6:1, Single-Ended Multiplexer
Data Sheet
83056
G
ENERAL
D
ESCRIPTION
T h e 8 3 0 5 6 i s a l ow s kew, 6 : 1 , S i n g l e - e n d e d M u l t i -
plexer from IDT. The 83056 has six selectable single-
ended clock inputs and one single-ended clock output. The
output has a V
DDO
pin which may be set at 3.3V, 2.5V, or
1.8V, making the device ideal for use in voltage transla-
tion applications. An output enable pin places the output in
a high impedance state which may be useful for testing or
debug purposes. The device operates up to 250MHz and is pack-
aged in a 16 TSSOP package.
F
EATURES
• 6:1 single-ended multiplexer
• Q nominal output impedance: 7Ω (V
DDO
= 3.3V)
• Maximum output frequency: 250MHz
• Propagation delay: 3ns (maximum), V
DD
= V
DDO
= 3.3V
• Input skew: 225ps (maximum), V
DD
= V
DDO
= 3.3V
• Part-to-part skew: 475ps (maximum), V
DD
= V
DDO
= 3.3V
• Additive phase jitter, RMS: 0.19ps (typical), 3.3V/3.3V
• Operating supply modes:
V
DD
/V
DDO
3.3V/3.3V
3.3V/2.5V
3.3V/1.8V
2.5V/2.5V
2.5V/1.8V
• -40°C to 85°C ambient operating temperature
• Available in lead-free (RoHS 6) package
B
LOCK
D
IAGRAM
CLK0
CLK1
CLK2
Q
CLK3
CLK4
CLK5
SEL2
SEL1
SEL0
OE
P
IN
A
SSIGNMENT
83056
16-Lead TSSOP
4.4mm x 5.0mm x 0.92mm package body
G Package
Top View
©2016 Integrated Device Technology, Inc
1
Revision B March 10, 2016
83056 Data Sheet
T
ABLE
1. P
IN
D
ESCRIPTIONS
Number
1
2, 4
6, 8,
9, 11,
13, 15
3
5
7, 10,
14
12
16
Name
Q
nc
CLK5, CLK4,
CLK3, CLK2,
CLK1, CLK0
OE
GND
SEL2, SEL1,
SEL0
V
DD
V
DDO
Type
Output
Unused
Input
Input
Power
Input
Power
Power
Description
Single-ended clock output. LVCMOS/LVTTL interface levels.
No connect.
Pulldown Single-ended clock inputs. LVCMOS/LVTTL interface levels.
Output enable. When LOW, outputs are in HIGH impedance state.
When HIGH, outputs are active. LVCMOS / LVTTL interface levels.
Power supply ground.
Clock select input. See Control Input Function Table.
Pulldown
LVCMOS / LVTTL interface levels.
Pullup
Core and input supply pin.
Output supply pin.
NOTE:
Pullup
and
Pulldown
refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
T
ABLE
2. P
IN
C
HARACTERISTICS
Symbol
C
IN
R
PULLUP
R
PULLDOWN
C
PD
Parameter
Input Capacitance
Input Pullup Resistor
Input Pulldown Resistor
V = 3.465V
DDO
Test Conditions
Minimum
Typical
4
51
51
18
20
30
7
7
10
Maximum
Units
pF
kΩ
kΩ
pF
pF
pF
Ω
Ω
Ω
Power Dissipation Capacitance
(per output)
V = 2.625V
DDO
V = 1.89V
DDO
V = 3.465V
DDO
R
OUT
Output Impedance
V = 2.625V
DDO
V = 1.89V
DDO
T
ABLE
3. C
ONTROL
I
NPUT
F
UNCTION
T
ABLE
SEL2
0
0
0
0
1
1
1
1
Control Inputs
SEL1
0
0
1
1
0
0
1
1
SEL0
0
1
0
1
0
1
0
1
Input Selected to Q
CLK0
CLK1
CLK2
CLK3
CLK4
CLK5
LOW
LOW
©2016 Integrated Device Technology, Inc
2
Revision B March 10, 2016
83056 Data Sheet
A
BSOLUTE
M
AXIMUM
R
ATINGS
Supply Voltage, V
DD
Inputs, V
I
Outputs, V
O
