Ultra Small
μClamp
®
1-Line, 3.3V ESD Protection
PROTECTION PRODUCTS - Z-Pak
TM
Description
μClamp
®
TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. They
are designed to replace 0201 size multilayer varistors
(MLVs) in portable applications such as cell phones, note-
book computers, and other portable electronics. They
features large cross-sectional area junctions for conduct-
ing high transient currents. These devices offer desir-
able characteristics for board level protection including
fast response time, low operating and clamping voltage,
and no device degradation.
μClamp
®
3311Z is constructed using Semtech’s propri-
etary EPD process technology. The EPD process provides
low standoff voltages with significant reductions in leak-
age currents and capacitance over silicon-avalanche di-
ode processes. They feature a true operating voltage of
3.3 volts for superior protection when compared to tra-
ditional pn junction devices.
μClamp3311Z
is in a 2-pin SLP0603P2X3A package.
It measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with lead-free NiAu. Each
device will protect one line operating at 3.3 volts. It
gives the designer the flexibility to protect single lines in
applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
uClamp3311Z
Features
High ESD withstand Voltage:
+/-14kV
(Contact) and
+/- 16kV
(Air) per
IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
Ultra-small 0201 package
0201 package
Protects one data line
Low reverse current: <10nA typical (VR=5V)
Working voltage: +/- 3.3V
Low capacitance: 6pF typical
Extremely low dynamic resistance: 0.21 Ohms (Typ)
Solid-state silicon-avalanche technology
SLP0603P2X3A package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking : Marking code
Packaging : Tape and Reel
Mechanical Characteristics
Applications
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
Portable Instrumentation
Digital Lines
Tablet PC
Nominal Dimensions
0.62
Schematic
0.22
0.32
1
2
0.16
0.355 BSC
0.25
Nominal Dimensions (mm)
2/6/2015
1
SLP0603P2X3A (Bottom View)
www.semtech.com
uClamp3311Z
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Peak Pulse Power (tp = 8/20
μ
s)
Maximum Peak Pulse Current (tp = 8/20
μ
s)
ESD per IEC 61000-4-2 (Air)
1
ESD per IEC 61000-4-2 (Contact)
1
Operating Temperature
Storage Temperature
Symbol
P
p k
I
p p
V
ESD
T
J
T
STG
Value
30
4
+/- 16
+/- 14
-40 to +85
-55 to +150
Units
Watts
Amps
kV
°C
°C
Electrical Characteristics (T=25
o
C)
Parameter
Reverse Stand-Off Voltage
Punch-Through Voltage
Snap-Back Voltage
Reverse Leakage Current
Clamping Voltage
Clamping Voltage
Clamping Voltage
Dynamic Resistance
2, 3
Junction Capacitance
Symbol
V
RWM
V
PT
V
SB
I
R
V
C
VC
V
C
R
D
C
j
I
PT
= 50
μ
A
I
SB
= 50mA
V
RWM
= 3.3V
I
PP
= 1A, tp = 8/20
μ
s
I
PP
= 3A, tp = 8/20
μ
s
I
PP
= 4A, tp = 8/20
μ
s
tp = 100ns
I/O pin to Gnd
V
R
= 0V, f = 1MHz
0.21
6
9
3.65
2.8
0.001
0.05
5.5
6.5
7.5
4
Conditions
Minimum
Typical
Maximum
3.3
4.4
Units
V
V
V
μ
A
V
V
V
Ohms
pF
Notes
1)ESD gun return path connected to ESD ground reference plane.
2)Transmission Line Pulse Test (TLP) Settings: t
p
= 100ns, t
r
= 0.2ns, I
TLP
and V
TLP
averaging window: t
1
= 70ns to t
2
= 90ns.
3) Dynamic resistance calculated from I
TLP
= 4A to I
TLP
= 16A
©
2015 Semtech Corporation
2
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uClamp3311Z
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
1000
T
A
= 25 C
O
Clamping Voltage vs. Peak Pulse Current (tp=8/20us)
7
6
Clamping Voltage - V
C
(V)
5
4
3
2
1
0
0
1
2
3
Peak Pulse Current - I
PP
(A)
4
5
Peak Pulse Power - P
PP
(W)
100
10
DR040412-40
1
0.1
1
10
100
Pulse Duration - tp (µs)
Waveform
Parameters:
tr = 8μs
td = 20μs
Normalized Junction Capacitance vs. Reverse Voltage
1.6
1.4
1.2
C
J
(V
R
) / C
J
(V
R
=0)
1
0.8
0.6
0.4
0.2
0
0
0.5
1
1.5
2
2.5
Reverse Voltage - V
R
(V)
f = 1 MHz
3
3.5
TLP Characteristic
25
Transmission Line Pulse Test (TLP)
Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
20
TLP Current (A)
15
10
5
0
0
2
4
6
8
10
12
14
16
TLP Voltage (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
35
30
Clamping Voltage (V)
25
20
15
10
5
0
-10
0
10
20
30
40
Time (ns)
50
60
70
80
-20
1.00E+04
-10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected for
50 Ohm, 20dB attenuator. ESD gun return
path connected to ESD ground plane
Typical Insertion Loss (S21)
30KHz to 3GhZ
5
0
-3dB
977MHz
-5
-15
1.00E+05
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+10
©
2015 Semtech Corporation
3
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uClamp3311Z
PROTECTION PRODUCTS
Applications Information
Device Connection Options
The
μClamp3311Z
is designed to protect one data line
operating up to 3.3 volts. It will present a high
impedance to the protected line up to 3.3 volts. It will
“turn on” when the line voltage exceeds 3.5 volts. The
device is bidirectional and may be used on lines where
the signal polarity is above and below ground. These
devices are not recommended for use on DC power
supply lines due to their snap-back voltage
characteristic.
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aper ture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
R ecommendation
0.272
Circuit Diagram
Stencil Aperture
Mounting Pad
Package
0.175
0.250
Laser cut, Electro-polished
Rectangular with rounded
corners
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
0.298
0.270
Recommended Mounting Pattern
©
2015 Semtech Corporation
4
www.semtech.com
uClamp3311Z
PROTECTION PRODUCTS
Outline Drawing - SLP0603P2X3A
A
D
B
DIMENSIONS
MILLIMETERS
DIM
MIN NOM MAX
A
A1
b
D
E
e
L
N
aaa
bbb
E
TOP VIEW
0.235 0.25 0.265
0.000 0.02 0.025
0.22 0.24
0.20
0.585 0.62 0.655
0.285 0.32 0.355
0.355 BSC
0.16 0.18
0.14
2
0.08
0.10
A
aaa C
A1
e/2
bxN
C A B
C
SEATING
PLANE
bbb
Pin 1 ID
R 0.060mm
e
2xL
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP0603P2X3A
DIMENSIONS
DIM
C
G
X
Y
Z
MILLIMETERS
(0.425)
0.175
0.270
0.250
0.675
(C)
G
Z
Y
X
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
©
2015 Semtech Corporation
5
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