LatticeECP3 Family Data Sheet
DS1021 Version 02.8EA, March 2015
LatticeECP3 Family Data Sheet
Introduction
February 2012
Data Sheet DS1021
Features
Higher Logic Density for Increased System
Integration
• 17K to 149K LUTs
• 116 to 586 I/Os
Embedded SERDES
• 150 Mbps to 3.2 Gbps for Generic 8b10b, 10-bit
SERDES, and 8-bit SERDES modes
• Data Rates 230 Mbps to 3.2 Gbps per channel
for all other protocols
• Up to 16 channels per device: PCI Express,
SONET/SDH, Ethernet (1GbE, SGMII, XAUI),
CPRI, SMPTE 3G and Serial RapidIO
• Dedicated read/write levelling functionality
• Dedicated gearing logic
• Source synchronous standards support
— ADC/DAC, 7:1 LVDS, XGMII
— High Speed ADC/DAC devices
• Dedicated DDR/DDR2/DDR3 memory with DQS
support
• Optional Inter-Symbol Interference (ISI)
correction on outputs
Programmable sysI/O™ Buffer Supports
Wide Range of Interfaces
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
On-chip termination
Optional equalization filter on inputs
LVTTL and LVCMOS 33/25/18/15/12
SSTL 33/25/18/15 I, II
HSTL15 I and HSTL18 I, II
PCI and Differential HSTL, SSTL
LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS
Dedicated bank for configuration I/Os
SPI boot flash interface
Dual-boot images supported
Slave SPI
TransFR™ I/O for simple field updates
Soft Error Detect embedded macro
IEEE 1149.1 and IEEE 1532 compliant
Reveal Logic Analyzer
ORCAstra FPGA configuration utility
On-chip oscillator for initialization & general use
1.2 V core power supply
sysDSP™
• Fully cascadable slice architecture
• 12 to 160 slices for high performance multiply
and accumulate
• Powerful 54-bit ALU operations
• Time Division Multiplexing MAC Sharing
• Rounding and truncation
• Each slice supports
— Half 36x36, two 18x18 or four 9x9 multipliers
— Advanced 18x36 MAC and 18x18 Multiply-
Multiply-Accumulate (MMAC) operations
Flexible Device Configuration
Flexible Memory Resources
• Up to 6.85Mbits sysMEM™ Embedded Block
RAM (EBR)
• 36K to 303K bits distributed RAM
System Level Support
sysCLOCK Analog PLLs and DLLs
• Two DLLs and up to ten PLLs per device
Pre-Engineered Source Synchronous I/O
• DDR registers in I/O cells
Table 1-1. LatticeECP3™ Family Selection Guide
ECP3-17
LUTs (K)
17
sysMEM Blocks (18 Kbits)
38
Embedded Memory (Kbits)
700
Distributed RAM Bits (Kbits)
36
18 x 18 Multipliers
24
SERDES (Quad)
1
PLLs/DLLs
2/2
Packages and SERDES Channels/ I/O Combinations
328 csBGA (10 x 10 mm)
2 / 116
256 ftBGA (17 x 17 mm)
4 / 133
484 fpBGA (23 x 23 mm)
4 / 222
672 fpBGA (27 x 27 mm)
1156 fpBGA (35 x 35 mm)
Device
ECP3-35
33
72
1327
68
64
1
4/2
ECP3-70
67
240
4420
145
128
3
10 / 2
ECP3-95
92
240
4420
188
128
3
10 / 2
ECP3-150
149
372
6850
303
320
4
10 / 2
4 / 133
4 / 295
4 / 310
4 / 295
8 / 380
12 / 490
4 / 295
8 / 380
12 / 490
8 / 380
16 / 586
© 2012 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1-1
DS1021
Introduction_01.6
Introduction
LatticeECP3 Family Data Sheet
Introduction
The LatticeECP3™ (EConomy Plus Third generation) family of FPGA devices is optimized to deliver high perfor-
mance features such as an enhanced DSP architecture, high speed SERDES and high speed source synchronous
interfaces in an economical FPGA fabric. This combination is achieved through advances in device architecture
and the use of 65 nm technology making the devices suitable for high-volume, high-speed, low-cost applications.