Package Thermal Impedance,
θ
JA
Storage Temperature, T
STG
4.6V
-0.5V to V
DD
+ 0.5 V
-0.5V to V
DDO
+ 0.5V
89°C/W (0 lfpm)
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond
those listed in the
DC Characteristics
or
AC Characteristics
is
not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
T
ABLE
4A. P
OWER
S
UPPLY
DC C
HARACTERISTICS
,
V
DD
= V
DDO
= 3.3V±5%, T
A
= -40°C
TO
85°C
Symbol
V
DD
V
DDO
I
DD
I
DDO
Parameter
Power Supply Voltage
Output Supply Voltage
Power Supply Current
Output Supply Current
Test Conditions
Minimum
3.135
3.135
Typical
3.3
3.3
Maximum
3.465
3.465
40
5
Units
V
V
mA
mA
T
ABLE
4B. P
OWER
S
UPPLY
DC C
HARACTERISTICS
,
V
DD
= 3.3V±5%, V
DDO
= 2.5V±5%, T
A
= -40°C
TO
85°C
Symbol
V
DD
V
DDO
I
DD
I
DDO
Parameter
Power Supply Voltage
Output Supply Voltage
Power Supply Current
Output Supply Current
Test Conditions
Minimum
3.135
2.375
Typical
3.3
2.5
Maximum
3.465
2.625
40
5
Units
V
V
mA
mA
T
ABLE
4C. P
OWER
S
UPPLY
DC C
HARACTERISTICS
,
V
DD
= 3.3V±5%, V
DDO
= 1.8V±0.2V, T
A
= -40°C
TO
85°C
Symbol
V
DD
V
DDO
I
DD
I
DDO
Parameter
Power Supply Voltage
Output Supply Voltage
Power Supply Current
Output Supply Current
Test Conditions
Minimum
3.135
1.71
Typical
3.3
1.8
Maximum
3.465
1.89
40
5
Units
V
V
mA
mA
T
ABLE
4D. P
OWER
S
UPPLY
DC C
HARACTERISTICS
,
V
DD
= V
DDO
= 2.5V±5%, T
A
= -40°C
TO
85°C
Symbol
V
DD
V
DDO
I
DD
I
DDO
Parameter
Power Supply Voltage
Output Supply Voltage
Power Supply Current
Output Supply Current
Test Conditions
Minimum
2.375
2.375
Typical
2.5
2.5
Maximum
2.625
2.625
35
5
Units
V
V
mA
mA
T
ABLE
4E. P
OWER
S
UPPLY
DC C
HARACTERISTICS
,
V
DD
= 2.5V±5%, V
DDO
= 1.8V±0.2V, T
A
= -40°C
TO
85°C
Symbol
V
DD
V
DDO
I
DD
I
DDO
Parameter
Power Supply Voltage
Output Supply Voltage
Power Supply Current
Output Supply Current
Test Conditions
Minimum
2.375
1.71
Typical
2.5
1.8
Maximum
2.625
1.89
35
5
Units
V
V
mA
mA
©2016 Integrated Device Technology, Inc
3
Revision B March 10, 2016
83056 Data Sheet
T
ABLE
4F. LVCMOS/LVTTL DC C
HARACTERISTICS
,
T
A
= -40°C
TO
85°C
Symbol
V
IH
V
IL
I
IH
Parameter
Input High Voltage
Input Low Voltage
CLK0:CLK5,
SEL0:SEL2
OE
I
IL
Input Low Current
CLK0:CLK5,
SEL0:SEL2
OE
V
OH
Output HighVoltage
Test Conditions
V
DD
= 3.3V ± 5%
V
DD
= 2.5V ± 5%
V
DD
= 3.3V ± 5%
V
DD
= 2.5V ± 5%
V
DD
= 3.3V or 2.5V ± 5%
V
DD
= 3.3V or 2.5V ± 5%
V
DD
= 3.3V or 2.5V ± 5%
V
DD
= 3.3V or 2.5V ± 5%
V
DDO
= 3.3V ± 5%; NOTE 1
V
DDO
= 2.5V ± 5%; NOTE 1
V
DDO
= 1.8V ± 5%; NOTE 1
V
DDO
= 3.3V ± 5%; NOTE 1
V
OL
Output Low Voltage
V
DDO
= 2.5V ± 5%; NOTE 1
V
DDO
= 1.8V ± 5%; NOTE 1
-5
-150
2.6
1.8
V
DD
- 0.3
0.5
0.45
0.35
Minimum
2
1.7
-0.3
-0.3
Typical
Maximum
V
DD
+ 0.3
V
DD
+ 0.3
0.8
0.7
150
5
Units
V
V
V
V
µA
µA
µA
µA
V
V
V
V
V
V
Input High Current
NOTE 1: Outputs terminated with 50W to V
DDO
/2. See Parameter Measurement section, “Load Test Circuit” diagrams.
