FPGA - Configuration Memory IC - Ser. Config Mem Flash 4Mb 66 MHz
参数名称 | 属性值 |
产品种类 Product Category | FPGA - Configuration Memory |
制造商 Manufacturer | Altera (Intel) |
RoHS | Details |
Memory Type | Flash |
Memory Size | 4 Mbit |
Maximum Operating Frequency | 66 MHz |
工作电源电压 Operating Supply Voltage | 3.3 V |
最小工作温度 Minimum Operating Temperature | 0 C |
最大工作温度 Maximum Operating Temperature | + 70 C |
安装风格 Mounting Style | SMD/SMT |
封装 / 箱体 Package / Case | PQFP-100 |
系列 Packaging | Tray |
工作电源电流 Operating Supply Current | 50 uA |
工厂包装数量 Factory Pack Quantity | 66 |
电源电压-最大 Supply Voltage - Max | 3.6 V |
电源电压-最小 Supply Voltage - Min | 3 V |
单位重量 Unit Weight | 0.419760 oz |
EPCE4QC100N | EPC16UC88 | EPC8QI100N | EPC4QC100 | EPCE8QC100N | EPCE16QC100N | EPC8QC100 | EPC16UI88AA | |
---|---|---|---|---|---|---|---|---|
描述 | FPGA - Configuration Memory IC - Ser. Config Mem Flash 4Mb 66 MHz | Translation - Voltage Levels 2-Bit Bi-Directional Voltage-Level-Trans | FPGA - Configuration Memory IC - Ser. Config Mem Flash 8Mb 50 MHz | Switching Voltage Regulators 5.5 to 36V Input 3A Step Dwn Converter | FPGA - Configuration Memory IC - Ser. Config Mem Flash 8Mb 50 MHz | FPGA - Configuration Memory IC - Ser. Config Mem Flash 16Mb 33 MHz | FPGA - Configuration Memory IC - Ser. Config Mem Flash 8Mb 50 MHz | FPGA - Configuration Memory IC - Ser. Config Mem Flash 16Mb 33 MHz |
是否无铅 | - | 含铅 | 不含铅 | 含铅 | - | - | 含铅 | 含铅 |
是否Rohs认证 | - | 不符合 | 符合 | 不符合 | - | - | 不符合 | 不符合 |
零件包装代码 | - | BGA | QFP | QFP | - | - | QFP | BGA |
包装说明 | - | MO-219, ULTRA FINE LINE, BGA-88 | PLASTIC, QFP-100 | PLASTIC, QFP-100 | - | - | PLASTIC, QFP-100 | UFBGA-88 |
针数 | - | 88 | 100 | 100 | - | - | 100 | 88 |
Reach Compliance Code | - | not_compliant | unknown | not_compliant | - | - | not_compliant | not_compliant |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 |
最大时钟频率 (fCLK) | - | 66.7 MHz | 66.7 MHz | 66.7 MHz | - | - | 66.7 MHz | 66.7 MHz |
JESD-30 代码 | - | R-PBGA-B88 | R-PQFP-G100 | R-PQFP-G100 | - | - | R-PQFP-G100 | R-PBGA-B88 |
JESD-609代码 | - | e0 | e3 | e0 | - | - | e0 | e0 |
长度 | - | 11 mm | 20 mm | 20 mm | - | - | 20 mm | 11 mm |
内存密度 | - | 16777216 bit | 8388608 bit | 4194304 bit | - | - | 8388608 bit | 16777216 bit |
内存集成电路类型 | - | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | - | - | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
内存宽度 | - | 16 | 16 | 16 | - | - | 16 | 16 |
湿度敏感等级 | - | 3 | 3 | 3 | - | - | 3 | 3 |
功能数量 | - | 1 | 1 | 1 | - | - | 1 | 1 |
端子数量 | - | 88 | 100 | 100 | - | - | 100 | 88 |
字数 | - | 1048576 words | 524288 words | 262144 words | - | - | 524288 words | 1048576 words |
字数代码 | - | 1000000 | 512000 | 256000 | - | - | 512000 | 1000000 |
工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 70 °C | 85 °C | 70 °C | - | - | 70 °C | 85 °C |
组织 | - | 1MX16 | 512KX16 | 256KX16 | - | - | 512KX16 | 1MX16 |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | LFBGA | QFP | QFP | - | - | QFP | LFBGA |
封装等效代码 | - | BGA88,8X12,32 | QFP100,.7X.9 | QFP100,.7X.9 | - | - | QFP100,.7X.9 | BGA88,8X12,32 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
封装形式 | - | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK | FLATPACK | - | - | FLATPACK | GRID ARRAY, LOW PROFILE, FINE PITCH |
并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | - | - | PARALLEL | PARALLEL |
电源 | - | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V | 3.3 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
座面最大高度 | - | 1.4 mm | 2.15 mm | 3.4 mm | - | - | 2.15 mm | 1.4 mm |
最大待机电流 | - | 0.00015 A | 0.00015 A | 0.00015 A | - | - | 0.00015 A | 0.00015 A |
最大压摆率 | - | 0.09 mA | 0.09 mA | 0.09 mA | - | - | 0.09 mA | 0.09 mA |
最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | - | - | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | - | - | 3 V | 3 V |
标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V | 3.3 V |
表面贴装 | - | YES | YES | YES | - | - | YES | YES |
技术 | - | CMOS | CMOS | CMOS | - | - | CMOS | CMOS |
温度等级 | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | - | - | COMMERCIAL | INDUSTRIAL |
端子面层 | - | Tin/Lead (Sn63Pb37) | Matte Tin (Sn) - annealed | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) |
端子形式 | - | BALL | GULL WING | GULL WING | - | - | GULL WING | BALL |
端子节距 | - | 0.8 mm | 0.65 mm | 0.65 mm | - | - | 0.65 mm | 0.8 mm |
端子位置 | - | BOTTOM | QUAD | QUAD | - | - | QUAD | BOTTOM |
类型 | - | NOR TYPE | NOR TYPE | NOR TYPE | - | - | NOR TYPE | NOR TYPE |
宽度 | - | 8 mm | 14 mm | 14 mm | - | - | 14 mm | 8 mm |
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