MAX2064
Dual 50MHz to 1000MHz High-Linearity,
Serial/Analog-Controlled VGA
General Description
The MAX2064 high-linearity, dual analog variable-gain
amplifier (VGA) operates in the 50MHz to 1000MHz
frequency range. Each analog attenuator is controlled
using an external voltage, or through the SPI-compatible
interface using an on-chip 8-bit DAC.
Since each of the stages has its own external RF
input and RF output, this component can be con-
figured to either optimize noise figure (NF) (ampli-
fier configured first) or OIP3 (amplifier last). The
device’s performance features include 24dB ampli-
fier gain (amplifier only), 4.4dB NF at maximum gain
(includes attenuator insertion losses), and a high
OIP3 level of +41dBm. Each of these features makes
the device an ideal VGA for multipath receiver and
transmitter applications.
In addition, the device operates from a single +5V
supply with full performance, or a +3.3V supply for an
enhanced power-savings mode with lower performance.
The device is available in a compact 48-pin TQFN
package (7mm x 7mm) with an exposed pad. Electrical
performance is guaranteed over the extended tempera-
ture range, from T
C
= -40NC to +85NC.
S
Independently Controlled Dual Paths
S
50MHz to 1000MHz RF Frequency Range
S
Pin-Compatible Family Includes
MAX2062 (Analog/Digital VGA)
MAX2063 (Digital-Only VGA)
S
22dB (typ) Maximum Gain
S
0.19dB Gain Flatness Over 100MHz Bandwidth
S
33dB Gain Range
S
49dB Path Isolation (at 200MHz)
S
Built-In 8-Bit DACs for Analog Attenuation Control
S
Excellent Linearity at 200MHz (Configured with
Amp Last)
+41dBm OIP3
+59dBm OIP2
+19dBm Output 1dB Compression Point
S
4.4dB Typical Noise Figure (at 200MHz)
S
Single +5V Supply (or +3.3V Operation)
S
Amplifier Power-Down Mode for TDD Applications
Features
Applications
IF and RF Gain Stages
Temperature-Compensation Circuits
WCDMA, TD-SCDMA, and
Stations
cdma2000
M
Base
Ordering Information
PART
MAX2064ETM+
MAX2064ETM+T
TEMP RANGE
-40NC to +85NC
-40NC to +85NC
PIN-PACKAGE
48 TQFN-EP*
48 TQFN-EP*
GSM 850/GSM 900 EDGE Base Stations
WiMAX
M
, LTE, and TD-LTE Base Stations and
Customer-Premise Equipment
Fixed Broadband Wireless Access
Wireless Local Loop
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP
= Exposed pad.
T = Tape and reel.
cdma2000 is a registered certification mark and registered
service mark of the Telecommunications Industry Association.
WiMAX is a registered certification mark and registered ser-
vice mark of the WiMAX Forum.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-5618; Rev 1; 8/15
MAX2064
ual 50MHz to 1000MHz High-Linearity,
Serial/Analog-Controlled VGA
ABSOLUTE MAXIMUM RATINGS
V
CC_AMP_1
, V
CC_AMP_2
, V
CC_RG
to GND ..........-0.3V to +5.5V
PD_1, PD_2, AMPSET to GND .............................-0.3V to +3.6V
A_VCTL_1, A_VCTL_2 to GND .............................-0.3V to +3.6V
DAT,
CS,
CLK, AA_SP to GND ............................-0.3V to +3.6V
AMP_IN_1, AMP_IN_2 to GND ..........................+0.95V to +1.2V
AMP_OUT_1, AMP_OUT_2 to GND .....................-0.3V to +5.5V
A_ATT_IN_1, A_ATT_IN_2, A_ATT_OUT_1,
A_ATT_OUT_2 to GND ......................................... 0V to +3.6V
REG_OUT to GND ................................................-0.3V to +3.6V
RF Input Power (A_ATT_IN_1, A_ATT_IN_2)................. +20dBm
RF Input Power (AMP_IN_1, AMP_IN_2)....................... +18dBm
q
JC
(Notes 1, 2) ......................................................... +12.3NC/W
q
JA
(Notes 2, 3) ............................................................ +38NC/W
Continuous Power Dissipation (Note 1) ..............................5.3W
Operating Case Temperature Range (Note 4) .. -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1:
Based on junction temperature T
J
= T
C
+ (q
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details. The junction
temperature must not exceed +150NC.
