Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
3.0SMC Series
Uni-directional
Description
RoHS
Pb
e3
The 3.0SMC series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Parameter
Power Dissipation on Infinite Heat
Sink at T
L
=50
O
C
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 1)
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only
Operating Temperature Range
Storage Temperature Range
Typical Thermal Resistance Junction
to Lead
Typical Thermal Resistance Junction
to Ambient
Symbol
P
D
I
FSM
V
F
T
J
T
STG
R
θJL
R
θJA
Value
6.5
300
3.5
-65 to 150
-65 to 175
15
75
Unit
W
A
V
°C
°C
°C/W
Features
• For surface mounted
applications in order to
optimize board space
• Low profile package
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• I
PP
is specified @ 8/20µS
surge waveform
• Built-in strain relief
• V
BR
@ T
J
= V
BR
@25°C
x (1+
α
T x (T
J
- 25))
(
α
T:Temperature
Coefficient, typical value is
0.1%)
• Glass passivated chip
junction
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• High temperature to reflow
soldering guaranteed:
260°C/40sec
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260
°
C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD-
609A.01)
°C/W
Notes:
1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
Functional Diagram
Bi-directional
Cathode
Uni-directional
Anode
Additional Infomarion
Applications
TVS devices are ideal for the protection of I/O Interfaces,
V
CC
bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic
applications.
Datasheet
Resources
Samples
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
Electrical Characteristics
(T =25°C unless otherwise noted)
A
Part
Number
(Uni)
3.0SMC20A
3.0SMC24A
3.0SMC28A
3.0SMC30A
3.0SMC33A
Maximum
Test
TVS
Reverse
Arrays
(SPA
™
Family of Products)
Diode
Voltage V
Marking
Stand off
Voltage V
R
(Volts)
20.0
24.0
28.0
30.0
33.0
Breakdown
(Volts) @ I
T
BR
MIN
22.20
26.70
31.10
33.30
36.70
MAX
24.50
29.50
34.40
36.80
40.60
Current
I
T
(mA)
1
1
1
1
1
Clamping
Voltage V
C
@ 8/20µS
I
pp
(V)
42
51
59
62
70
Maximum Peak
Maximum
Pulse Current
Reverse
I
pp
@ 8/20µS
Leakage I
R
@ V
R
(A)
(µA)
570
520
470
420
365
1
1
1
1
1
YLA
YLC
YLE
YLF
YLG
I-V Curve Characteristics
Uni-directional
Vc V
BR
V
R
I
R
V
F
I
T
V
I
pp
P
PPM
V
R
V
BR
V
C
I
R
V
F
Peak Pulse Power Dissipation
-- Max power dissipation
Stand-off Voltage
-- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage
-- Maximum voltage that flows though the TVS at a specified test current (I
T
)
Clamping Voltage
-- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
Reverse Leakage Current
-- Current measured at V
R
Forward Voltage Drop for Uni-directional
A
Ratings and Characteristic Curves
(T =25°C unless otherwise noted)
Figure 1 - TVS Transients Clamping Waveform
Voltage Transients
Figure 2 - Peak Pulse Power Rating
1000
TJ initial = Tamb
P
PPM
-Peak Pulse Power (KW)
Voltage Across TVS
Voltage or Current
100
Current Through TVS
10
1
0.31x0.31" (8.0x8.0mm)
0.1
Copper Pad Area
0.001
Time
0.01
0.1
1
t
d
-Pulse Width (ms)
10
continues on next page.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
Ratings and Characteristic Curves
(T =25°C unless otherwise noted)
(Continued)
A
Figure 3 - Peak Pulse Power Derating Curve
100
Peak Pulse Power (P
PP
) or Current (I
