IDT74FCT16501AT/CT
FAST CMOS 18-BIT REGISTERED TRANSCEIVER
INDUSTRIAL TEMPERATURE RANGE
FAST CMOS
18-BIT REGISTERED
TRANSCEIVER
FEATURES:
•
•
•
•
•
•
•
•
•
0.5 MICRON CMOS Technology
High-speed, low-power CMOS replacement for ABT functions
Typical t
SK(o)
(Output Skew) < 250ps
Low input and output leakage
≤
1µA (max.)
ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
High drive outputs (–32mA I
OH
, 64mA I
OL
)
Power off disable outputs permit “live insertion”
Typical V
OLP
(Output Ground Bounce) < 1.0V at V
CC
= 5V,
T
A
= 25°C
Available in TSSOP package
IDT74FCT16501AT/CT
DESCRIPTION:
The FCT16501T 18-bit registered transceivers are built using advanced
dual metal CMOS technology. These high-speed, low-power 18-bit registered
bus transceivers combine D-type latches and D-type flip-flops to allow data flow
in transparent, latched and clocked modes. Data flow in each direction is
controlled by output-enable (OEAB and
OEBA),
latch enable (LEAB and LEBA)
and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device
operates in transparent mode when LEAB is high. When LEAB is low, the A data
is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A bus
data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. OEAB
is the output enable for the B port. Data flow from the B port to the A port is similar
but requires using
OEBA,
LEBA and CLKBA. Flow-through organization of
signal pins simplifies layout. All inputs are designed with hysteresis for improved
noise margin.
The FCT16501T are ideally suited for driving high-capacitance loads and
low-impedance backplanes. The output buffers are designed with power off
disable capability to allow "live insertion" of boards when used as backplane
drivers.
FUNCTIONAL BLOCK DIAGRAM
OEAB
CLKBA
LEBA
OEBA
CLKAB
LEAB
55
1
30
28
27
2
C
A
1
3
C
D
54
B
1
D
C
D
C
D
TO 17 OTHER CHANNELS
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
© 2009 Integrated Device Technology, Inc.
SEPTEMBER 2009
DSC-5435/5
IDT74FCT16501AT/CT
FAST CMOS 18-BIT REGISTERED TRANSCEIVER
INDUSTRIAL TEMPERATURE RANGE
PIN CONFIGURATION
OEAB
LEAB
A
1
GND
A
2
A
3
V
CC
A
4
A
5
A
6
GND
A
7
A
8
A
9
A
10
A
11
A
12
GND
A
13
A
14
A
15
V
CC
A
16
A
17
GND
A
18
OEBA
LEBA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
GND
CLKAB
B
1
GND
B
2
B
3
V
CC
B
4
B
5
B
6
GND
B
7
B
8
B
9
B
10
B
11
B
12
GND
B
13
B
14
B
15
V
CC
B
16
B
17
GND
B
18
CLKBA
GND
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
Description
Max
–0.5 to 7
–0.5 to V
CC
+0.5
–65 to +150
–60 to +120
Unit
V
V
°C
mA
V
TERM(2)
Terminal Voltage with Respect to GND
V
TERM(3)
Terminal Voltage with Respect to GND
T
STG
I
OUT
Storage Temperature
DC Output Current
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. All device terminals except FCT162XXX Output and I/O terminals.
3. Output and I/O terminals for FCT162XXX.
CAPACITANCE
(T
A
= +25°C, f = 1.0MHz)
Symbol
C
IN
C
OUT
Parameter
(1)
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Typ.
3.5
3.5
Max.
6
8
Unit
pF
pF
NOTE:
1. This parameter is measured at characterization but not tested.
FUNCTION TABLE
(1, 4)
OEAB
L
H
H
H
H
H
H
Inputs
LEAB
CLKAB
X
X
H
X
H
X
L
↑
L
↑
L
L
L
H
Ax
X
L
H
L
H
X
X
Outputs
Bx
Z
L
H
L
H
B
(2)
B
(3)
TSSOP
TOP VIEW
PIN DESCRIPTION
Pin Names
OEAB
OEBA
LEAB
LEBA
CLKAB
CLKBA
Ax
Bx
Description
A-to-B Output Enable Input
B-to-A Output Enable Input (Active LOW)
A-to-B Latch Enable Input
B-to-A Latch Enable Input
A-to-B Clock Input
B-to-A Clock Input
A-to-B Data Inputs or B-to-A 3-State Outputs
B-to-A Data Inputs or A-to-B 3-State Outputs
NOTES:
1. A-to-B data flow is shown. B-to-A data flow is similar but uses
OEBA,
LEBA, and
CLKBA.
