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74VCX08M

产品描述Logic Gates Qd 2-Input AND Gate
产品类别逻辑    逻辑   
文件大小935KB,共14页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
标准
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74VCX08M概述

Logic Gates Qd 2-Input AND Gate

74VCX08M规格参数

参数名称属性值
Brand NameFairchild Semiconductor
是否无铅不含铅
是否Rohs认证符合
厂商名称Fairchild
零件包装代码SOIC
包装说明0.150 INCH, LEAD FREE, MS-012, SOIC-14
针数14
制造商包装代码14LD,SOIC,JEDEC MS-012, .150\", NARROW BODY
Reach Compliance Codecompliant
ECCN代码EAR99
系列ALVC/VCX/A
JESD-30 代码R-PDSO-G14
JESD-609代码e3
长度8.6235 mm
负载电容(CL)30 pF
逻辑集成电路类型AND GATE
最大I(ol)0.024 A
湿度敏感等级1
功能数量4
输入次数2
端子数量14
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP14,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE
包装方法RAIL
峰值回流温度(摄氏度)260
电源3.3 V
Prop。Delay @ Nom-Sup2.8 ns
传播延迟(tpd)37 ns
认证状态Not Qualified
施密特触发器NO
座面最大高度1.753 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)1.2 V
标称供电电压 (Vsup)1.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度3.9 mm

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Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
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Please
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74VCX08M相似产品对比

74VCX08M 74VCX08MTCX 74VCX08BQX
描述 Logic Gates Qd 2-Input AND Gate Operational Amplifiers - Op Amps Single 1.8V 1MHz Motor / Motion / Ignition Controllers u0026 Drivers H-BRIDGE 36V max 1 Chan 2.0A
Brand Name Fairchild Semiconductor Fairchild Semiconductor Fairchild Semiconductor
是否无铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合
厂商名称 Fairchild Fairchild Fairchild
零件包装代码 SOIC TSSOP MLP
包装说明 0.150 INCH, LEAD FREE, MS-012, SOIC-14 TSSOP, TSSOP14,.25 HVQCCN, LCC14,.1X.12,20
针数 14 14 14
制造商包装代码 14LD,SOIC,JEDEC MS-012, .150\", NARROW BODY 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE 14LD,DQFN,JEDEC MO-241,2.5 X 3.0MM
Reach Compliance Code compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99
系列 ALVC/VCX/A ALVC/VCX/A ALVC/VCX/A
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-XQCC-N14
JESD-609代码 e3 e4 e4
长度 8.6235 mm 5 mm 3 mm
负载电容(CL) 30 pF 30 pF 30 pF
逻辑集成电路类型 AND GATE AND GATE AND GATE
最大I(ol) 0.024 A 0.024 A 0.024 A
湿度敏感等级 1 1 1
功能数量 4 4 4
输入次数 2 2 2
端子数量 14 14 14
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED
封装代码 SOP TSSOP HVQCCN
封装等效代码 SOP14,.25 TSSOP14,.25 LCC14,.1X.12,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
包装方法 RAIL TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 260 NOT SPECIFIED
电源 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 2.8 ns 2.8 ns 2.8 ns
传播延迟(tpd) 37 ns 37 ns 37 ns
认证状态 Not Qualified Not Qualified Not Qualified
施密特触发器 NO NO NO
座面最大高度 1.753 mm 1.2 mm 0.8 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 1.2 V 1.2 V 1.2 V
标称供电电压 (Vsup) 1.5 V 1.5 V 1.5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 GULL WING GULL WING NO LEAD
端子节距 1.27 mm 0.65 mm 0.5 mm
端子位置 DUAL DUAL QUAD
处于峰值回流温度下的最长时间 30 NOT SPECIFIED NOT SPECIFIED
宽度 3.9 mm 4.4 mm 2.5 mm
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