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1N5919CUR-1E3

产品描述Zener Diode
产品类别分立半导体    二极管   
文件大小293KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
标准
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1N5919CUR-1E3概述

Zener Diode

1N5919CUR-1E3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明O-LELF-R2
Reach Compliance Codecompli
ECCN代码EAR99
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
JESD-609代码e3
元件数量1
端子数量2
最高工作温度175 °C
最低工作温度-65 °C
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
标称参考电压5.6 V
表面贴装YES
技术ZENER
端子面层Matte Tin (Sn)
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差2%
工作测试电流66.9 mA
Base Number Matches1

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1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
Available
Metallurgically Bonded Glass Surface Mount
1.5 Watt Zener Diodes
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar
in electrical features to the JEDEC registered 1N5913B through 1N5956B axial-leaded
package for 3.3 to 200 V. It is an ideal selection for applications of high density and low
parasitic requirements. Due to its glass hermetic qualities and metallurgically enhanced
internal contacts, it may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in
Features below.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-213AB MELF
Package
Also available in:
DO-41 package
(glass axial-leaded)
1N5913BG – 1N5956BG
FEATURES
Surface mount equivalent of JEDEC registered 1N5913B TO 1N5956B number series.
Zener voltage available 3.3 V to 200 V.
Voltage tolerances of 10%, 5%, 2% and 1% are available.
Screening in reference to MIL-PRF-19500 is available.
(See
part nomenclature
for all available options.)
RoHS compliant versions are available.
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
SMAJ package
APPLICATIONS / BENEFITS
Regulates voltage over a broad ranges of operation current and temperature.
Leadless package ideal for high-density surface mounting.
Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance.
Hermetically sealed glass package.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Specified capacitance (see
figure 2).
Inherently radiation hard as described in Microsemi
MicroNote 050.
o
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
MAXIMUM RATINGS
@ T
A
= 25 C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-End Cap
(1)
Thermal Resistance Junction-to-Ambient
Steady State Power Dissipation
@ T
EC
≤ 115 ºC
(1)
@ T
A
= 25 ºC
Rated Average Power Dissipation (also see
figure 1)
Forward Voltage
@ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
& T
STG
R
ӨJEC
R
ӨJA
P
D
P
M(AV)
V
F
T
SP
Value
-65 to +175
40
120
1.5
1.25
1.5
1.2
260
Unit
o
C
o
C/W
o
C/W
W
W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 1 of 5
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