2. Output level before the indicated steady-state input conditions were established.
3. Output level before the indicated steady-state input conditions were established,
provided that CLKAB was HIGH before LEAB went LOW.
4. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don't Care
Z = High-impedance
↑
= LOW-to-HIGH Transition
2
IDT74FCT16501AT/CT
FAST CMOS 18-BIT REGISTERED TRANSCEIVER
INDUSTRIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Industrial: T
A
= –40°C to +85°C, V
CC
= 5.0V ±10%
Symbol
V
IH
V
IL
I
IH
I
IL
I
OZH
I
OZL
V
IK
I
OS
V
H
I
CCL
I
CCH
I
CCZ
Parameter
Input HIGH Level
Input LOW Level
Input HIGH Current (Input pins)
(5)
Input HIGH Current (I/O pins)
(5)
Input LOW Current (Input pins)
(5)
Input LOW Current (I/O pins)
(5)
High Impedance Output Current
(3-State Output pins)
(5)
Clamp Diode Voltage
Short Circuit Current
Input Hysteresis
Quiescent Power Supply Current
V
CC
= Max.
V
IN
= GND or V
CC
V
CC
= Min., I
IN
= –18mA
V
CC
= Max., V
O
= GND
(3)
—
V
CC
= Max.
V
O
= 2.7V
V
O
= 0.5V
V
I
= GND
Test Conditions
(1)
Guaranteed Logic HIGH Level
Guaranteed Logic LOW Level
V
CC
= Max.
V
I
= V
CC
Min.
2
—
—
—
—
—
—
—
—
–80
—
—
Typ.
(2)
—
—
—
—
—
—
—
—
–0.7
–140
100
5
Max.
—
0.8
±1
±1
±1
±1
±1
±1
–1.2
–250
—
500
V
mA
mV
µA
µA
Unit
V
V
µA
OUTPUT DRIVE CHARACTERISTICS
Symbol
I
O
V
OH
Parameter
Output Drive Current
Output HIGH Voltage
Test Conditions
(1)
V
CC
= Max., V
O
= 2.5V
(3)
V
CC
= Min.
I
OH
= –3mA
V
IN
= V
IH
or V
IL
I
OH
= –15mA
I
OH
= –32mA
(4)
V
CC
= Min.
I
OL
= 64mA
V
IN
= V
IH
or V
IL
V
CC
= 0V, V
IN
or V
O
≤
4.5V
Min.
–50
2.5
2.4
2
—
—
Typ.
(2)
—
3.5
3.5
3
0.2
—
Max.
–180
—
—
—
0.55
±1
Unit
mA
V
V
μA
V
OL
I
OFF
Output LOW Voltage
Input/Output Power Off Leakage
(5)
NOTES:
1. For conditions shown as Min. or Max., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Not more than one output should be shorted at one time. Duration of the test should not exceed one second.
4. Duration of the condition can not exceed one second.
5. This test limit for this parameter is ±5µA at T
A
= –55°C.
3
IDT74FCT16501AT/CT
FAST CMOS 18-BIT REGISTERED TRANSCEIVER
INDUSTRIAL TEMPERATURE RANGE
POWER SUPPLY CHARACTERISTICS
Symbol
ΔI
CC
I
CCD
Parameter
Quiescent Power Supply
Current TTL Inputs HIGH
Dynamic Power Supply Current
(4)
Test Conditions
(1)
V
CC
= Max.
