JFET 30V 10mA
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 含铅 |
| 零件包装代码 | TO-92 |
| 包装说明 | CASE 29-11, TO-92, 3 PIN |
| 针数 | 3 |
| 制造商包装代码 | 29-11 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 配置 | SINGLE |
| 最小漏源击穿电压 | 30 V |
| 最大漏源导通电阻 | 30 Ω |
| FET 技术 | JUNCTION |
| 最大反馈电容 (Crss) | 4 pF |
| JEDEC-95代码 | TO-226AA |
| JESD-30 代码 | O-PBCY-T3 |
| JESD-609代码 | e0 |
| 元件数量 | 1 |
| 端子数量 | 3 |
| 工作模式 | DEPLETION MODE |
| 最高工作温度 | 150 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | ROUND |
| 封装形式 | CYLINDRICAL |
| 峰值回流温度（摄氏度） | 240 |
| 极性/信道类型 | N-CHANNEL |
| 最大功率耗散 (Abs) | 0.31 W |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 晶体管应用 | SWITCHING |
| 晶体管元件材料 | SILICON |
| Base Number Matches | 1 |
| 2N5638RLRA | 2N5639G | 2N5639RLRAG | 2N5639 | 2N5638RLRAG | |
|---|---|---|---|---|---|
| 描述 | JFET 30V 10mA | JFET 30V 10mA | JFET 30V 10mA | JFET 30V 10mA | |
| Brand Name | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 |
| 零件包装代码 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 |
| 包装说明 | CASE 29-11, TO-92, 3 PIN | CYLINDRICAL, O-PBCY-T3 | CYLINDRICAL, O-PBCY-T3 | CYLINDRICAL, O-PBCY-T3 | LEAD FREE, CASE 29-11, TO-92, 3 PIN |
| 针数 | 3 | 3 | 3 | 3 | 3 |
| 制造商包装代码 | 29-11 | 29-11 | 29-11 | 29-11 | 29-11 |
| Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 最小漏源击穿电压 | 30 V | 30 V | 30 V | 30 V | 30 V |
| 最大漏源导通电阻 | 30 Ω | 60 Ω | 60 Ω | 60 Ω | 30 Ω |
| FET 技术 | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION |
| 最大反馈电容 (Crss) | 4 pF | 4 pF | 4 pF | 4 pF | 4 pF |
| JEDEC-95代码 | TO-226AA | TO-226AA | TO-92 | TO-226AA | TO-226AA |
| JESD-30 代码 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 |
| JESD-609代码 | e0 | e1 | e1 | e0 | e1 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 3 | 3 | 3 | 3 | 3 |
| 工作模式 | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE |
| 最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | ROUND | ROUND | ROUND | ROUND | ROUND |
| 封装形式 | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
| 峰值回流温度（摄氏度） | 240 | 260 | 260 | 240 | 260 |
| 极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
| 最大功率耗散 (Abs) | 0.31 W | 0.31 W | 0.31 W | 0.31 W | 0.31 W |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 40 | 30 | 40 |
| 晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| 晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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