IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CQCC20, CERAMIC, LLCC-20, Gate
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QLCC |
| 包装说明 | CERAMIC, LLCC-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OR GATE |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 最大电源电流（ICC） | 15.5 mA |
| 传播延迟（tpd） | 6.3 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| N54F32/B2A | 54F32/BCA | 54F32/B2A | 54F32/BDA | N54F32/BDA | |
|---|---|---|---|---|---|
| 描述 | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CQCC20, CERAMIC, LLCC-20, Gate | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CDIP14, Gate | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CQCC20, Gate | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, Gate | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, DFP-14, Gate |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T14 | S-CQCC-N20 | R-CDFP-F14 | R-CDFP-F14 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 14 | 20 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | QCCN | DFP | DFP |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK | FLATPACK |
| 最大电源电流（ICC） | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA |
| 传播延迟（tpd） | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT | FLAT |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) |
| 包装说明 | CERAMIC, LLCC-20 | DIP, | - | DFP, | CERAMIC, DFP-14 |
| 座面最大高度 | 1.905 mm | 5.08 mm | - | - | 2.159 mm |
| 端子节距 | 1.27 mm | 2.54 mm | - | - | 1.27 mm |
| 宽度 | 8.89 mm | 7.62 mm | - | - | 6.2865 mm |
模拟与混合信号
Microchip MCU
嵌入式系统
PCB设计
模拟电子
stm32/stm8
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