V
IN
= 3.4V
(3)
V
CC
= Max.,
Outputs Open
OEAB =
OEBA
= V
CC
or GND
One Input Toggling
50% Duty Cycle
V
CC
= Max.,
Outputs Open
f
CP
= 10MHz (CLKAB)
50% Duty Cycle
OEAB =
OEBA
= V
CC
LEAB = GND
One Bit Toggling
fi = 5MHz
50% Duty Cycle
V
CC
= Max.,
Outputs Open
f
CP
= 10MHz (CLKAB)
50% Duty Cycle
OEAB =
OEBA
= V
CC
LEAB = GND
Eighteen Bits Toggling
fi = 2.5MHz
50% Duty Cycle
Min.
—
V
IN
= V
CC
V
IN
= GND
—
Typ.
(2)
0.5
75
Max.
1.5
120
Unit
mA
µA/
MHz
I
C
Total Power Supply Current
(6)
V
IN
= V
CC
V
IN
= GND
—
0.8
1.7
mA
V
IN
= 3.4V
VIN = GND
—
1.3
3.2
V
IN
= V
CC
V
IN
= GND
—
3.8
6.5
(5)
V
IN
= 3.4V
V
IN
= GND
—
8.5
20.8
(5)
NOTES:
1. For conditions shown as Min. or Max., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Per TTL driven input (V
IN
= 3.4V). All other inputs at V
CC
or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of the I
CC
formula. These limits are guaranteed but not tested.
6. I
C
= I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
I
C
= I
CC
+
ΔI
CC
D
H
N
T
+ I
CCD
(f
CP
N
CP
/2 + fiNi)
I
CC
= Quiescent Current (I
CCL
, I
CCH
and I
CCZ
)
ΔI
CC
= Power Supply Current for a TTL High Input (V
IN
= 3.4V)
D
H
= Duty Cycle for TTL Inputs High
N
T
= Number of TTL Inputs at D
H
I
CCD
= Dynamic Current Caused by an Input Transition Pair (HLH or LHL)
f
CP
= Clock Frequency for Register Devices (Zero for Non-Register Devices)
N
CP
= Number of Clock Inputs at f
CP
f
i
= Input Frequency
N
i
= Number of Inputs at f
i
4
IDT74FCT16501AT/CT
FAST CMOS 18-BIT REGISTERED TRANSCEIVER
INDUSTRIAL TEMPERATURE RANGE
SWITCHING CHARACTERISTICS OVER OPERATING RANGE
FCT16501AT
Symbol
f
MAX
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
SU
t
H
t
SU
t
H
t
W
t
W
t
SK(o)
Parameter
CLKAB or CLKBA frequency
(3)
Propagation Delay
Ax to Bx or Bx to Ax
Propagation Delay
LEBA to Ax, LEAB to Bx
Propagation Delay
CLKBA to Ax, CLKAB to Bx
Output Enable Time
OEBA
to Ax, OEAB to Bx
Output Disable Time
OEBA
to Ax, OEAB to Bx
Set-up Time, HIGH or LOW
Ax to CLKAB, Bx to CLKBA
Hold Time, HIGH or LOW
Ax to CLKAB, Bx to CLKBA
Set-up Time HIGH or LOW
Clock LOW
Ax to LEAB, Bx to LEBA
Clock HIGH
Hold Time, HIGH or LOW
Ax to LEAB, Bx to LEBA
LEAB or LEBA Pulse Width HIGH
(3)
CLKAB or CLKBA Pulse Width HIGH or LOW
(3)
Output Skew
(4)
Condition
(1)
C
L
= 50pF
R
L
= 500Ω
Min.
(2)
—
1.5
1.5
1.5
1.5
1.5
3
0
3
1.5
1.5
3
3
—
Max.
150
5.1
5.6
5.6
6
5.6
—
—
—
—
—
—
—
0.5
—
1.5
1.5
1.5
1.5
1.5
2.4
0
2
1.5
0.5
3
3
—
Min.
(2)
FCT16501CT
Max.
150
4.3
4.4
4.4
4.8
5.2
—
—
—
—
—
—
—
0.5
Unit
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTES:
1. See test circuits and waveforms.
2. Minimum limits are guaranteed but not tested on Propagation Delays.
3. This parameter is guaranteed but not tested.
4. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
5
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