WS483
Sn62 and Sn63
Water Soluble Solder Paste
Features:
- 48 Hour Stencil Life
- Excellent Activity
- 24 Hour Tack Time
- Excellent Printing Characteristics
- Slump Resistant
- Good for Batch or Continuous Runs
- Extended Cleaning Window
- High-Humidity Resistant
- Will Not Foam During Wash
Description:
WS483 is an organically activated formulation developed to better resist the effects of increased humidity
levels. WS483 offers improved heat and humidity resistance, while maintaining high tack and resistance to
slump. WS483 also provides an exceptional post-process cleaning window and will not foam during the
cleaning process, even in high-pressure wash systems.
Printing:
-
Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of
12 to 16 mm (½ to ⅝ inch) is normally sufficient to begin).
-
Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry
and workable properties.
-
WS483 provides the necessary tack time and force for today’s high speed placement equipment, which
will enhance product performance and reliability.
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
PARAMETER
Squeegee Pressure
Squeegee Speed
Snap-off Distance
RECOMMENDED INITIAL SETTINGS
0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade
12-150 mm/sec (.5-6”/sec)
On Contact 0.00 mm (0.00”)
PARAMETER
PCB Separation Distance
PCB Separation Speed
RECOMMENDED INITIAL SETTINGS
0.75-2.0 mm (.030-.080”)
Slow
Reflow Profile:
Either a straight ramp-spike or ramp-soak-spike profile can be used as shown below. Both profiles would
have a similar peak temperature and time above liquidus (TAL). The shaded area defines the process window.
Oven efficiency, board size/mass, component type and density all influence the final profile for a given
assembly. These profiles are starting points, and processing boards with thermal-couples attached is
recommended to optimize the process.
RATE OF
RISE
1.5-2 °C / SEC
MAX
RAMP TO
150 °C
( 300°F)
PROGRESS
THROUGH
150°C-170°C
(300°F-340°F)
TO PEAK TEMP
210 °C-220°C
(410°F-430°F)
TIME ABOVE
183 °C (380°F)
COOLDOWN
≤
4°C
/ SEC
PROFILE
LENGTH
AMBIENT TO
COOL DOWN
Standard
Profile
≤ 75 Sec
30-60 Sec
45-75 Sec
30-60 Sec
45± 15 Sec
2.75-3.5 Min
T
HE RECOMMENDED REFLOW PROFILE FOR
WS483
IS PROVIDED AS A GUIDELINE
. O
PTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE
,
ASSEMBLY
LAYOUT
,
OR OTHER PROCESS VARIABLES
. C
ONTACT
AIM T
ECHNICAL
S
UPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE
.
T
HE
R
EFLOW
P
ROFILE FOR THE
Sn/Pb P
ASTES USING A
V
APOR
P
HASE
R
EFLOW
O
VEN
: P
EAK TEMPERATURE RANGE I S
230°C – 245°C.
Compatible Products:
-
Electropure Solder Bar
-
WS Tacky Flux
-
WS715; WS375 Spray Flux
-
WS482 Cored Wire
-
Epoxy 4089 – Chip Bonding Epoxy
-
200AX – Stencil Cleaner
Cleaning:
WS483 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A
temperature of 38°C (100°F) - 66°C (150°F) is sufficient for removing residues. An in-line or other
pressurized spray cleaning system is suggested, but is not required.
Handling and Storage:
- WS483 has a refrigerated shelf life of 6 months at 4°C (40°F).
- Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
- Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated
material.
- Do not store new and used paste in the same container, and reseal any opened containers while not in use.
- Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.
Safety:
- Use with adequate ventilation and proper personal protective equipment.
- Refer to the accompanying Material Safety Data Sheet
for any specific emergency information.
- Do not dispose of any lead-containing materials in non-approved containers.
Physical Properties:
ITEM
Appearance
Alloy
Melting Point
Particle Size
General Metal Loading
Viscosity
Packaging
SPECIFICATION
Gray, Smooth, Creamy
Sn63 and Sn62
183°C
T3, T4, T5
90% (T3)
Print/Dispense
Available in all industry standard packaging.
Test Data Summary:
CLASSIFICATION
Product
Name
WS483
POWDER TESTING
No.
Item
1
IPC Classification to J-STD-004
ORM0
Copper Mirror to J-STD-004
Low
Results
Type 3 – 45-25 micron
Type 4 – 38-20 micron
Spherical
Results
150.02 mg KOH/g Flux
No Fluoride
Low
Pass
Control Coupons > 1E at 96 & 168 h. - Pass
Sample Coupons > 1E at 96 & 168 h. - Pass
> No dendrite growth or corrosion, after a
visual inspection - pass
See list of recommended products above
Results
900 ± 10% kcps
Results
30.5 gf
82.8 gf
Pass
Pass
4°C (39°F) = 6 months
Pass
Test Method
J-STD-004 IPC TM 650 2.2.14
Microscope
Test Method
J-STD-004 IPC TM 650 2.3.13
J-STD-004 IPC TM 650 2.3.35.1
J-STD-004 IPC TM 650 2.3.32
J-STD-004 IPC TM 650 2.3.33
J-STD-004 IPC TM 650 2.6.3.3
GR-78-CORE
Test Method
J-STD-005 IPC TM 650 2.4.34
Test Method
J-STD-005 IPC TM 650 2.4.44
JIS Z 3284 Annez 9
J-STD-005 IPC TM 650 2.4.43
J-STD-005 IPC TM 650 2.4.45
AIM TM 125-11
J-STD-005 IPC TM 650 2.4.35
Silver Chromate to J-STD-004
Pass
Powder Size
2
Powder Shape
FLUX MEDIUM TESTING
No.
Item
1
Acid Value
2
Fluorides Spot Test
3
Corrosivity Test/ Copper Mirror
4
Halide-Free/Silver Chromate Paper Test
7
Surface Insulation Resistance
8
Compatibility Test
VISCOSITY TESTING
No.
Item
1
T-Bar Spindle Test Method
SOLDER PASTE TESTING
No.
Item
1
Tack Test
2
Tack Test
3
Solder Ball Test
4
Wetting Test
5
Paste Shelf Life
6
Solder Paste Slump Test
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Asia-Pacific +86-755-2993-6487 · India +91-80-41554753 · info@aimsolder.com · www.aimsolder.com
AIM IS ISO9001:2008 CERTIFIED
The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of
proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability is expressly
disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to
http://www.aimsolder.com/Home/TermsConditions.aspx
to review AIM's terms and conditions.
03/12
Document Rev # 3
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