The LatticeECP3 device family expands look-up-table (LUT) capacity to 149K logic elements and supports up to
586 user I/Os. The LatticeECP3 device family also offers up to 320 18 x 18 multipliers and a wide range of parallel
I/O standards.
The LatticeECP3 FPGA fabric is optimized with high performance and low cost in mind. The LatticeECP3 devices
utilize reconfigurable SRAM logic technology and provide popular building blocks such as LUT-based logic, distrib-
uted and embedded memory, Phase Locked Loops (PLLs), Delay Locked Loops (DLLs), pre-engineered source
synchronous I/O support, enhanced sysDSP slices and advanced configuration support, including encryption and
dual-boot capabilities.
The pre-engineered source synchronous logic implemented in the LatticeECP3 device family supports a broad
range of interface standards, including DDR3, XGMII and 7:1 LVDS.
The LatticeECP3 device family also features high speed SERDES with dedicated PCS functions. High jitter toler-
ance and low transmit jitter allow the SERDES plus PCS blocks to be configured to support an array of popular
data protocols including PCI Express, SMPTE, Ethernet (XAUI, GbE, and SGMII) and CPRI. Transmit Pre-empha-
sis and Receive Equalization settings make the SERDES suitable for transmission and reception over various
forms of media.
The LatticeECP3 devices also provide flexible, reliable and secure configuration options, such as dual-boot capa-
bility, bit-stream encryption, and TransFR field upgrade features.
The Lattice Diamond™ and ispLEVER
®
design software allows large complex designs to be efficiently imple-
mented using the LatticeECP3 FPGA family. Synthesis library support for LatticeECP3 is available for popular logic
synthesis tools. Diamond and ispLEVER tools use the synthesis tool output along with the constraints from its floor
planning tools to place and route the design in the LatticeECP3 device. The tools extract the timing from the routing
and back-annotate it into the design for timing verification.
Lattice provides many pre-engineered IP (Intellectual Property) modules for the LatticeECP3 family. By using these
configurable soft core IPs as standardized blocks, designers are free to concentrate on the unique aspects of their
design, increasing their productivity.
1-2
LatticeECP3 Family Data Sheet
Architecture
June 2013
Data Sheet DS1021
Architecture Overview
Each LatticeECP3 device contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Inter-
spersed between the rows of logic blocks are rows of sysMEM™ Embedded Block RAM (EBR) and rows of sys-
DSP™ Digital Signal Processing slices, as shown in Figure 2-1. The LatticeECP3-150 has four rows of DSP slices;
all other LatticeECP3 devices have two rows of DSP slices. In addition, the LatticeECP3 family contains SERDES
Quads on the bottom of the device.
There are two kinds of logic blocks, the Programmable Functional Unit (PFU) and Programmable Functional Unit
without RAM (PFF). The PFU contains the building blocks for logic, arithmetic, RAM and ROM functions. The PFF
block contains building blocks for logic, arithmetic and ROM functions. Both PFU and PFF blocks are optimized for
flexibility, allowing complex designs to be implemented quickly and efficiently. Logic Blocks are arranged in a two-
dimensional array. Only one type of block is used per row.
The LatticeECP3 devices contain one or more rows of sysMEM EBR blocks. sysMEM EBRs are large, dedicated
18Kbit fast memory blocks. Each sysMEM block can be configured in a variety of depths and widths as RAM or
ROM. In addition, LatticeECP3 devices contain up to two rows of DSP slices. Each DSP slice has multipliers and
adder/accumulators, which are the building blocks for complex signal processing capabilities.
