PN736X
NFC Cortex-M0 microcontroller
Rev. 3.3 — 7 September 2017
406333
Product data sheet
COMPANY PUBLIC
1
General description
The PN736X family is a family of 32-bit ARM Cortex-M0-based NFC microcontrollers
offering high performance and low power consumption. It has a simple instruction set and
memory addressing along with a reduced code size compared to existing architectures.
PN736Xoffers an all in one solution, with features such as NFC, microcontroller, and
software in a single chip. It operates at CPU frequencies of up to 20 MHz. It is part of the
PN7462AU product family which offers a common set of features, library and tools.
The peripheral complement of the PN736X microcontroller includes 160/80 kB of flash
memory, 12 kB of SRAM data memory and 4 kB EEPROM. It also includes one host
2
interface with either high-speed mode I C-bus, SPI, USB or high-speed UART, and two
2
master interfaces, SPI and Fast-mode Plus I C-bus. Four general-purpose counter/
timers, a random number generator, one CRC coprocessor and up to 21 general-purpose
I/O pins are also available.
The PN736X NFC microcontroller offer a one chip solution to build contactless
applications. It is equipped with a highly integrated high-power output NFC-IC for
contactless communication at 13.56 MHz enabling EMV-compliance on RF level, without
additional external active components.
PN736X supports the following operating modes:
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•
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ISO/IEC 14443-A and B, MIFARE
JIS X 6319-4 (comparable with FeliCa scheme)
ISO/IEC 15693, ICODE, ISO/IEC 18000-3 mode 3
NFC protocols - tag reader/writer, P2P
ISO/IEC 14443- type A card emulation
EMVCo compliance
NXP Semiconductors
NFC Cortex-M0 microcontroller
PN736X
2
Features and benefits
2.1 Integrated contactless interface frontend
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•
•
•
•
•
•
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High RF output power frontend IC for transfer speed up to 848 kbit/s
NFC IP1 and NFC IP2 support
Full NFC tag support (type 1, type 2, type 3, type 4A and type 4B)
P2P active and passive, target and initiator
Card emulation ISO14443 type A
ISO/IEC 14443 type A and type B
MIFARE classic card
ISO/IEC 15693, and ISO/IEC 18000-3 mode 3
Low-power card detection
Dynamic Power Control (DPC) support
Compliance with EMV contactless protocol specification
Compliance with NFC standards
2.2 Cortex-M0 microcontroller
•
Processor core
–
ARM Cortex: 32-bit M0 processor
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Built-in Nested Vectored Interrupt Controller (NVIC)
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Non-maskable interrupt
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24-bit system tick timer
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Running frequency of up to 20 MHz
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Clock management to enable low power consumption
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Memory
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Flash: 160 (PN7362) / 80 kB (PN7360)
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SRAM: 12 kB
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EEPROM: 4 kB
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40 kB boot ROM included, including USB mass storage primary boot loader for code
download
•
Debug option
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Serial Wire Debug (SWD) interface
•
Peripherals
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Host interface:
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USB 2.0 full speed with USB 3.0 hub connection capability
–
HSUART for serial communication, supporting standards speeds from 9600 bauds to
115200 bauds, and faster speed up to 1.288 Mbit/s
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SPI with half-duplex and full duplex capability with speeds up to 7 Mbit/s
2
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I C supporting standard mode, fast mode and high-speed mode with multiple address
support
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Master interface:
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SPI with half-duplex capability from 1 Mbit/s to 6.78 Mbit/s
2
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I C supporting standard mode, fast mode, fast mode plus and clock stretching
•
Up to 21 General-Purpose I/O (GPIO) with configurable pull-up/pull-down resistors
PN736X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.3 — 7 September 2017
406333
2 / 80
NXP Semiconductors
NFC Cortex-M0 microcontroller
•
GPIO1 to GPIO12 can be used as edge and level sensitive interrupt sources
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Power
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Two reduced power modes: standby mode and hard power-down mode
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Supports suspend mode for USB host interface
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Processor wake-up from hard power-down mode, standby mode, suspend mode via
host interface, GPIOs, RF field detection
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Integrated PMU to adjust internal regulators automatically, to minimize the power
consumption during all possible power modes
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Power-on reset
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RF supply: external, or using an integrated LDO (TX LDO, configurable with 3 V, 3.3
V, 3.6 V, 4.5 V, and 4.75 V)
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Pad voltage supply: external 3.3 V or 1.8 V, or using an integrated LDO (3.3 V
supply)
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Timers
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Four general-purpose timers
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Programmable Watchdog Timer (WDT)
•
CRC coprocessor
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Random number generator
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Clocks
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Crystal oscillator at 27.12 MHz
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Dedicated PLL at 48 MHz for the USB
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Integrated HFO 20 MHz and LFO 365 kHz
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General
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HVQFN64 package
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Temperature range: -40 °C to +85 °C
PN736X
PN736X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.3 — 7 September 2017
406333
3 / 80
NXP Semiconductors
NFC Cortex-M0 microcontroller
PN736X
3
Applications
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Physical access control
Gaming
USB NFC reader, including dual interface smart card readers
Home banking, payment readers EMVCo compliant
High integration devices
NFC applications
PN736X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.3 — 7 September 2017
406333
4 / 80
NXP Semiconductors
NFC Cortex-M0 microcontroller
PN736X
4
Quick reference data
Table 1. Quick reference data
Operating range: -40 °C to +85 °C unless specified; contactless interface: internal LDO not used
Symbol
V
DDP(VBUS)
Parameter
power supply voltage
on pin VBUS
Conditions
card emulation, passive target
(PLM)
all RF modes
all RF modes
Min
2.3
2.7
3
1.65
3
-
Typ
-
-
-
1.8
3.3
12
Max
5.5
5.5
5.5
1.95
3.6
18
Unit
V
V
V
V
V
μA
V
DD(PVDD)
I
DDP(VBUS)
PVDD supply voltage
power supply current
on pin VBUS
1.8 V
3.3 V
in hard power-down mode; T
= 25 °C; V
DDP(VBUS)
= 5.5 V;
RST_N = 0
stand by mode; T = 25 °C;
V
DDP(VBUS)
= 3.3 V; external
PVDD LDO used
stand by mode; T = 25 °C;
V
DDP(VBUS)
= 5.5 V; internal
PVDD LDO used
suspend mode, USB interface;
V
DDP(VBUS)
= 5.5 V; external
PVDD supply; T = 25 °C
-
18
-
μA
-
55
-
μA
-
120
250
μA
I
DD(TVDD)
TVDD supply current
on pin TVDD_IN; maximum
supported current by the
contactless interface
-
-
250
mA
P
max
T
amb
maximum power
dissipation
ambient temperature
JEDEC PCB
-
-40
-
-
1050
+85
mW
°C
PN736X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.3 — 7 September 2017
406333
5 / 80
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