PP
)
Derating in Percentage %
TVS Diode Arrays
(SPA
™
Family
4
of
Pulse Waveform
Products)
Figure -
tr= rise time to peak value
td= decaytime to half value
I
PP
- Peak Pulse Current, % I
PP
80
60
40
20
0
100
Peak
Value
Waveform = tr x td
50
Half Value
0
0
25
50
75
100 125 150
T
J
- Initial Junction Temperature (ºC)
175
0
tr=8µS
td=20µS
t-Time (µS)
Figure 5 - Typical Junction Capacitance
Figure 6 - Typical Transient Thermal Impedance
Transient Thermal Impedance (
°
C/W)
100
100000
Uni-direc onal V=0V
10000
1000
Cj(pF)
10
Uni-direc onal V=V
R
1
100
10
1
1
10
V
BR
- Reverse Breakdown Voltage(V)
100
0.1
0.01
0.001
0.01
0.1
1
10
100
1000
T
P
- Pulse Duration (s)
Figure 7 - Maximum Non-Repetitive Peak Forward
Surge Current Uni-Directional only
350
300
250
200
150
100
50
0
1
10
Number of Cycles at 60 Hz
100
Figure 8 - Peak Forward Voltage Drop vs Peak Forward
Current (Typical Values)
100.0
IFSM - Peak Forward Surve Current(A)
I
F
- Peak Forward Current(A)
10.0
1.0
0.1
0.0
1.0
2.0
3.0
4.0
5.0
V
F
- Peak Forward Voltage(V)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
Soldering Parameters
Reflow Condition
TVS Diode Arrays
(SPA
™
Family of Products)
Lead–free
assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Temperature (T)
T
P
Ramp-up
t
p
Critical Zone
T
L
to T
P
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp (T
A
)
to peak
T
S(max)
to T
A
- Ramp-up Rate
Reflow
- Temperature (T
A
) (Liquidus)
- Time (min to max) (t
s
)
T
L
T
s(max)
t
L
T
s(min)
Ramp-down
Preheat
t
s
25˚C
t 25˚C to Peak
Time (t)
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Environmental Specifications
High Temp. Storage
HTRB
Temperature Cycling
MSL
H3TRB
RSH
JESD22-A103
JESD22-A108
JESD22-A104
JEDEC-J-STD-020, Level 1
JESD22-A101
JESD22-A111
Physical Specifications
Weight
Case
Polarity
Terminal
0.007 ounce, 0.21 grams
JEDEC DO214AB. Molded plastic body
over glass passivated junction
Color band denotes positive end
(cathode) except Bidirectional.
Matte Tin-plated leads, Solderable per
JESD22-B102
Dimensions
DO-214AB (SMC J-Bend)
Cathode Band
Dimensions
A
B
C
D
Inches
Min
0.114
0.260
0.220
0.079
0.030
-
0.305
0.006
0.129
0.094
-
0.094
Max
0.126
0.280
0.245
0.103
0.060
0.008
0.320
0.012
-
-
0.165
-
Millimeters
Min
2.900
6.600
5.590
2.060
0.760
-
7
.750
0.152
3.300
2.400
2.400
Max
3.200
7
.110
6.220
2.620
1.520
0.203
8.130
0.305
-
-
4.200
-
A
B
H
D
F
J
C
E
F
G
H
I
E
G
K
L
J
K
L
I
Solder Pads
(all dimensions in mm)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Transient Voltage Suppression Diodes
Surface Mount > 3.0SMC series
Part Numbering System
3.0SMC XX A
Part Marking System
Cathode Band
F
YMXXX
5%
V
BR
VOLTAGE TOLERANCE
Littelfuse Logo
V
R
VOLTAGE
SERIES
XXX
Marking Code
Trace Code Marking
Y:Year Code
M: Month Code
XXX: Lot Code
Packaging Options
Part number
3.0SMCxxX
Component
Package
DO-214AB
Quantity
3000
Packaging
Option
Tape & Reel - 16mm tape/13” reel
Packaging
Specification
EIA STD RS-481
Tape and Reel Specification
0.157
(4.0)
0.47
(12.0)
Cathode
0.157
(4.0)
13.0 (330)
0.059 DIA
(1.5)
Cover tape
0.80 (20.2)
Arbor Hole Dia.
Dimensions are in inches
(and millimeters).
0.49
(12.5)
Direction of Feed
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
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