T
ABLE
5A. AC C
HARACTERISTICS
,
V
DD
= V
DDO
= 3.3V ± 5%, T
A
= -40°C
TO
85°C
Symbol
f
MAX
tp
LH
tp
HL
tsk(i)
tjit
tsk(pp)
t
R
/ t
F
odc
MUX
ISOL
Parameter
Output Frequency
Propagation Delay, Low to High; NOTE 1
Propagation Delay, High to Low; NOTE 1
Input Skew; NOTE 2
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section;
NOTE 3
Part-to-Part Skew; NOTE 2, 4
Output Rise/Fall Time
Output Duty Cycle
MUX Isolation
@ 100MHz
20% to 80%
50
45
45
155.52MHz,
(12kHz to 20MHz)
2.4
2.5
2.7
2.7
55
0.19
475
500
55
Test Conditions
Minimum
Typical
Maximum
250
3.0
2.9
225
Units
MHz
ns
ns
ps
ps
ps
ps
%
dB
NOTE 1: Measured from V
DD
/2 of the input to V
DDO
/2 of the output.
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 3: Driving only one input clock.
NOTE 4: Defined as skew between outputs on different devices operating a the same supply voltages and
with equal load conditions. Using the same type of input on each device, the output is measured at V
DDO
/2.
©2016 Integrated Device Technology, Inc
4
Revision B March 10, 2016
83056 Data Sheet
T
ABLE
5B. AC C
HARACTERISTICS
,
V
DD
= 3.3V ± 5%, V
DDO
= 2.5V ± 5%, T
A
= -40°C
TO
85°C
Symbol
f
MAX
tp
LH
tp
HL
tsk(i)
tjit
tsk(pp)
t
R
/ t
F
odc
MUX
ISOL
Parameter
Output Frequency
Propagation Delay, Low to High; NOTE 1
Propagation Delay, High to Low; NOTE 1
Input Skew; NOTE 2
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section;
NOTE 3
Part-to-Part Skew; NOTE 2, 4
Output Rise/Fall Time
Output Duty Cycle
MUX Isolation
@ 100MHz
20% to 80%
50
45
45
155.52MHz,
(12kHz to 20MHz)
2.5
2.6
2.8
2.8
45
0.14
400
500
55
Test Conditions
Minimum
Typical
Maximum
250
3.1
3.0
150
Units
MHz
ns
ns
ps
ps
ps
ps
%
dB
NOTE 1: Measured from V
DD
/2 of the input to V
DDO
/2 of the output.
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 3: Driving only one input clock.
NOTE 4: Defined as skew between outputs on different devices operating a the same supply voltages and
with equal load conditions. Using the same type of input on each device, the output is measured at V
DDO
/2.
T
ABLE
5C. AC C
HARACTERISTICS
,
V
DD
= 3.3V ± 5%, V
DDO
= 1.8V ± 5%, T
A
= -40°C
TO
85°C
Symbol
f
MAX
tp
LH
tp
HL
tsk(i)
tjit
tsk(pp)
t
R
/ t
F
odc
MUX
ISOL
Parameter
Output Frequency
Propagation Delay, Low to High; NOTE 1
Propagation Delay, High to Low; NOTE 1
Input Skew; NOTE 2
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter Section;
NOTE 3
Part-to-Part Skew; NOTE 2, 4
Output Rise/Fall Time
Output Duty Cycle
MUX Isolation
@ 100MHz
20% to 80%
100
45
45
155.52MHz,
(12kHz to 20MHz)
2.7
2.8
3.2
3.3
50
0.16
475
700
55
Test Conditions
Minimum
Typical
Maximum
250
3.8
3.8
150
Units
MHz
ns
ns
ps
ps
ps
ps
%
dB
NOTE 1: Measured from V
DD
/2 of the input to V
DDO
/2 of the output.
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 3: Driving only one input clock.
NOTE 4: Defined as skew between outputs on different devices operating a the same supply voltages and
with equal load conditions. Using the same type of input on each device, the output is measured at V
DDO
/2.
©2016 Integrated Device Technology, Inc
5
Revision B March 10, 2016
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