ARM Microcontrollers - MCU IND TEMP MRL B
| 参数名称 | 属性值 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, |
| 针数 | 100 |
| Reach Compliance Code | unknown |
| ECCN代码 | 5A992.C |
| Factory Lead Time | 1 week |
| 具有ADC | YES |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | |
| 位大小 | 32 |
| 最大时钟频率 | 50 MHz |
| DAC 通道 | NO |
| DMA 通道 | YES |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQFP-G100 |
| 长度 | 14 mm |
| I/O 线路数量 | 62 |
| 端子数量 | 100 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 认证状态 | Not Qualified |
| ROM可编程性 | FLASH |
| 座面最大高度 | 1.6 mm |
| 速度 | 55 MHz |
| 最大供电电压 | 1.95 V |
| 最小供电电压 | 1.65 V |
| 标称供电电压 | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| AT91SAM7XC128B-AU | AT91SAM7XC256-AU | AT91SAM7XC128B-CU | AT91SAM7XC128B-AUR | |
|---|---|---|---|---|
| 描述 | ARM Microcontrollers - MCU IND TEMP MRL B | ARM Microcontrollers - MCU LQFP IND TEMP | ARM Microcontrollers - MCU IND TEMP MRL B | ARM Microcontrollers - MCU 128KB FL MCU 55 MHz 32KB SRAM |
| 包装说明 | LFQFP, | LFQFP, QFP100,.63SQ,20 | TFBGA, | , |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | QFP | QFP | BGA | - |
| 针数 | 100 | 100 | 100 | - |
| ECCN代码 | 5A992.C | 3A001.A.3 | 5A992.C | - |
| Factory Lead Time | 1 week | - | 1 week | 1 week |
| 具有ADC | YES | YES | YES | - |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | - |
| 位大小 | 32 | 32 | 32 | - |
| 最大时钟频率 | 50 MHz | 50 MHz | 50 MHz | - |
| DAC 通道 | NO | NO | NO | - |
| DMA 通道 | YES | YES | YES | - |
| JESD-30 代码 | S-PQFP-G100 | S-PQFP-G100 | S-PBGA-B100 | - |
| 长度 | 14 mm | 14 mm | 9 mm | - |
| I/O 线路数量 | 62 | 62 | 62 | - |
| 端子数量 | 100 | 100 | 100 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - |
| PWM 通道 | YES | YES | YES | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | LFQFP | LFQFP | TFBGA | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - |
| ROM可编程性 | FLASH | FLASH | FLASH | - |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.1 mm | - |
| 速度 | 55 MHz | 55 MHz | 55 MHz | - |
| 最大供电电压 | 1.95 V | 1.95 V | 1.95 V | - |
| 最小供电电压 | 1.65 V | 1.65 V | 1.65 V | - |
| 标称供电电压 | 1.8 V | 1.8 V | 1.8 V | - |
| 表面贴装 | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子形式 | GULL WING | GULL WING | BALL | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.8 mm | - |
| 端子位置 | QUAD | QUAD | BOTTOM | - |
| 宽度 | 14 mm | 14 mm | 9 mm | - |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - |
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