Flash Memory 64K x 8 90 ns 4.5V-5.5V
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | TSOP1 |
| 包装说明 | 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 90 ns |
| 其他特性 | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| 耐久性 | 10000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G32 |
| JESD-609代码 | e3 |
| 长度 | 18.4 mm |
| 内存密度 | 524288 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 部门数/规模 | 512 |
| 端子数量 | 32 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装等效代码 | TSSOP32,.8,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 页面大小 | 128 words |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 部门规模 | 128 |
| 最大待机电流 | 0.0003 A |
| 最大压摆率 | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 切换位 | YES |
| 类型 | NOR TYPE |
| 宽度 | 8 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| Base Number Matches | 1 |
| AT29C512-90TU | AT29C512-90JI | AT29C512-70TC | AT29C512-70JI | AT29C512-90JU | AT29C512-12TC | AT29C512-12PI | AT29C512-15JC | AT29C512-12JI | AT29C512-90PI | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Flash Memory 64K x 8 90 ns 4.5V-5.5V | Flash Memory 512K(64Kx8) 5V ONLY 90NS IND TEMP | Flash Memory 512K(64Kx8) 5V ONLY 70NS COM TEMP | Flash Memory 512K(64Kx8) 5V ONLY 70NS IND TEMP | Flash Memory 64K x 8 90 ns 4.5V-5.5V | Flash Memory 512k (64kx8) NRND | Flash Memory 512k (64kx8) NRND | Flash Memory 512k (64kx8) NRND | Flash Memory 512k (64kx8) NRND | Flash Memory 512k (64kx8) |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TSOP1 | QFJ | TSOP1 | QFJ | QFJ | TSOP1 | DIP | QFJ | QFJ | DIP |
| 包装说明 | 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 | PLASTIC, MS-016AE, LCC-32 | 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 | PLASTIC, MS-016AE, LCC-32 | PLASTIC, MS-016AE, LCC-32 | 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 | DIP, DIP32,.6 | QCCJ, LDCC32,.5X.6 | PLASTIC, MS-016AE, LCC-32 | DIP, DIP32,.6 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | compliant | compliant | unknown | unknown | compliant | unknown | compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 90 ns | 90 ns | 70 ns | 70 ns | 90 ns | 120 ns | 120 ns | 150 ns | 120 ns | 90 ns |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 耐久性 | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G32 | R-PQCC-J32 | R-PDSO-G32 | R-PQCC-J32 | R-PQCC-J32 | R-PDSO-G32 | R-PDIP-T32 | R-PQCC-J32 | R-PQCC-J32 | R-PDIP-T32 |
| JESD-609代码 | e3 | e0 | e0 | e0 | e3 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.4 mm | 13.97 mm | 18.4 mm | 13.97 mm | 13.97 mm | 18.4 mm | 42.037 mm | 13.97 mm | 13.97 mm | 42.037 mm |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | - | -40 °C | - | -40 °C | -40 °C |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | QCCJ | TSOP1 | QCCJ | QCCJ | TSOP1 | DIP | QCCJ | QCCJ | DIP |
| 封装等效代码 | TSSOP32,.8,20 | LDCC32,.5X.6 | TSSOP32,.8,20 | LDCC32,.5X.6 | LDCC32,.5X.6 | TSSOP32,.8,20 | DIP32,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | DIP32,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 页面大小 | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 225 | 240 | 225 | 245 | 240 | NOT SPECIFIED | 225 | 225 | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 3.556 mm | 1.2 mm | 3.556 mm | 3.556 mm | 1.2 mm | 4.826 mm | 3.556 mm | 3.556 mm | 4.826 mm |
| 部门规模 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| 最大待机电流 | 0.0003 A | 0.0003 A | 0.0001 A | 0.0003 A | 0.0003 A | 0.0001 A | 0.0003 A | 0.0001 A | 0.0003 A | 0.0003 A |
| 最大压摆率 | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA | 0.05 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | J BEND | GULL WING | J BEND | J BEND | GULL WING | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| 端子节距 | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | 1.27 mm | 0.5 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 40 | 30 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED |
| 切换位 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 8 mm | 11.43 mm | 8 mm | 11.43 mm | 11.43 mm | 8 mm | 15.24 mm | 11.43 mm | 11.43 mm | 15.24 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | - | Atmel (Microchip) |
| 其他特性 | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | - | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
| 湿度敏感等级 | 3 | 2 | 3 | 2 | 2 | 3 | - | 2 | 2 | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Base Number Matches | 1 | - | - | - | 1 | 1 | - | 1 | 1 | 1 |
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