9-BIT PARITY GENERATOR/CHECKER

| HCF40101B | HCF40101 | HCC40101BF | HCC40101B | HCF40101BC1 | HCF40101BEY | HCF40101BM1 | |
|---|---|---|---|---|---|---|---|
| 描述 | 9-BIT PARITY GENERATOR/CHECKER | 9-BIT PARITY GENERATOR/CHECKER | 9-BIT PARITY GENERATOR/CHECKER | 9-BIT PARITY GENERATOR/CHECKER | 9-BIT PARITY GENERATOR/CHECKER | 9-BIT PARITY GENERATOR/CHECKER | 9-BIT PARITY GENERATOR/CHECKER |
| 是否Rohs认证 | - | - | 不符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | - | - | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | - | - | DIP | - | QLCC | DIP | SOIC |
| 包装说明 | - | - | DIP, DIP14,.3 | - | QCCJ, LDCC20,.4SQ | PLASTIC, DIP-14 | SOP, SOP14,.25 |
| 针数 | - | - | 14 | - | 20 | 14 | 14 |
| Reach Compliance Code | - | - | _compli | - | compli | compli | compli |
| 其他特性 | - | - | ODD/EVEN PARITY GENERATOR; WITH INHIBIT | - | ODD/EVEN PARITY GENERATOR; WITH INHIBIT | ODD/EVEN PARITY GENERATOR; WITH INHIBIT | ODD/EVEN PARITY GENERATOR; WITH INHIBIT |
| 系列 | - | - | 4000/14000/40000 | - | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | - | - | R-GDIP-T14 | - | S-PQCC-J20 | R-PDIP-T14 | R-PDSO-G14 |
| JESD-609代码 | - | - | e0 | - | e3 | e3 | e4 |
| 负载电容(CL) | - | - | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | - | PARITY GENERATOR/CHECKER | - | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER | PARITY GENERATOR/CHECKER |
| 位数 | - | - | 9 | - | 9 | 9 | 9 |
| 功能数量 | - | - | 1 | - | 1 | 1 | 1 |
| 端子数量 | - | - | 14 | - | 20 | 14 | 14 |
| 最高工作温度 | - | - | 125 °C | - | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -55 °C | - | -40 °C | -55 °C | -55 °C |
| 输出极性 | - | - | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | - | - | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | DIP | - | QCCJ | DIP | SOP |
| 封装等效代码 | - | - | DIP14,.3 | - | LDCC20,.4SQ | DIP14,.3 | SOP14,.25 |
| 封装形状 | - | - | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | IN-LINE | - | CHIP CARRIER | IN-LINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | - | 3/18 V | - | 3/15 V | 3/15 V | 3/15 V |
| 传播延迟(tpd) | - | - | 700 ns | - | 700 ns | 700 ns | 700 ns |
| 认证状态 | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 5.08 mm | - | 4.57 mm | 5.1 mm | 1.75 mm |
| 最大供电电压 (Vsup) | - | - | 18 V | - | 15 V | 20 V | 20 V |
| 最小供电电压 (Vsup) | - | - | 3 V | - | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | - | - | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | - | NO | - | YES | NO | YES |
| 技术 | - | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | - | - | MILITARY | - | INDUSTRIAL | MILITARY | MILITARY |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | - | THROUGH-HOLE | - | J BEND | THROUGH-HOLE | GULL WING |
| 端子节距 | - | - | 2.54 mm | - | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | - | - | DUAL | - | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | - | 7.62 mm | - | 8.9662 mm | 7.62 mm | 3.9 mm |
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