128K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM
| MCM69P735 | MCM69P735ZP3R | MCM69P735ZP3.5 | MCM69P735ZP3 | MCM69P735ZP3.5R | |
|---|---|---|---|---|---|
| 描述 | 128K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM | 128K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM | 128K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM | 128K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM | 128K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM |
| 厂商名称 | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 零件包装代码 | - | BGA | - | BGA | BGA |
| 包装说明 | - | BGA, | BGA, | BGA, | BGA, |
| 针数 | - | 119 | - | 119 | 119 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow |
| ECCN代码 | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | - | 3 ns | - | 3 ns | 3.5 ns |
| JESD-30 代码 | - | R-PBGA-B119 | - | R-PBGA-B119 | R-PBGA-B119 |
| 长度 | - | 22 mm | - | 22 mm | 22 mm |
| 内存密度 | - | 4718592 bi | - | 4718592 bi | 4718592 bi |
| 内存集成电路类型 | - | CACHE SRAM | - | CACHE SRAM | CACHE SRAM |
| 内存宽度 | - | 36 | - | 36 | 36 |
| 功能数量 | - | 1 | - | 1 | 1 |
| 端口数量 | - | 1 | - | 1 | 1 |
| 端子数量 | - | 119 | - | 119 | 119 |
| 字数 | - | 131072 words | - | 131072 words | 131072 words |
| 字数代码 | - | 128000 | - | 128000 | 128000 |
| 工作模式 | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | 70 °C | - | 70 °C | 70 °C |
| 组织 | - | 128KX36 | - | 128KX36 | 128KX36 |
| 输出特性 | - | 3-STATE | - | 3-STATE | 3-STATE |
| 可输出 | - | YES | - | YES | YES |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | BGA | - | BGA | BGA |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | GRID ARRAY | - | GRID ARRAY | GRID ARRAY |
| 并行/串行 | - | PARALLEL | - | PARALLEL | PARALLEL |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 2.4 mm | - | 2.4 mm | 2.4 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 3.135 V | - | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | - | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | - | YES | YES |
| 技术 | - | MOS | - | MOS | MOS |
| 温度等级 | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子形式 | - | BALL | - | BALL | BALL |
| 端子节距 | - | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 端子位置 | - | BOTTOM | - | BOTTOM | BOTTOM |
| 宽度 | - | 14 mm | - | 14 mm | 14 mm |
嵌入式系统
求职招聘
为我们提建议&公告
单片机
WindowsCE
模拟电子
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
