Philips Semiconductors
Product specification
30 Mbits/s up to 1.25 Gbits/s laser drivers
CONTENTS
FEATURES
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
8
9
10
General
Control features
Protection features
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Data and clock input
Retiming
Pulse width adjustment
Modulator output stage
Dual-loop control
Average loop control
Direct current setting
Soft start
Alarm functions
Enable
Reference block
LIMITING VALUES
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
11
12
12.1
12.1.1
12.1.2
12.1.3
12.1.4
12.1.5
12.1.6
12.2
12.3
12.4
13
14
15
15.1
15.2
15.3
15.4
15.5
16
17
18
TZA3047A; TZA3047B
AC CHARACTERISTICS
APPLICATION INFORMATION
Design equations
Bias and modulation currents
Average monitor current and extinction ratio
Dual-loop control
Alarm operating current
Alarm monitor current
Pulse width adjustment
TZA3047A with dual-loop control
TZA3047B with dual-loop control
TZA3047B with average loop control
BONDING PAD LOCATIONS
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2003 Jun 05
2
Philips Semiconductors
Product specification
30 Mbits/s up to 1.25 Gbits/s laser drivers
1
1.1
FEATURES
General
1.3
TZA3047A; TZA3047B
Protection features
•
Alarm function on operating current
•
Alarm function on monitor current
•
Enable function on bias and modulation currents
•
Soft start on bias and modulation currents.
2
APPLICATIONS
•
30 Mbits/s to 1.25 Gbits/s
•
Bias current up to 100 mA
•
Modulation current up to 100 mA
•
Rise and fall times typical 120 ps
•
Jitter below 30 ps (peak-to-peak value)
•
Modulation output voltage up to 2 V dynamic range
•
1.2 V minimum voltage on the modulation output pin and
0.4 V minimum voltage on pin BIAS
•
Retiming function via external clock with disable option
•
Pulse width adjustment function with disable option
•
Positive Emitter Coupled Logic (PECL), Low Voltage
Positive Emitter Coupled Logic (LVPECL) and
Current-Mode Logic (CML) compatible data and clock
inputs
•
Internal common mode voltage available for AC-coupled
data and clock inputs and for single-ended applications
•
3.3 V supply voltage
•
TZA3047A: AC-coupled laser for 3.3 V laser supply
•
TZA3047B: DC-coupled laser for 3.3 V and 5 V laser
supply.
1.2
Control features
•
SDH/SONET optical transmission systems.
3
GENERAL DESCRIPTION
The TZA3047 is a fully integrated laser driver for optical
transmission systems with data rates up to 1.25 Gbits/s.
The TZA3047 incorporates all the necessary control and
protection functions for a laser driver application with very
few external components required and low power
dissipation. The dual-loop controls the average monitor
current in a programmable range from 150
µA
to 1300
µA
and the extinction ratio in a programmable range from
5 to 15 (linear scale).
The design is made in the Philips BiCMOS RF process
and is available in a HBCC32 package or as bare die. The
TZA3047A is intended for use in an application with an
AC-coupled laser diode with a 3.3 V laser supply voltage.
The TZA3047B is intended for use in an application with a
DC-coupled laser diode for both 3.3 and 5 V laser supply
voltages.
•
Dual-loop control for constant and accurate optical
average power level and extinction ratio
•
Optional average power loop control (up to 1.25 Gbits/s)
•
Optional direct setting of modulation and bias currents.
4
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TZA3047AVH
TZA3047BVH
TZA3047UH
HBCC32
HBCC32
−
DESCRIPTION
plastic thermal enhanced bottom chip carrier; 32 terminals;
body 5
×
5
×
0.65 mm
bare die; 2 560
×
2 510
×
380
µm
VERSION
SOT560-1
−
2003 Jun 05
3
Philips Semiconductors
Product specification
30 Mbits/s up to 1.25 Gbits/s laser drivers
6
PINNING
SYMBOL
GND
V
CCA
V
CCA
V
CCD
V
CCD
DIN
DINQ
GNDRF
GNDRF
GNDRF
GNDRF
TEST
CIN
CINQ
GND
GNDESD
ALRESET
ENABLE
GNDDFT
ALOP
ALMON
i.c.
MAXOP
i.c.
VTEMP
MAXMON
RREF
GNDRF
PWA
GND
GNDO
LAQ
LAQ
LAQ
LAQ
GNDO
i.c.
GNDO
2003 Jun 05
PIN
die pad
1
−
2
−
3
4
−
−
−
−
5
6
7
8
−
9
10
−
11
12
−
13
−
14
15
16
−
17
18
−
19
−
20
−
−
−
−
PAD
(1)
TZA3047A; TZA3047B
DESCRIPTION
substrate common ground plane for V
CCA
, V
CCD
, V
CCO
, RF and I/O; must be connected to
ground
1
2
3
4
5
6
7
8
9
10
11
12
13
−
14
15
16
17
18
19
20
21
22
23
24
25
26
27
−
28
29
30
31
32
33
34
35
analog supply voltage
analog supply voltage
digital supply voltage
digital supply voltage
non-inverted data input (RF input)
inverted data input (RF input)
ground
ground
ground
ground
test pin or test pad; must be connected to ground
non-inverted clock input (RF input)
inverted clock input (RF input)
ground
ground
alarm reset input; resets ALMON and ALOP alarms
enable input for modulation and bias current
ground
alarm output on operating current (open-drain)
alarm output on monitor diode current (open-drain)
internally connected
threshold level input for alarm on operating current
internally connected
temperature dependent voltage output source
threshold level input for alarm on monitor diode current
reference current input; must be connected to ground with an accurate (1%)
10 kΩ resistor
ground
pulse width adjustment input
ground
ground
inverted laser modulation output (RF output); output for dummy load
inverted laser modulation output (RF output); output for dummy load
inverted laser modulation output (RF output); output for dummy load
inverted laser modulation output (RF output); output for dummy load
ground
internally connected
ground
5
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