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Note 3:
Junction temperature T
J
= T
A
+ (q
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
+5V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +4.75V to +5.25V, AMPSET = 0, PD_1 = PD_2 = 0,
T
C
= -40NC to +85NC. Typical values are at V
CC_
= +5.0V and T
C
= +25NC, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Power-Down Current
Input Low Voltage
Input High Voltage
Input Logic Current
SYMBOL
V
CC
I
DC
I
DCPD
V
IL
V
IH
I
IH,
I
IL
1.7
-1
PD_1 = PD_2 = 1, V
IH
= 3.3V
CONDITIONS
MIN
4.75
TYP
5
143
5.3
MAX
5.25
210
8
0.5
3.465
+1
UNITS
V
mA
mA
V
V
FA
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +3.135V to +3.465V, AMPSET = 1, PD_1 = PD_2 = 0,
T
C
= -40NC to +85NC. Typical values are at V
CC_
= +3.3V and T
C
= +25NC, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Power-Down Current
Input Low Voltage
Input High Voltage
SYMBOL
V
CC
I
DC
I
DCPD
V
IL
V
IH
PD_1 = PD_2 = 1, V
IH
= 3.3V
CONDITIONS
MIN
3.135
TYP
3.3
84.7
4.5
0.5
1.7
MAX
3.465
145
8
UNITS
V
mA
mA
V
V
2
Maxim Integrated
MAX2064
Dual 50MHz to 1000MHz High-Linearity,
Serial/Analog-Controlled VGA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency
SYMBOL
f
RF
(Note 5)
CONDITIONS
MIN
50
TYP
MAX
1000
UNITS
MHz
+5V SUPPLY AC ELECTRICAL CHARACTERISTICS (each path, unless otherwise noted)
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +4.75V to +5.25V, attenuators are set for maximum gain,
RF ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz
P
f
RF
P
500MHz, T
C
= -40NC to +85NC. Typical
values are at maximum gain setting, V
CC
= +5.0V, P
IN
= -20dBm, f
RF
= 350MHz, and T
C
= +25NC, unless otherwise noted.) (Note 6)
PARAMETER
SYMBOL
f
RF
= 50MHz
f
RF
= 100MHz
f
RF
= 200MHz
Small-Signal Gain
G
f
RF
= 350MHz, T
C
= +25NC
f
RF
= 450MHz
f
RF
= 750MHz
f
RF
= 900MHz
Gain vs. Temperature
From 100MHz to 200MHz
Gain Flatness vs. Frequency
Any 100MHz frequency band from 200MHz
to 500MHz
f
RF
= 50MHz
f
RF
= 100MHz
f
RF
= 200MHz
Noise Figure
NF
f
RF
= 350MHz
f
RF
= 450MHz
f
RF
= 750MHz
f
RF
= 900MHz
Total Attenuation Range
Output Second-Order Intercept
Point
OIP2
f
RF
= 350MHz, T
C
= +25NC
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
1
+ f
2
RF input 1 amplified power measured at RF
output 2 relative to RF output 1, all unused
ports terminated to 50I
RF input 2 amplified signal measured at RF
output 1 relative to RF output 2, all unused
ports terminated to 50I
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 50MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 100MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 200MHz
Output Third-Order Intercept Point
OIP3
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 350MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 450MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 750MHz
P
OUT
= 0dBm/tone,
Df
= 1MHz, f
RF
= 900MHz
30
19.5
CONDITIONS
MIN
TYP
22.4
22.3
22.2
21.9
21.7
21.4
20.6
-0.006
0.18
0.19
4.4
4.4
4.4
4.6
4.7
5.3
5.7
32.9
53.7
dB
dBm
dB
dB
dB/NC
23.5
dB
MAX
UNITS
48.7
dB
48.6
46.3
44.2
41.1
37.1
34.9
28.2
24.6
dBm
Path Isolation
Maxim Integrated
3
MAX2064
ual 50MHz to 1000MHz High-Linearity,
Serial/Analog-Controlled VGA
+5V SUPPLY AC ELECTRICAL CHARACTERISTICS (each path, unless otherwise noted)
(continued)
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +4.75V to +5.25V, attenuators are set for maximum gain,
RF ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz
P
f
RF
P
500MHz, T
C
= -40NC to +85NC. Typical
values are at maximum gain setting, V
CC
= +5.0V, P
IN
= -20dBm, f
RF
= 350MHz, and T
C
= +25NC, unless otherwise noted.) (Note 6)
PARAMETER
Output -1dB Compression Point
Second Harmonic
Third Harmonic
Group Delay
Amplifier Power-Down Time
Amplifier Power-Up Time
Input Return Loss
