MURF1660CTG
Switch-mode Power
Rectifier
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
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•
•
•
•
•
•
•
•
Ultrafast 60 Nanosecond Recovery Times
150°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
High Temperature Glass Passivated Junction
Low Leakage Specified @ 150°C Case Temperature
Current Derating @ Both Case and Ambient Temperatures
Electrically Isolated. No Isolation Hardware Required.
This is a Pb−Free Package*
ULTRAFAST RECTIFIER
16 AMPERES, 600 VOLTS
1
2
3
Mechanical Characteristics:
•
Case: Epoxy, Molded
•
Weight: 1.9 Grams (Approximately)
•
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•
Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
MAXIMUM RATINGS
(Per Leg)
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
Total Device, (Rated V
R
), T
C
= 150°C
Per Diode
Per Device
Peak Repetitive Forward Current
(Rated V
R
, Square Wave, 20 kHz),
T
C
= 150°C
Non−repetitive Peak Surge Current
(Surge applied at rated load conditions
halfwave, single phase, 60 Hz)
Operating Junction and Storage Temperature
RMS Isolation Voltage
(t = 0.3 second, R.H.
≤
30%, T
A
= 25°C)
(Note 1) Per Figure 3
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
8
16
I
FM
16
A
Value
600
Unit
V
A
Y
WW
U1660
G
AKA
1
2
3
ISOLATED TO−220
CASE 221AH
MARKING
DIAGRAM
AYWW
U1660G
AKA
A
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
= Diode Polarity
I
FSM
100
A
ORDERING INFORMATION
− 65 to +150
°C
V
4500
Device
MURF1660CTG
Package
TO−220
(Pb−Free)
Shipping
50 Units / Rail
T
J
, T
stg
V
iso1
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Proper strike and creepage distance must be provided.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2016
1
July, 2016 − Rev. 7
Publication Order Number:
MURF1660CT/D
MURF1660CTG
THERMAL CHARACTERISTICS
(Per Leg)
Characteristic
Maximum Thermal Resistance, Junction−to−Case
Lead Temperature for Soldering Purposes: 1/8″ from Case for 5 Seconds
Symbol
R
qJC
T
L
Value
3.0
260
Unit
°C/W
°C
ELECTRICAL CHARACTERISTICS
(Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 2)
(i
F
= 8.0 A, T
C
= 150°C)
(i
F
= 8.0 A, T
C
= 25°C)
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, T
C
= 150°C)
(Rated DC Voltage, T
C
= 25°C)
Maximum Reverse Recovery Time
(I
F
= 1.0 A, di/dt = 50 A/ms)
(I
F
= 0.5 A, i
R
= 1.0 A, I
REC
= 0.25 A)
Symbol
v
F
1.20
1.50
i
R
500
10
t
rr
60
50
ns
mA
Value
Unit
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
i F , INSTANTANEOUS FORWARD CURRENT (AMPS)
100
50
20
10
5
2
1
0.5
0.2
0.1
100°C
T
J
= 150°C
25°C
0.4
0.6
1.0
1.2
0.8
1.4
v
F
, INSTANTANEOUS VOLTAGE (V)
1.6
1.8
Figure 1. Typical Forward Voltage, Per Leg
10 K
1.0 K
100
T
J
= 150°C
10
1.0
25°C
0.1
100°C
I R, REVERSE CURRENT (
μ
A)
0.01
100
200
300
400
V
R
, REVERSE VOLTAGE (V)
500
600
Figure 2. Typical Reverse Current, Per Leg*
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2
MURF1660CTG
PACKAGE DIMENSIONS
TO−220 FULLPACK, 3−LEAD
CASE 221AH
ISSUE F
A
E
E/2
P
0.14
Q
1 2 3
M
B
A
B A
M
SEATING
PLANE
H1
A1
D
C
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR UNCONTROLLED IN THIS AREA.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE
PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE
MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY.
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION.
LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00.
6. CONTOURS AND FEATURES OF THE MOLDED PACKAGE BODY
MAY VARY WITHIN THE ENVELOP DEFINED BY DIMENSIONS A1
AND H1 FOR MANUFACTURING PURPOSES.
DIM
A
A1
A2
b
b2
c
D
E
e
H1
L
L1
P
Q
MILLIMETERS
MIN
MAX
4.30
4.70
2.50
2.90
2.50
2.90
0.54
0.84
1.10
1.40
0.49
0.79
14.70
15.30
9.70
10.30
2.54 BSC
6.60
7.10
12.50
14.73
---
2.80
3.00
3.40
2.80
3.20
L
L1
3X
3X
b
0.25
M
c
B A
M
b2
e
FRONT VIEW
C
A2
SIDE VIEW
SECTION D−D
A
NOTE 6
NOTE 6
H1
D
D
A
ALTERNATE CONSTRUCTION
SECTION A−A
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4
MURF1660CT/D
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