Buffers u0026 Line Drivers QUAD 3-STATE BUS BUF
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SSOP |
| 包装说明 | PLASTIC, SSOP-14 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 控制类型 | ENABLE LOW |
| 系列 | HCT |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 6.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.006 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 38 ns |
| 传播延迟（tpd） | 38 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 5.3 mm |
| 74HCT125DB | 74HCT125N | 74HC125PW-T | 74HCT125DB-T | 74HCT125D | 74HC125DB | 74HC125DB-T | 74HCT125PW | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Buffers u0026 Line Drivers QUAD 3-STATE BUS BUF | Buffers u0026 Line Drivers QUAD 3-STATE BUS BUF | Buffers u0026 Line Drivers QUAD 3-STATE BUS BUF | Buffers u0026 Line Drivers QUAD 3-STATE BUS BUF | Buffers u0026 Line Drivers QUAD 3-STATE BUS BUF | Buffers & Line Drivers QUAD 3-STATE BUS BUF | Buffers & Line Drivers QUAD 3-STATE BUS BUF | Buffers & Line Drivers QUAD 3-STATE BUS BUF |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SSOP | DIP | TSSOP | SSOP | SOIC | SSOP | SSOP | TSSOP |
| 包装说明 | PLASTIC, SSOP-14 | DIP, DIP14,.3 | TSSOP, | SSOP, | PLASTIC, SO-14 | SSOP, SSOP14,.3 | SSOP, SSOP14,.3 | TSSOP, TSSOP14,.25 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant | unknown | compliant |
| 系列 | HCT | HCT | HC/UH | HCT | HCT | HC/UH | HC/UH | HCT |
| JESD-30 代码 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 6.2 mm | 19.025 mm | 5 mm | 6.2 mm | 8.65 mm | 6.2 mm | 6.2 mm | 5 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | DIP | TSSOP | SSOP | SOP | SSOP | SSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 38 ns | 38 ns | 30 ns | 38 ns | 38 ns | 30 ns | 30 ns | 38 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 4.2 mm | 1.1 mm | 2 mm | 1.75 mm | 2 mm | 2 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 6 V | 5.5 V | 5.5 V | 6 V | 6 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 2 V | 4.5 V | 4.5 V | 2 V | 2 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 5.3 mm | 7.62 mm | 4.4 mm | 5.3 mm | 3.9 mm | 5.3 mm | 5.3 mm | 4.4 mm |
| 是否无铅 | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 | - | 不含铅 |
| 控制类型 | ENABLE LOW | ENABLE LOW | - | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-609代码 | e4 | e4 | e4 | e4 | - | e4 | e4 | e4 |
| 最大I（ol） | 0.006 A | 0.006 A | - | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 封装等效代码 | SSOP14,.3 | DIP14,.3 | - | - | SOP14,.25 | SSOP14,.3 | SSOP14,.3 | TSSOP14,.25 |
| 电源 | 5 V | 5 V | - | - | 5 V | 2/6 V | 2/6 V | 5 V |
| Prop。Delay @ Nom-Sup | 38 ns | 38 ns | - | - | 38 ns | 30 ns | 30 ns | 38 ns |
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