电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

15SMC160C

产品描述ESD Suppressors / TVS Diodes 1.5SMC160C
产品类别电路保护   
文件大小990KB,共6页
制造商Littelfuse
官网地址http://www.littelfuse.com
下载文档 详细参数 全文预览

15SMC160C在线购买

供应商 器件名称 价格 最低购买 库存  
15SMC160C - - 点击查看 点击购买

15SMC160C概述

ESD Suppressors / TVS Diodes 1.5SMC160C

15SMC160C规格参数

参数名称属性值
产品种类
Product Category
ESD Suppressors / TVS Diodes
制造商
Manufacturer
Littelfuse
RoHSDetails
PolarityBidirectional
端接类型
Termination Style
SMD/SMT
Breakdown Voltage152 V
Working Voltage136 V
Clamping Voltage219 V
封装 / 箱体
Package / Case
DO-214AB
Pd-功率耗散
Pd - Power Dissipation
1.5 kW
最小工作温度
Minimum Operating Temperature
- 65 C
最大工作温度
Maximum Operating Temperature
+ 150 C
系列
Packaging
Reel
工作温度范围
Operating Temperature Range
- 65 C to + 150 C
工厂包装数量
Factory Pack Quantity
3000
单位重量
Unit Weight
0.007408 oz

文档预览

下载PDF文档
Transient Voltage Suppression Diodes
Surface Mount – 1500W > 1.5SMC series
1.5SMC Series
Uni-directional
Bi-directional
Descriptios
RoHS
Pb
e3
The 1.5SMC series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• 1500W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Excellent clamping
capability
• Low incremental surge
resistance
• Typical I
R
less than 1μA
when V
BR
min>12V
• For surface mounted
applications to optimize
board space
• Low profile package
• Built-in strain relief
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
Applications
TVS devices are ideal for the protection of I/O Interfaces,
V
CC
bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic
applications.
Additional Infomarion
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Glass passivated chip
junction
• High temperature
to reflow soldering
guaranteed: 260°C/40sec
• V
BR
@ T
J
= V
BR
@25°C
x (1+
α
T x (T
J
- 25))
(
α
T:Temperature
Coefficient, typical value
is 0.1%)
• Plastic package is
flammability rated V-0 per
Underwriters Laboratories
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260
°
C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD-
609A.01)
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Parameter
Peak Pulse Power Dissipation at
T
A
=25ºC by 10/1000µs Waveform
(Fig.2)(Note 1), (Note 2), (Note 5)
Power Dissipation on Infinite Heat
Sink at T
L
=50
O
C
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only (Note 4)
Operating Temperature Range
Storage Temperature Range
Typical Thermal Resistance Junction
to Lead
Typical Thermal Resistance Junction
to Ambient
Symbol
P
PPM
P
D
I
FSM
V
F
T
J
T
STG
R
θJL
R
θJA
Value
1500
6.5
200
3.5/5.0
-65 to 150
-65 to 175
15
75
Unit
W
W
A
V
°C
°C
°C/W
°C/W
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above T
J
(initial) =25
O
C per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
4. V
F
< 3.5V for single die parts and V
F
< 5.0V for stacked-die parts.
5. The P
PPM
of stacked-die parts is 2000W and please contact littelfuse for the detail
stacked-die parts.
Functional Diagram
Bi-directional
Cathode
Uni-directional
Anode
Datasheet
Resources
Samples
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
分享lpc1788nandflsh移植文件系统资料
主控:LPC1788 NADFLSH:是来自三星的:K9F1G08UOC,128M 文件系统是使用:yaffs文件系统 YAFFS是第一个专门为NAND Flash存储器设计的嵌入式文件系统,适用于大容量的存储设备。是基于日志 ......
cxmdz NXP MCU
带你走进嵌入式ARM MMU神秘的内部世界
ARM MMU页表框架file:///C:\Users\郭晓娟\AppData\Local\Temp\ksohtml\wpsF282.tmp.png 先上一张arm mmu的页表结构的通用框图(以下的论述都由该图来逐渐展开): file:///C:\Users\郭晓娟\AppD ......
jingcheng ARM技术
求助!串口发送文件问题?
我在写bootloader,在串口这遇到点麻烦,各位大牛给点意见 我将bootloader分为两个阶段,现在第一阶段差不多完成了,就差实现从串口烧录第二阶段到flash的功能 思路是这样的,在kermit下send b ......
烽火寒轩 嵌入式系统
专业电脑主板抄板,手机板抄板,天元世纪承接各种电路板抄板业务
本帖最后由 jameswangsynnex 于 2015-3-3 19:58 编辑 天元世纪pcb设计工作室成立于2004年,公司在信息技术软硬件产品及其功能模块的技术研究、技术解析与实现、核心技术的研究以及反向研究等方 ......
rain 消费电子
TI 无晶振SimpleLink™无线MCU助您轻松实现无晶体化
半导体行业的创新往往是在现有产品的基础上加以改进,但在设计方面则追求“少即是多”的理念。在德州仪器,我们研究了SimpleLinkTM无线MCU周围的电子材料构建(BOM),并希望在不 ......
alan000345 微控制器 MCU
凌阳16位CPU能否支持IDLE/Sleep模式?
如题,谢谢...
gaoyuan78 嵌入式系统

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 81  1720  2817  565  709  2  35  57  12  15 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved