Analog to Digital Converters - ADC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SON |
| 包装说明 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEED-3, TDFN-10 |
| 针数 | 10 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | 1.8 V |
| 最小模拟输入电压 | -1.8 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-XDSO-N10 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 最大线性误差 (EL) | 0.0244% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC10,.12,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 1.8/3.3 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.3125 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 1.6 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| MAX1393MTB-T | MAX1396MUB-T | MAX1396MTB-T | MAX1396MUB | |
|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SON | TSSOP | SON | TSSOP |
| 包装说明 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEED-3, TDFN-10 | MO-187C-BA, MICRO SOP-10 | 3 X 3 MM, 0.80 MM HEIGHT, MO-229WEED-3, TDFN-10 | MO-187C-BA, MICRO SOP-10 |
| 针数 | 10 | 10 | 10 | 10 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大模拟输入电压 | 1.8 V | 3.65 V | 3.6 V | 3.65 V |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-XDSO-N10 | S-PDSO-G10 | S-XDSO-N10 | S-PDSO-G10 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm |
| 最大线性误差 (EL) | 0.0244% | 0.0244% | 0.0244% | 0.0244% |
| 模拟输入通道数量 | 1 | 2 | 2 | 2 |
| 位数 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | HVSON | TSSOP | HVSON | TSSOP |
| 封装等效代码 | SOLCC10,.12,20 | TSSOP10,.19,20 | SOLCC10,.12,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 245 | NOT SPECIFIED | 245 | 240 |
| 电源 | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.3125 MHz | 0.3125 MHz | 0.3125 MHz | 0.3125 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 0.8 mm | 1.1 mm | 0.8 mm | 1.1 mm |
| 标称供电电压 | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
| 湿度敏感等级 | 1 | - | 1 | 1 |
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