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2036-47-SM-RP

产品描述Gas Discharge Tubes - GDTs / Gas Plasma Arrestors GAS DISCHARGE TUBE
产品类别无线/射频/通信    电信电路   
文件大小219KB,共3页
制造商Bourns
官网地址http://www.bourns.com
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2036-47-SM-RP概述

Gas Discharge Tubes - GDTs / Gas Plasma Arrestors GAS DISCHARGE TUBE

2036-47-SM-RP规格参数

参数名称属性值
是否Rohs认证不符合
Reach Compliance Codecompliant
Factory Lead Time6 weeks
JESD-30 代码X-XXSS-X3
功能数量1
端子数量3
最高工作温度85 °C
最低工作温度-55 °C
封装主体材料UNSPECIFIED
封装形状UNSPECIFIED
封装形式SPECIAL SHAPE
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
表面贴装NO
电信集成电路类型SURGE PROTECTION CIRCUIT
温度等级OTHER
端子形式UNSPECIFIED
端子位置UNSPECIFIED
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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*R
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
n
Balanced Mini-TRIGARD™ Series
(5 mm diameter, 7.3 mm length)
n
Ideal for board level protection of
broadband circuits
n
Leadless, surface mount for economical
assembly
n
Stable breakdown throughout life
M
PL
IA
NT
n
High surge current rating, low insertion loss
n
UL Recognized
n
RoHS compliant* version available
Bourns now offers a surface mount (SM) 3-electrode Gas Discharge Tube (GDT) surge protection device. The industry-leading quality
and features of the Bourns
®
miniature 2036 TRIGARD™ series GDT continues in this new SM version for “pick and place”
manufacturing techniques. The 2036 SM device is ideal for board level protection of high bandwidth applications such as xDSL,
cable broadband and high speed Ethernet, due to its high energy handling capability, long and stable life performance and low
capacitance of less than 2 pF. Bourns subminiature family of GDTs measure only 5 mm in diameter and are the smallest high
performance GDTs in the telecom industry. Bourns
®
GDTs are designed to prevent damage from transient disturbances by acting as
a “crowbar” in creating a short-to-ground circuit during conduction. When a voltage transient surge exceeds the defined breakdown
voltage level of the GDT, the device becomes ionized and conduction takes place within a fraction of a microsecond. When the surge
passes and system voltage returns to normal levels, the GDT returns to its high-impedance (off) state.
Test Methods per ITU-T K.12, IEEE C62.31 and IEC 61643-311 GDT standards.
Characteristic
DC Sparkover ±20 % @ 100 V/s
Impulse Sparkover
(1)
100 V/µs
1000 V/µs
Characteristic
DC Sparkover ±20 % @ 100 V/s
Impulse Sparkover
(1)
100 V/µs
1000 V/µs
(1)
*R
oH
S
2036-xx-SM Precision Gas Discharge Tube Surge Protector
CO
2036-07
75 V
250 V
525 V
2036-30
300 V
500 V
650 V
2036-09
90 V
250 V
550 V
2036-35
350 V
600 V
750 V
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Characteristics
LE
AD
F
RE
E
Model No.
2036-15
2036-20
150 V
200 V
350 V
500 V
425 V
575 V
2036-23
230 V
450 V
600 V
2036-47
470 V
750 V
950 V
2036-25
250 V
475 V
625 V
2036-60
600 V
850 V
1100 V
Model No.
2036-40
2036-42
400 V
420 V
650 V
825 V
675 V
850 V
75 ns
10
10
Ω
70 V
10 V
0.5 A
2 pF
150 ms
Impulse Sparkover voltage is defined as typical values of distribution.
Impulse Transverse Delay ............................... 1000 V/μs..........................................................<
Insulation Resistance (IR) ............................... 100 V (50 V for Model 2036-07 & 2036-09) ......>
Glow Voltage ................................................... 10 mA................................................................~
Arc Voltage ...................................................... 1 A .....................................................................~
Glow-Arc Transition Current .......................................................................................................<
Capacitance..................................................... 1 MHz ...............................................................<
DC Holdover Voltage
(2)
................................... >135 V, (52 V for Model 2036-07, & -09, ..........<
80 V for Model 2036-15)
Impulse Discharge Current .............................. 20000 A, 8/20 µs
(3)
...........................................
10000 A, 8/20 µs ...............................................>
200 A, 10/1000 µs ............................................>
2000 A, 10/350 µs .............................................
200 A, 10/700 µs ..............................................>
Alternating Discharge Current ......................... 20 Arms, 1 s
2
....................................................
10 Arms, 1 s ......................................................>
Storage Temperature ..................................................................................................................
Operating Temperature...............................................................................................................
Climatic Category (IEC 60068-1)................................................................................................
1 operation minimum
10 operations
300 operations
1 operation
500 operations
1 operation minimum
10 operations
-55 to +105 °C
-55 to +105 °C
55/105/21
Notes:
• UL Recognized component, UL File E153537.
• No model number marking on tube; date code and voltage only: month year digits, xxxV (e.g. 0209 400V).
• The rated discharge current for Mini-TRIGARD™ GDTs is the total current equally divided between each line to ground.
• Surface Mount (SM) parts may show a temporary increase in DCBD after the solder reflow process. Most devices will recover within 24
hours time. It should be noted that there is no quality defect nor change in protection levels during the temporary change in DCBD.
• Sparkover limits after life ±25 % (-25 %,+30 % for Model 2036-07, 2036-09 and 2036-60), IR >10
8
Ω.
• Operating characteristics per RUS PE-80 and Telcordia GR 1361 available on request.
• Line to Line voltage is approximately 1.8 to 2 times the stated Line to Ground breakdown voltage.
• At delivery AQL 0.65 Level II, DIN ISO 2859.
• Bourns recommends reflowing surface mount devices per IPC/JEDEC J-STD-020 rev D.
(2)
Network applied.
(3)
DC Sparkover may exceed ±25 % but will continue to protect without venting.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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