25 mΩ
Notes
1. To order parts in Tape and Reel, add the R2 suffix to the part number.
12XS6D2
2
NXP Semiconductors
Table of Contents
1
2
3
Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Relationship between ratings and operating requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.4 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.5 Supply currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
General IC functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5 Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.6 SPI interface and configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Functional block requirements and behaviors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.1 Self-protected high-side switches description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.2 Power supply functional block description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.3 Communication interface and device control functional block description and application information . . . . . . . . . . . . 54
Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.2 EMC and EMI considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.3 Robustness considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.4 PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.5 Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
8.1 Marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
8.2 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
4
5
6
7
8
9
12XS6D2
NXP Semiconductors
3
2
Internal block diagram
100 nF
V
CC
V
BAT
VCC
Power
Supply
Vs
UVF
CP
VBAT_PROTECTED
VBAT
Reverse
Battery
Protection
Charge
Pump
Power-on
Reset
Undervoltage
Detection
OV
Battery
Clamp
CPF
SO
SPI Control
CS
SCLK
SI
RST
Limp Home Control
SPIF
OTW1
OTW2
Thermal
Prewarning
Temperature
Shut-down
OTS1
SPI
Selectable
Slope Control
OC1
Selectable Overcurrent
Protection
Selectable OpenLoad
Detection
Selectable
Current Sensing
Fault
Management
OLON1
OLOFF1
LIMP
IN1
IN2
IN3
PWM Module
OUT1
OUT2 Channel
Logic
CLKF
VCC
Wake OR RST
OUT2
Reference
PWM Clock
OUT3 Channel
OUT3
CLK
Clock Failure
Detection
5k
A to D Convertion
CSNS
SYNC\
OUT6
Selectable
Delay
Selectable
Analog
Feedback
Control die
Temperature
Monitoring
VBAT_PROTECTED
CSNS
5k
VBAT_PROTECTED
Battery
Voltage
Monitoring
GND
Figure 2. Simplified internal block diagram
12XS6D2
4
NXP Semiconductors
Smart Power
Switch Drive
VCC
VCC
Power channels
Output Voltage
Monitoring
OUT1 Channel
OUT1
3
3.1
Pin connections
Pinout diagram
Transparent top view of package
CP
RSTB
CSB
SCLK
SI
VCC
SO
OUT6
GND
OUT2
OUT2
OUT4
OUT4
OUT4
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VBAT
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
CLK
LIMP
IN4
IN3
IN2
IN1
CSNS SYNCB
CSNS
GND
OUT1
OUT1
OUT3
OUT3
OUT3
NC
NC
Figure 3. 12XS6 pinout diagram
3.2
Pin definitions
Table 2. 12XS6 pin definitions
Pin number
1
2
Pin name
CP
RSTB
Pin function
Internal
supply
SPI
Formal name
Charge Pump
Reset
Definition
This pin is the connection for an external capacitor for charge pump use only.
This input pin is used to initialize the device configuration and fault registers, as well as
place the device in a low-current sleep mode. This pin has a passive internal pull-down.
This input pin is connected to a chip select output of a master microcontroller (MCU).
When this digital signal is high, SPI signals are ignored. Asserting this pin low starts the
SPI transaction. The transaction is indicated as completed when this signal returns to
a high level. This pin has a passive internal pull-up to V
CC
through a diode.
This input pin is connected to the MCU providing the required bit shift clock for SPI
communication. This pin has a passive internal pull-down.
This pin is the data input of the SPI communication interface. The data at the input is
sampled on the positive edge of the SCLK. This pin has a passive internal pull-down.
3
CSB
SPI
Chip Select
4
5
6
SCLK
SI
VCC
SPI
SPI
Power
Supply
SPI
Serial Clock
Serial input
MCU Power Supply This pin is a power supply pin is for internal logic, the SPI I/Os, and the OUT6 driver.
This output pin is connected to the SPI serial data input pin of the MCU, or to the SI pin
of the next device of a daisy chain of devices. The SPI changes on the negative edge
of SCLK. When CSB is high, this pin is high-impedance.
This output pin controls an external Smart Power Switch by logic level. This pin has a
passive internal pull-down.
7
SO
Serial Output
8
OUT6
Output
External Solid State
12XS6D2
NXP Semiconductors
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
