Freescale Semiconductor, Inc.
Data Sheet: Technical Data
KL33P80M48SF3
Rev. 2, 03/2015
Kinetis KL33 Microcontroller
48 MHz ARM® Cortex®-M0+ and 64 KB Flash
MKL33Z32Vxx4
MKL33Z64Vxx4
The KL33 series is optimized for cost-sensitive and battery-
powered applications requiring low-power segment LCD. The
product offers:
• Low power segment LCD up to 40x8/42x6/44x4
• Embedded ROM with boot loader for flexible program
upgrade
• High accuracy internal voltage and clock reference
• FlexIO to support any standard and customized serial
peripheral emulation
• Hardware CRC module
• Down to 60uA/MHz in very low power run mode and
1.83uA in deep sleep mode (RAM + RTC retained)
64 LQFP
10x10 mm P 0.5 mm
80 LQFP
12x12 mm P 0.5 mm
48 QFN
7x7 mm P 0.5 mm
64 BGA
5x5 mm P 0.5 mm
Core Processor
• ARM
®
Cortex
®
-M0+ core up to 48 MHz
Memories
• 32/64 KB program flash memory
• 4/8 KB SRAM
• 8 KB ROM with build-in bootloader
• 32-byte backup register
System
• 4-channel asynchronous DMA controller
• Watchdog
• Low-leakage wakeup unit
• Two-pin Serial Wire Debug (SWD) programming and
debug interface
• Micro Trace Buffer
• Bit manipulation engine
• Interrupt controller
Clocks
• 48 MHz high accuracy (up to 0.5%) internal reference
clock
• 8MHz/2MHz high accuracy (up to 3%) internal
reference clock
• 1KHz reference clock active under all low-power
modes (except VLLS0)
• 32–40KHz and 3–32MHz crystal oscillator
Peripherals
• Segment LCD supporting up to 40x8/42x6/44x4
segments
• One UART module supporting ISO7816, operating
up to 1.5 Mbit/s
• Two low-power UART modules supporting
asynchronous operation in low-power modes
• Two I2C modules and I2C0 supporting up to 1
Mbit/s
• Two 16-bit SPI modules supporting up to 24 Mbit/s
• One FlexIO module supporting emulation of
additional UART, IrDA, SPI, I2C, PWM and other
serial modules, etc.
• One 16-bit 818 ksps ADC module with high
accuracy internal voltage reference (Vref) and up to
20 channels
• High-speed analog comparator containing a 6-bit
DAC for programmable reference input
• One 12-bit DAC
• 1.2 V internal voltage reference
Timers
•
•
•
•
•
One 6-channel Timer/PWM module
Two 2-channel Timer/PWM modules
One low-power timer
Periodic interrupt timer
Real time clock
Freescale reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products. © 2014–2015 Freescale
Semiconductor, Inc. All rights reserved.
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range: –40 to 105 °C
Packages
• 80 LQFP 12mm x 12mm, 0.5mm pitch, 1.6mm
thickness
• 64 LQFP 10mm x 10mm, 0.5mm pitch, 1.6mm
thickness
• 64 MAPBGA 5mm x 5mm, 0.5mm pitch, 1.23mm
thickness (Package Your Way)
• 48 QFN 7mm x 7mm, 0.5mm pitch, 0.65mm thickness
(Package Your Way)
Security and Integrity
• 80-bit unique identification number per chip
• Advanced flash security
• Hardware CRC module
I/O
• Up to 70 general-purpose input/output pins (GPIO)
and 4 high-drive pad
Low Power
• Down to 60uA/MHz in very low power run mode
• Down to 1.83uA in VLLS3 mode (RAM + RTC
retained)
• Six flexible static modes
Ordering Information
Product
Part number
Marking (Line1/
Line2)
TBD
TBD
MKL33Z32/VLH4
MKL33Z64/VLH4
TBD
TBD
MKL33Z32VLK4
MKL33Z64VLK4
Memory
Flash
(KB)
32
64
32
64
32
64
32
64
SRAM
(KB)
4
8
4
8
4
8
4
8
Package
Pin
count
48
48
64
64
64
64
80
80
Package
IO and ADC channel
GPIOs
GPIOs
(INT/HD)
1
40/4
40/4
54/4
54/4
54/4
54/4
70/4
70/4
ADC
channels
(SE/DP)
17/3
17/3
20/4
20/4
20/4
20/4
20/4
20/4
MKL33Z32VFT4
MKL33Z64VFT4
MKL33Z32VLH4
MKL33Z64VLH4
MKL33Z32VMP4
MKL33Z64VMP4
MKL33Z32VLK4
MKL33Z64VLK4
QFN
QFN
LQFP
LQFP
MAPBGA
MAPBGA
LQFP
LQFP
40
40
54
54
54
54
70
70
1. INT: interrupt pin numbers; HD: high drive pin numbers
NOTE
The 48 QFN and 64 MAPBGA packages supporting MKLx3ZxxVFT4 and
MKLx3ZxxVMP4 part numbers for this product are not yet available. However, these
packages are included in Package Your Way program for Kinetis MCUs. Visit
freescale.com/KPYW
for more details.
