Figure 1. Schematic of Module, Showing Pin–Out and External Connections
Motorola IGBT Device Data
3
MHPM6B20E60D3
RECOMMENDED PCB LAYOUT
VIEW OF BOARD FROM HEAT SINK
(All Dimensions Typical)
NON–PLATED THRU–HOLE
0.140
0.265
KEEP–OUT ZONES (x4)
0.270
0.175
0.250
0.625
0.270
PIN 1
PLATED THRU–HOLES
(x16)
0.065
0.250
3.500
PACKAGE “SHADOW”
0.450
0.625
0.175
0.175
1.350
1.530
OPTIONAL NON–PLATED
THRU–HOLES FOR ACCESS
TO HEAT SINK MOUNTING
SCREWS (x2)
Figure 2. Package Footprint
NOTE:
1. Package is symmetrical, except for a polarizing plastic post near pin 1, indicated by a non–plated thru–hole in the footprint.
2. Dimension of plated thru–holes indicates net size after plating.
3. Access holes for mounting screws may or may not be necessary depending on assembly plan for finished product.
4
Motorola IGBT Device Data
MHPM6B20E60D3
PACKAGE DIMENSIONS
A
AA
U
Q
3 PL
Y
2 PL
1
2
3
4
5
6
7
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. LEAD LOCATION DIMENSIONS (ie: G, S, R, H ...)
ARE TO THE CENTER OF THE LEAD.
MILLIMETERS
MIN
MAX
88.39
89.41
38.35
39.37
12.32
13.59
0.89
1.65
8.64
9.65
0.13
0.64
5.97
6.73
33.91
34.67
0.41
1.22
16.26
17.27
3.71
4.72
5.46
6.48
10.92
11.94
24.89
25.91
2.01
2.62
16.76
17.53
15.49
16.26
75.69
76.71
55.88
57.15
29.97
30.99
5.26
5.77
11.30
12.07
2.29
2.79
16.26
17.27
INCHES
MIN
MAX
3.480
3.520
1.510
1.550
0.485
0.535
0.035
0.065
0.340
0.380
0.005
0.025
0.235
0.265
1.335
1.365
0.016
0.048
0.640
0.680
0.146
0.186
0.215
0.255
0.430
0.470
0.980
1.020
0.079
0.103
0.660
0.690
0.610
0.640
2.980
3.020
2.200
2.250
1.180
1.220
0.207
0.227
0.445
0.475
0.090
0.110
0.640
0.680
J
B P N
R
16
15
14
13
12
11
10
9
H
F
DETAIL Z
16 PL
S
D
16 PL
G
14 PL
M
4 PL
DETAIL Z
AB
C X
K
E
L
W
V
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
U
V
W
Y
X
AA
AB
CASE 464–03
ISSUE B
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Motorola was negligent regarding the design or manufacture of the part. Motorola and
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Opportunity/Affirmative Action Employer.
Mfax is a trademark of Motorola, Inc.
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