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HCF40105BC1: 产品描述FIFO REGISTER; 产品类别存储存储; 文件大小241KB，共12页; 制造商ST(意法半导体); 官网地址http://www.st.com/

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HCF40105BC1概述

FIFO REGISTER

HCF40105BC1规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	ST(意法半导体)
零件包装代码	QLCC
包装说明	PLASTIC, LCC-20
针数	20
Reach Compliance Code	_compli
ECCN代码	EAR99
最长访问时间	370 ns
最大时钟频率 (fCLK)	3 MHz
周期时间	333.33 ns
JESD-30 代码	S-PQCC-J20
JESD-609代码	e0
长度	8.9662 mm
内存密度	64 bi
内存集成电路类型	OTHER FIFO
内存宽度	4
功能数量	1
端子数量	20
字数	16 words
字数代码	16
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	16X4
输出特性	3-STATE
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	QCCJ
封装等效代码	LDCC20,.4SQ
封装形状	SQUARE
封装形式	CHIP CARRIER
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	3/15 V
认证状态	Not Qualified
座面最大高度	4.57 mm
最大供电电压 (Vsup)	15 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	J BEND
端子节距	1.27 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	8.9662 mm
Base Number Matches	1

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HCC40105B

HCF40105B

FIFO REGISTER

INDEPENDENT ASYNCHRONOUS INPUTS

AND OUTPUTS

3-STATE OUTPUTS

EXPANDABLE IN EITHER DIRECTION

STATUS INDICATORS ON INPUT AND OUT-

PUT

RESET CAPABILITY

STANDARDIZED, SYMMETRICAL OUTPUT

CHARACTERISTICS

QUIESCENT CURRENT SPECIFIED AT 20V

FOR HCC DEVICE

5V, 10V, AND 15V PARAMETRIC RATINGS

INPUT CURRENT OF 100nA AT 18V AND 25°C

FOR HCC DEVICE

100% TESTED FOR QUIESCENT CURRENT

MEETS ALL REQUIREMENTS OF JEDEC TEN-

TATIVE STANDARD N

13A, ”STANDARD

SPECIFICATIONS FOR DESCRIPTION OF ”B”

SERIES CMOS DEVICES”

READY) indicates if the FIFO contains data. As the

earliest data are removed from the bottom of the data

stack (the output end), all data entered later will auto-

matically propagate (ripple) toward the output.

(Plastic Package)

(Ceramic Package)

(Chip Carrier)

ORDER CODES :

HCC40105BF

HCF40105BEY

HCF40105BC1

DESCRIPTION

The

HCC40105B

(extended temperature range) and

HCF40105B

(intermediate temperature range) are

monolithic integrated circuits, available in 16-lead dual

in-line plastic or ceramic package.

The

HCC/HCF40105B

is a low-power first-in-first-out

(FIFO) ”elastic” storage register that can store 16 4-bit

words. It is capable of handling input and output data

at different shifting rates. This feature makes it particu-

larly useful as a buffer between asynchronous sys-

tems. Each word position in the register is clocked by

a control flip-flop, which stores a marker bit. A ”1” sig-

nifies that the position’s data is filled and a ”0” denotes

a vacancy in that position. The control flip-flop detects

the state of the preceding flip-flop and communicates

its own status to the succeeding flip-flop. When a con-

trol flip-flop is in the ”0” state and sees a ”1” in the

preceding flip-flop, it generates a clock pulse that

transfers data from the preceding four data latches

into its own four data latches and resets the preceding

flip-flop to ”0”. The first and last control flip-flops have

buffered outputs. Since all empty locations ”bubble”

automatically to the input end, and all valid data ripple

through to the output end, the status of the first control

flip-flop (DATA-IN READY) indicates if the FIFO is full,

and the status of the last flip-flop (DATA-OUT

June 1989

PIN CONNECTIONS

1/12

HCF40105BC1相似产品对比

	HCF40105BC1	HCF40105	HCC40105BF	HCF40105BEY	HCF40105B
描述	FIFO REGISTER	FIFO REGISTER	FIFO REGISTER	FIFO REGISTER	FIFO REGISTER
是否Rohs认证	不符合	-	不符合	不符合	-
厂商名称	ST(意法半导体)	-	ST(意法半导体)	ST(意法半导体)	-
零件包装代码	QLCC	-	DIP	DIP	-
包装说明	PLASTIC, LCC-20	-	DIP, DIP16,.3	PLASTIC, DIP-16	-
针数	20	-	16	16	-
Reach Compliance Code	_compli	-	_compli	_compli	-
ECCN代码	EAR99	-	EAR99	EAR99	-
最长访问时间	370 ns	-	370 ns	370 ns	-
最大时钟频率 (fCLK)	3 MHz	-	3 MHz	3 MHz	-
周期时间	333.33 ns	-	333.33 ns	125 ns	-
JESD-30 代码	S-PQCC-J20	-	R-GDIP-T16	R-PDIP-T16	-
JESD-609代码	e0	-	e0	e0	-
内存密度	64 bi	-	64 bi	64 bi	-
内存集成电路类型	OTHER FIFO	-	OTHER FIFO	OTHER FIFO	-
内存宽度	4	-	4	4	-
功能数量	1	-	1	1	-
端子数量	20	-	16	16	-
字数	16 words	-	16 words	16 words	-
字数代码	16	-	16	16	-
工作模式	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	-
最高工作温度	85 °C	-	125 °C	125 °C	-
最低工作温度	-40 °C	-	-55 °C	-55 °C	-
组织	16X4	-	16X4	16X4	-
输出特性	3-STATE	-	3-STATE	3-STATE	-
可输出	YES	-	YES	YES	-
封装主体材料	PLASTIC/EPOXY	-	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	-
封装代码	QCCJ	-	DIP	DIP	-
封装等效代码	LDCC20,.4SQ	-	DIP16,.3	DIP16,.3	-
封装形状	SQUARE	-	RECTANGULAR	RECTANGULAR	-
封装形式	CHIP CARRIER	-	IN-LINE	IN-LINE	-
并行/串行	PARALLEL	-	PARALLEL	PARALLEL	-
峰值回流温度（摄氏度）	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-
电源	3/15 V	-	3/18 V	3/15 V	-
认证状态	Not Qualified	-	Not Qualified	Not Qualified	-
座面最大高度	4.57 mm	-	5.08 mm	5.1 mm	-
最大供电电压 (Vsup)	15 V	-	18 V	20 V	-
最小供电电压 (Vsup)	3 V	-	3 V	3 V	-
标称供电电压 (Vsup)	5 V	-	5 V	5 V	-
表面贴装	YES	-	NO	NO	-
技术	CMOS	-	CMOS	CMOS	-
温度等级	INDUSTRIAL	-	MILITARY	MILITARY	-
端子面层	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
端子形式	J BEND	-	THROUGH-HOLE	THROUGH-HOLE	-
端子节距	1.27 mm	-	2.54 mm	2.54 mm	-
端子位置	QUAD	-	DUAL	DUAL	-
处于峰值回流温度下的最长时间	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	-
宽度	8.9662 mm	-	7.62 mm	7.62 mm	-

HCF40105BC1

HCF40105BC1概述

HCF40105BC1规格参数

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HCF40105BC1相似产品对比

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