MJD340 (NPN),
MJD350 (PNP)
High Voltage Power
Transistors
DPAK for Surface Mount Applications
Designed for line operated audio output amplifier, switchmode
power supply drivers and other switching applications.
Features
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•
Lead Formed for Surface Mount Applications in Plastic Sleeves
•
•
•
•
(No Suffix)
Electrically Similar to Popular MJE340 and MJE350
Epoxy Meets UL 94 V−0 @ 0.125 in
NJV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SILICON
POWER TRANSISTORS
0.5 AMPERE
300 VOLTS, 15 WATTS
COLLECTOR
2, 4
COLLECTOR
2, 4
1
BASE
3
EMITTER
1
BASE
3
EMITTER
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current − Continuous
Collector Current − Peak
Total Power Dissipation
@ T
C
= 25°C
Derate above 25°C
Total Power Dissipation (Note 1)
@ T
A
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
ESD − Human Body Model
MJD340 (NPN)
MJD350 (PNP)
ESD − Machine Model
MJD340 (NPN)
MJD350 (PNP)
MM
M4
M4
Symbol
V
CEO
V
CB
V
EB
I
C
I
CM
P
D
15
0.12
P
D
1.56
0.012
T
J
, T
stg
HBM
3B
2
V
−65 to +150
W
W/°C
°C
V
W
W/°C
Max
300
300
3
0.5
0.75
Unit
Vdc
Vdc
Vdc
Adc
Adc
4
1 2
3
DPAK
CASE 369C
STYLE 1
MARKING DIAGRAM
AYWW
J3x0G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
A
Y
WW
J3x0
G
=
=
=
=
Assembly Location
Year
Work Week
Device Code
x= 4 or 5
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
©
Semiconductor Components Industries, LLC, 2016
1
June, 2016 − Rev. 12
Publication Order Number:
MJD340/D
MJD340 (NPN), MJD350 (PNP)
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient (Note 2)
Leading Temperature for Soldering Purpose
Symbol
R
qJC
R
qJA
T
L
Max
8.33
80
260
Unit
°C/W
°C/W
°C
2. These ratings are applicable when surface mounted on the minimum pad sizes recommended.
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ELECTRICAL CHARACTERISTICS
(T
C
= 25_C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 3)
(I
C
= 1 mA, I
B
= 0)
Collector Cutoff Current
(V
CB
= 300 V, I
E
= 0)
Emitter Cutoff Current
(V
BE
= 3 V, I
C
= 0)
V
CEO(sus)
I
CEO
I
EBO
V
300
−
−
−
mA
mA
0.1
0.1
ON CHARACTERISTICS
(Note 3)
DC Current Gain
(I
C
= 50 mA, V
CE
= 10 V)
h
FE
−
30
−
−
240
1
Collector−Emitter Saturation Voltage
(I
C
= 100 mA, I
B
= 10 mA)
Base−Emitter On Voltage
(I
C
= 1 A, V
CE
= 10 V)
V
CE(sat)
V
BE(on)
V
V
1.5
DYNAMIC CHARACTERISTICS
Current Gain − Bandwidth Product
(I
C
= 50 mA, V
CE
= 10 V, f = 10 MHz)
f
T
MHz
10
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width
≤
300
ms,
Duty Cycle
≤
2%.
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2
MJD340 (NPN), MJD350 (PNP)
TYPICAL CHARACTERISTICS
MJD340
300
200
hFE , DC CURRENT GAIN
T
J
= 150°C
+100°C
+ 25°C
30
20
- 55°C
V
CE
= 2 V
V
CE
= 10 V
100
70
50
10
1
2
3
5
7
10
20
30
50
I
C
, COLLECTOR CURRENT (mAdc)
70
100
200
300
500
Figure 1. DC Current Gain
MJD340
1
T
J
= 25°C
0.8
V, VOLTAGE (VOLTS)
V
BE(sat)
@ I
C
/I
B
= 10
V
BE
@ V
CE
= 10 V
0.6
0.4
V
CE(sat)
@ I
C
/I
B
= 10
0.2
I
C
/I
B
= 5
0
10
20
30
50
100
200 300
I
C
, COLLECTOR CURRENT (mA)
500
Figure 2. “On” Voltages
MJD350
200
1
T
J
= 150°C
25°C
V, VOLTAGE (VOLTS)
1
T
J
= 25°C
0.8
V
BE(sat)
@ I
C
/I
B
= 10
0.6
MJD350
hFE , DC CURRENT GAIN
100
70
50
30
20
- 55°C
V
BE
@ V
CE
= 10 V
0.4
I
C
/I
B
= 10
V
CE
= 2 V
V
CC
= 10 V
5
7
10
20 30
200 300
50 70 100
I
C
, COLLECTOR CURRENT (mA)
500
0.2
V
CE(sat)
0
5
7
10
20 30
50 70 100
I
C
, COLLECTOR CURRENT (mA)
I
C
/I
B
= 5
200 300 500
10
Figure 3. DC Current Gain
Figure 4. “On” Voltages
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3
MJD340 (NPN), MJD350 (PNP)
1
0.7
0.5
r(t), TRANSIENT THERMAL
RESISTANCE (NORMALIZED)
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.01
D = 0.5
0.2
0.1
0.05
0.01
R
qJC(t)
= r(t) R
qJC
R
qJC
= 8.33°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
1
T
J(pk)
- T
C
= P
(pk)
q
JC(t)
P
(pk)
t
1
t
2
DUTY CYCLE, D = t
1
/t
2
SINGLE PULSE
0.02 0.03 0.05
0.1
0.2 0.3
0.5
1
2 3
5
t, TIME (ms)
10
20
30
50
100
200 300
500
1k
Figure 5. Thermal Response
1000
500
300
200
100
ms
500
ms
1 ms
100
50
30
20
10
5
3
2
1
10
20 30
50 70 100
200 300
500 700 1000
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
dc
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I
C
− V
CE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 6 is based on T
J(pk)
= 150_C; T
C
is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T
J(pk)
≤
150_C. T
J(pk)
may be calculated from the data in
Figure 5. At high case temperatures, thermal limitations will
reduce the power that can be handled to values less than the
limitations imposed by second breakdown.
IC, COLLECTOR CURRENT (mA)
Figure 6. Active Region Safe Operating Area
T
A
T
C
2.5 25
PD, POWER DISSIPATION (WATTS)
2 20
1.5 15
T
A
1 10
T
C
0.5
5
0
0
25
50
75
100
125
150
T, TEMPERATURE (°C)
Figure 7. Power Derating
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MJD340 (NPN), MJD350 (PNP)
ORDERING INFORMATION
Device
MJD340G
MJD340RLG
MJD340T4G
NJVMJD340T4G
MJD350G
MJD350T4G
NJVMJD350T4G
Package
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
Shipping
†
75 Units / Rail
1,800 / Tape & Reel
2,500 / Tape & Reel
2,500 / Tape & Reel
75 Units / Rail
2,500 / Tape & Reel
2,500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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