The LatticeECP3 devices feature up to 16 embedded 3.2 Gbps SERDES (Serializer / Deserializer) channels. Each
SERDES channel contains independent 8b/10b encoding / decoding, polarity adjust and elastic buffer logic. Each
group of four SERDES channels, along with its Physical Coding Sub-layer (PCS) block, creates a quad. The func-
tionality of the SERDES/PCS quads can be controlled by memory cells set during device configuration or by regis-
ters that are addressable during device operation. The registers in every quad can be programmed via the
SERDES Client Interface (SCI). These quads (up to four) are located at the bottom of the devices.
Each PIC block encompasses two PIOs (PIO pairs) with their respective sysI/O buffers. The sysI/O buffers of the
LatticeECP3 devices are arranged in seven banks, allowing the implementation of a wide variety of I/O standards.
In addition, a separate I/O bank is provided for the programming interfaces. 50% of the PIO pairs on the left and
right edges of the device can be configured as LVDS transmit/receive pairs. The PIC logic also includes pre-engi-
neered support to aid in the implementation of high speed source synchronous standards such as XGMII, 7:1
LVDS, along with memory interfaces including DDR3.
The LatticeECP3 registers in PFU and sysI/O can be configured to be SET or RESET. After power up and the
device is configured, it enters into user mode with these registers SET/RESET according to the configuration set-
ting, allowing the device entering to a known state for predictable system function.
Other blocks provided include PLLs, DLLs and configuration functions. The LatticeECP3 architecture provides two
Delay Locked Loops (DLLs) and up to ten Phase Locked Loops (PLLs). The PLL and DLL blocks are located at the
end of the EBR/DSP rows.
The configuration block that supports features such as configuration bit-stream decryption, transparent updates
and dual-boot support is located toward the center of this EBR row. Every device in the LatticeECP3 family sup-
ports a sysCONFIG™ port located in the corner between banks one and two, which allows for serial or parallel
device configuration.
In addition, every device in the family has a JTAG port. This family also provides an on-chip oscillator and soft error
detect capability. The LatticeECP3 devices use 1.2 V as their core voltage.
© 2013 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
2-1
DS1021
Architecture_02.1
Architecture
LatticeECP3 Family Data Sheet
Figure 2-1. Simplified Block Diagram, LatticeECP3-35 Device (Top Level)
sysIO
Bank 0
sysIO
Bank 1
Configuration Logic:
Dual-boot, Encryption
and Transparent Updates
JTAG
On-chip Oscillator
sysIO
Bank
7
Enhanced DSP
Slices:
Multiply,
Accumulate and ALU
sysIO
Bank
2
Pre-engineered Source
Synchronous Support:
DDR3 -
800
Mbps
Generic - Up to 1 Gbps
sysCLOCK
PLLs & DLLs:
Frequency Synthesis
and Clock Alignment
Flexible sysIO:
LVCMOS, HSTL,
SSTL, LVDS
Up to 486 I/Os
sysMEM Block
RAM:
18 Kbit
Flexible Routing:
Optimized for speed
and routability
Programmable
Function Units:
Up to 149K LUTs
sysIO Bank 6
SERDES/PCS SERDES/PCS
CH 3
CH 2
SERDES/PCS SERDES/PCS
CH 1
CH 0
sysIO Bank 3
3.2 Gbps SERDES
Note:
There is no Bank 4 or Bank 5 in LatticeECP3 devices.
PFU Blocks
The core of the LatticeECP3 device consists of PFU blocks, which are provided in two forms, the PFU and PFF.
The PFUs can be programmed to perform Logic, Arithmetic, Distributed RAM and Distributed ROM functions. PFF
blocks can be programmed to perform Logic, Arithmetic and ROM functions. Except where necessary, the remain-
der of this data sheet will use the term PFU to refer to both PFU and PFF blocks.
Each PFU block consists of four interconnected slices numbered 0-3 as shown in Figure 2-2. Each slice contains
two LUTs. All the interconnections to and from PFU blocks are from routing. There are 50 inputs and 23 outputs
associated with each PFU block.
2-2
微控制器 MCU
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