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Description
The Freescale Solution Advisor is a web-based tool that features
interactive application wizards and a dynamic product selector.
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
Table continues on the next page...
2
Freescale Semiconductor, Inc.
Kinetis KL33 Microcontroller, Rev.2, 03/2015.
Resource
Solution Advisor
KL3xPB
1
KL33P80M48SF3RM
1
This document.
Related Resources (continued)
Type
Chip Errata
Package
drawing
Description
Resource
The chip mask set Errata provides additional or corrective information for KINETIS_L_0N01P
1
a particular device mask set.
Package dimensions are provided in package drawings.
• 64-LQFP: 98ASS23234W
1
• 64 MAPBGA:
98ASA00420D
1
• 48 QFN: 98ASA00616D
1
• 80 LQFP: 98ASS23174W
1
1. To find the associated resource, go to
http://www.freescale.com
and perform a search using this term.
Kinetis KL33 Microcontroller, Rev.2, 03/2015.
3
Freescale Semiconductor, Inc.
Table of Contents
1 Ratings.................................................................................. 5
1.1 Thermal handling ratings............................................. 5
1.2 Moisture handling ratings............................................ 5
1.3 ESD handling ratings...................................................5
1.4 Voltage and current operating ratings......................... 5
2 General................................................................................. 6
AC electrical characteristics........................................ 6
Nonswitching electrical specifications......................... 6
2.2.1 Voltage and current operating requirements... 7
2.2.2 LVD and POR operating requirements............7
2.2.3 Voltage and current operating behaviors.........8
2.2.4 Power mode transition operating behaviors.... 9
2.2.5 Power consumption operating behaviors........ 10
2.2.6 EMC performance........................................... 20
2.2.7 Capacitance attributes.....................................21
2.3 Switching specifications...............................................21
2.3.1 Device clock specifications..............................21
2.3.2 General switching specifications..................... 21
2.4 Thermal specifications.................................................22
2.4.1 Thermal operating requirements..................... 22
2.4.2 Thermal attributes............................................22
3 Peripheral operating requirements and behaviors................ 23
3.1 Core modules.............................................................. 23
3.1.1
3.2
3.3
SWD electricals .............................................. 23
System modules.......................................................... 25
Clock modules............................................................. 25
3.3.1 MCG-Lite specifications...................................25
3.3.2 Oscillator electrical specifications....................25
Memories and memory interfaces............................... 28
3.4.1 Flash electrical specifications.......................... 28
Security and integrity modules.................................... 29
Analog......................................................................... 29
3.6.1 ADC electrical specifications........................... 29
3.6.2
3.6.3
3.6.4
Voltage reference electrical specifications...... 34
CMP and 6-bit DAC electrical specifications... 35
12-bit DAC electrical characteristics................37
2.1
2.2
5.1
5.2
SPI switching specifications........................................ 40
I2C............................................................................... 45
5.2.1 Inter-Integrated Circuit Interface (I2C) timing.. 45
5.3 UART...........................................................................47
6 Design considerations...........................................................47
6.1 Hardware design considerations................................. 47
6.1.1 Printed circuit board recommendations........... 47
6.1.2 Power delivery system.....................................47
6.1.3 Analog design..................................................48
6.1.4 Digital design................................................... 49
6.1.5 Crystal oscillator.............................................. 52
6.2 Software considerations.............................................. 53
Human-machine interfaces (HMI)......................................... 54
7.1 LCD electrical characteristics...................................... 54
Dimensions........................................................................... 56
8.1 Obtaining package dimensions................................... 56
Pinouts and Packaging......................................................... 56
9.1 KL33 Signal Multiplexing and Pin Assignments.......... 56
9.2 KL33 Family Pinouts....................................................60
Ordering parts....................................................................... 64
10.1 Determining valid orderable parts................................64
Part identification...................................................................64
11.1 Description...................................................................65
11.2 Format......................................................................... 65
11.3 Fields........................................................................... 65
11.4 Example.......................................................................65
12 Terminology and guidelines.................................................. 66
12.1 Definition: Operating requirement................................66
12.2 Definition: Operating behavior..................................... 66
12.3 Definition: Attribute...................................................... 67
12.4 Definition: Rating......................................................... 67
12.5 Result of exceeding a rating........................................ 67
12.6 Relationship between ratings and operating
requirements................................................................68
12.7 Guidelines for ratings and operating requirements......68
12.8 Definition: Typical value...............................................69
12.9 Typical value conditions.............................................. 70
13 Revision History.................................................................... 70
7
8
9
10
11
3.4
3.5
3.6
4 Timers................................................................................... 40
5 Communication interfaces.....................................................40
4
Freescale Semiconductor, Inc.
Kinetis KL33 Microcontroller, Rev.2, 03/2015.
Ratings
1 Ratings
1.1 Thermal handling ratings
Table 1. Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Table 2. Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Table 3. ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105 °C
Min.
–2000
–500
–100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
Kinetis KL33 Microcontroller, Rev.2, 03/2015.
5
Freescale Semiconductor, Inc.
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