Voltage References Ultra-Low-Power Voltage Ref
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | MO-178AA, SOT-23, 5 PIN |
| 针数 | 5 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | THREE TERMINAL VOLTAGE REFERENCE |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e0 |
| 长度 | 2.9 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 输出次数 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电压 | 3.333 V |
| 最小输出电压 | 3.267 V |
| 标称输出电压 | 3.3 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.45 mm |
| 最大供电电压 (Vsup) | 12.6 V |
| 最小供电电压 (Vsup) | 3.5 V |
| 标称供电电压 (Vsup) | 3.5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 最大电压温度系数 | 100 ppm/°C |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 微调/可调输出 | NO |
| 最大电压容差 | 1% |
| 宽度 | 1.625 mm |
| Base Number Matches | 1 |
| MAX6129BEUK33-T | MAX6129AEUK21-T | MAX6129AEUK50-T | MAX6129BEUK50-T | GP65P-2942-CB50 | MAX6129BEUK30-T | MAX6129BEUK25-T | MAX6129BEUK21-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Voltage References Ultra-Low-Power Voltage Ref | RS-422/RS-485 Interface IC Differential Bus Transceiver | Voltage References Ultra-Low-Power Series Voltage Reference | Voltage References Ultra-Low-Power Voltage Ref | Fixed Resistor, Metal Film, 1W, 29400ohm, 400V, 0.25% +/-Tol, 50ppm/Cel, | Tantalum Capacitors - Solid SMD 25volts 100uF 20% | Programmer Accessories Tag-Connect In-Circ Cable No Legs | Voltage References Ultra-Low-Power Series Voltage Reference |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 端子数量 | 5 | 5 | 5 | 5 | 2 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 160 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | CYLINDRICAL PACKAGE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Axial | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | METAL FILM | BICMOS | BICMOS | BICMOS |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | - | SOIC | SOIC | SOIC |
| 包装说明 | MO-178AA, SOT-23, 5 PIN | MO-178AA, SOT-23, 5 PIN | LSSOP, TSOP5/6,.11,37 | MO-178AA, SOT-23, 5 PIN | - | MO-178AA, SOT-23, 5 PIN | MO-178AA, SOT-23, 5 PIN | LSSOP, TSOP5/6,.11,37 |
| 针数 | 5 | 5 | 5 | 5 | - | 5 | 5 | 5 |
| Is Samacsys | N | N | - | N | - | N | N | - |
| 模拟集成电路 - 其他类型 | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | - | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE | THREE TERMINAL VOLTAGE REFERENCE |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | - | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 长度 | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | - | 2.9 mm | 2.9 mm | 2.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 输出次数 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 最大输出电压 | 3.333 V | 2.0562 V | 5.02 V | 5.05 V | - | 3.03 V | 2.525 V | 2.0685 V |
| 最小输出电压 | 3.267 V | 2.0398 V | 4.98 V | 4.95 V | - | 2.97 V | 2.475 V | 2.0275 V |
| 标称输出电压 | 3.3 V | 2.048 V | 5 V | 5 V | - | 3 V | 2.5 V | 2.048 V |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSSOP | LSSOP | LSSOP | - | LSSOP | LSSOP | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | - | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 245 | - | 245 | 245 | 245 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | - | 1.45 mm | 1.45 mm | 1.45 mm |
| 最大供电电压 (Vsup) | 12.6 V | 12.6 V | 12.6 V | 12.6 V | - | 12.6 V | 12.6 V | 12.6 V |
| 最小供电电压 (Vsup) | 3.5 V | 2.5 V | 5.2 V | 5.2 V | - | 3.2 V | 2.7 V | 2.5 V |
| 标称供电电压 (Vsup) | 3.5 V | 2.5 V | 5.2 V | 5.2 V | - | 3.2 V | 2.7 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | - | YES | YES | YES |
| 最大电压温度系数 | 100 ppm/°C | 40 ppm/°C | 40 ppm/°C | 100 ppm/°C | - | 100 ppm/°C | 100 ppm/°C | 100 ppm/°C |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | - | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 微调/可调输出 | NO | NO | NO | NO | - | NO | NO | NO |
| 最大电压容差 | 1% | 0.4% | 0.4% | 1% | - | 1% | 1% | 1% |
| 宽度 | 1.625 mm | 1.625 mm | 1.625 mm | 1.625 mm | - | 1.625 mm | 1.625 mm | 1.625 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 |
微控制器 MCU
求职招聘
嵌入式系统
以拆会友
嵌入式系统
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