Output Return Loss
Insertion Loss
Input Second-Order Intercept
Point
Input Third-Order Intercept Point
Attenuation Range
Gain Control Slope
Maximum Gain Control Slope
Insertion Phase Change
Analog control input
Over analog control input range
Over analog control input range
31dB to 0dB, AA_SP = 0,
from A_VCTL_ step
RF settled to
within
Q0.5dB
31dB to 0dB, AA_SP = 1,
from
CS
step
0dB to 31dB, AA_SP = 0,
from A_VCTL_ step
0dB to 31dB, AA_SP = 1,
from
CS
step
Group Delay vs. Control Voltage
Analog Control Input Range
Analog Control Input Impedance
Input Return Loss
Output Return Loss
50I source
50I load
Over analog control input from 0.25V to
2.75V
0.25
19.2
16.0
15.9
RL
IN
RL
OUT
IL
IIP2
IIP3
P
IN1
= 0dBm, P
IN2
= 0dBm (minimum
attenuation),
Df
= 1MHz, f
1
+ f
2
P
IN1
= 0dBm, P
IN2
= 0dBm (minimum
attenuation),
Df
= 1MHz
SYMBOL
P
1dB
CONDITIONS
f
RF
= 350MHz, T
C
= +25NC (Note 7)
P
OUT
= +3dBm
P
OUT
= +3dBm
Includes EV kit PCB delays
PD_1 or PD_2 from 0 to 1, amplifier DC
supply current settles to within 0.1mA
PD_1 or PD_2 from 1 to 0, amplifier DC
supply current settles to within 1%
50I source
50I load
MIN
17
TYP
18.7
-56.7
-72.4
0.9
0.5
0.5
16.8
30.7
2.2
61.9
37.0
32.9
-13.3
-35.2
16.5
500
500
ns
500
500
-0.26
2.75
ns
V
kI
dB
dB
MAX
UNITS
dBm
dBc
dBc
ns
Fs
Fs
dB
dB
dB
dBm
dBm
dB
dB/V
dB/V
Deg/V
ANALOG ATTENUATOR (each path, unless otherwise noted)
Attenuator Response Time
4
Maxim Integrated
MAX2064
Dual 50MHz to 1000MHz High-Linearity,
Serial/Analog-Controlled VGA
+5V SUPPLY AC ELECTRICAL CHARACTERISTICS (each path, unless otherwise noted)
(continued)
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +4.75V to +5.25V, attenuators are set for maximum gain,
RF ports are driven from 50I sources, AMPSET = 0, PD_1 = PD_2 = 0, 100MHz
P
f
RF
P
500MHz, T
C
= -40NC to +85NC. Typical
values are at maximum gain setting, V
CC
= +5.0V, P
IN
= -20dBm, f
RF
= 350MHz, and T
C
= +25NC, unless otherwise noted.) (Note 6)
PARAMETER
D/A CONVERTER
Number of Bits
Output Voltage
SERIAL PERIPHERAL INTERFACE (SPI)
Maximum Clock Speed
Data-to-Clock Setup Time
Data-to-Clock Hold Time
Clock-to-CS Setup Time
CS
Positive Pulse Width
CS
Setup Time
Clock Pulse Width
t
CS
t
CH
t
ES
t
EW
t
EWS
t
CW
20
2
2.5
3
7
3.5
5
MHz
ns
ns
ns
ns
ns
ns
DAC code = 00000000
DAC code = 11111111
2.7
8
0.35
Bits
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
+3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS (each path, unless otherwise noted)
(Typical
Application Circuit,
V
CC
= V
CC_AMP_1
= V
CC_AMP_2
= V
CC_RG
= +3.135V to +3.465V, attenuators are set for maximum
gain, RF ports are driven from 50I sources, AMPSET = 1, PD_1 = PD_2 = 0, 100MHz
P
f
RF
P
500MHz, T
C
= -40NC to +85NC. Typical
values are at maximum gain setting, V
CC
= +3.3V, P
IN
= -20dBm, f
RF
= 350MHz, and T
C
= +25NC, unless otherwise noted.) (Note 6)
PARAMETER
Small-Signal Gain
Output Third-Order Intercept Point
Noise Figure
Total Attenuation Range
RF input 1 amplified power measured at RF
output 2 relative to RF output 1, all unused
ports terminated to 50I
RF input 2 amplified signal measured at RF
output 1 relative to RF output 2, all unused
ports terminated to 50I
P
1dB
(Note 7)
SYMBOL
G
OIP3
NF
CONDITIONS
P
OUT
= 0dBm/tone
MIN
TYP
21.8
29.1
4.8
32.9
48.1
dB
48.2
13.2
dBm
MAX
UNITS
dB
dBm
dB
dB
Path Isolation
Output -1dB Compression Point
Note 5:
Operation outside this range is possible, but with degraded performance of some parameters. See the
Typical Operating
Characteristics.
Note 6:
All limits include external component losses. Output measurements are performed at the RF output port of the
Typical
Application Circuit.
Note 7:
It is advisable not to continuously operate the RF input 1 or RF input 2 above +15dBm.
Maxim Integrated
5
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