IDT7MP1021S35M概述

Multi-Port SRAM Module, 128KX8, 35ns, CMOS

IDT7MP1021S35M规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
Reach Compliance Code	not_compliant
ECCN代码	EAR99
最长访问时间	35 ns
其他特性	SEMAPHORE
I/O 类型	COMMON
JESD-30 代码	R-XSMA-N64
内存密度	1048576 bit
内存集成电路类型	MULTI-PORT SRAM MODULE
内存宽度	8
湿度敏感等级	1
功能数量	1
端口数量	2
端子数量	64
字数	131072 words
字数代码	128000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX8
输出特性	3-STATE
可输出	YES
封装主体材料	UNSPECIFIED
封装代码	SIMM
封装等效代码	SSIM64
封装形状	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY
并行/串行	PARALLEL
峰值回流温度（摄氏度）	225
电源	5 V
认证状态	Not Qualified
最大待机电流	0.125 A
最小待机电流	4.5 V
最大压摆率	0.94 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	SINGLE
处于峰值回流温度下的最长时间	NOT SPECIFIED
Base Number Matches	1

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IDT7MP1021S35M相似产品对比

	IDT7MP1021S35M	IDT7MP1023S30M	IDT7MP1023S50M	IDT7MP1021S40M	IDT7MP1021S50M	IDT7MP1023S25M	IDT7MP1023S35M	IDT7MP1023S40M	IDT7MP1021S30M	IDT7MP1021S25M
描述	Multi-Port SRAM Module, 128KX8, 35ns, CMOS	Multi-Port SRAM Module, 64KX8, 30ns, CMOS	Multi-Port SRAM Module, 64KX8, 50ns, CMOS	Multi-Port SRAM Module, 128KX8, 40ns, CMOS	Multi-Port SRAM Module, 128KX8, 50ns, CMOS	Multi-Port SRAM Module, 64KX8, 25ns, CMOS	Multi-Port SRAM Module, 64KX8, 35ns, CMOS	Multi-Port SRAM Module, 64KX8, 40ns, CMOS	Multi-Port SRAM Module, 128KX8, 30ns, CMOS	Multi-Port SRAM Module, 128KX8, 25ns, CMOS
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	35 ns	30 ns	50 ns	40 ns	50 ns	25 ns	35 ns	40 ns	30 ns	25 ns
其他特性	SEMAPHORE	SEMAPHORE	SEMAPHORE	SEMAPHORE	SEMAPHORE	SEMAPHORE	SEMAPHORE	SEMAPHORE	SEMAPHORE	SEMAPHORE
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64	R-XSMA-N64
内存密度	1048576 bit	524288 bit	524288 bit	1048576 bit	1048576 bit	524288 bit	524288 bit	524288 bit	1048576 bit	1048576 bit
内存集成电路类型	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE	MULTI-PORT SRAM MODULE
内存宽度	8	8	8	8	8	8	8	8	8	8
湿度敏感等级	1	1	1	1	1	1	1	1	1	1
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2	2	2
端子数量	64	64	64	64	64	64	64	64	64	64
字数	131072 words	65536 words	65536 words	131072 words	131072 words	65536 words	65536 words	65536 words	131072 words	131072 words
字数代码	128000	64000	64000	128000	128000	64000	64000	64000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX8	64KX8	64KX8	128KX8	128KX8	64KX8	64KX8	64KX8	128KX8	128KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装代码	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM
封装等效代码	SSIM64	SSIM64	SSIM64	SSIM64	SSIM64	SSIM64	SSIM64	SSIM64	SSIM64	SSIM64
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	225	225	225	225	225	225	225	225	225	225
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最小待机电流	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
最大待机电流	0.125 A	-	0.065 A	0.125 A	0.125 A	0.000065 A	0.065 A	0.065 A	-	0.125 A
最大压摆率	0.94 mA	-	0.66 mA	0.94 mA	0.94 mA	0.66 mA	0.66 mA	0.66 mA	-	0.94 mA

IDT7MP1021S35M

IDT7MP1021S35M概述

IDT7MP1021S35M规格参数

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IDT7MP1021S35M相似产品对比

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