NBCD ADDER
| 参数名称 | 属性值 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | unknow |
| 其他特性 | BCD ADDER; WITH INTERNAL RIPPLE CARRY; PERMITS RIPPLE CARRY CASCADING |
| 系列 | 4000/14000/40000 |
| JESD-30 代码 | R-GDIP-T16 |
| 逻辑集成电路类型 | ADDER/SUBTRACTOR |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |

| HCC4560BF | HCF4560 | HCC4560B | HCF4560BC1 | HCF4560BM1 | HCF4560B | HCF4560BEY | |
|---|---|---|---|---|---|---|---|
| 描述 | NBCD ADDER | NBCD ADDER | NBCD ADDER | NBCD ADDER | NBCD ADDER | NBCD ADDER | NBCD ADDER |
| 厂商名称 | ST(意法半导体) | - | - | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) |
| 零件包装代码 | DIP | - | - | QLCC | SOIC | - | DIP |
| 包装说明 | DIP, | - | - | QCCJ, | SOP, | - | DIP, |
| 针数 | 16 | - | - | 20 | 16 | - | 16 |
| Reach Compliance Code | unknow | - | - | compli | unknow | - | unknow |
| 其他特性 | BCD ADDER; WITH INTERNAL RIPPLE CARRY; PERMITS RIPPLE CARRY CASCADING | - | - | BCD ADDER; WITH INTERNAL RIPPLE CARRY; PERMITS RIPPLE CARRY CASCADING | BCD ADDER; WITH INTERNAL RIPPLE CARRY; PERMITS RIPPLE CARRY CASCADING | - | BCD ADDER; WITH INTERNAL RIPPLE CARRY; PERMITS RIPPLE CARRY CASCADING |
| 系列 | 4000/14000/40000 | - | - | 4000/14000/40000 | 4000/14000/40000 | - | 4000/14000/40000 |
| JESD-30 代码 | R-GDIP-T16 | - | - | S-PQCC-J20 | R-PDSO-G16 | - | R-PDIP-T16 |
| 逻辑集成电路类型 | ADDER/SUBTRACTOR | - | - | ADDER/SUBTRACTOR | ADDER/SUBTRACTOR | - | ADDER/SUBTRACTOR |
| 位数 | 4 | - | - | 4 | 4 | - | 4 |
| 功能数量 | 1 | - | - | 1 | 1 | - | 1 |
| 端子数量 | 16 | - | - | 20 | 16 | - | 16 |
| 最高工作温度 | 125 °C | - | - | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -55 °C | - | - | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | - | - | QCCJ | SOP | - | DIP |
| 封装形状 | RECTANGULAR | - | - | SQUARE | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | - | - | CHIP CARRIER | SMALL OUTLINE | - | IN-LINE |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 5.08 mm | - | - | 4.57 mm | 1.75 mm | - | 5.1 mm |
| 最大供电电压 (Vsup) | 18 V | - | - | 15 V | 15 V | - | 15 V |
| 最小供电电压 (Vsup) | 3 V | - | - | 3 V | 3 V | - | 3 V |
| 标称供电电压 (Vsup) | 5 V | - | - | 5 V | 5 V | - | 5 V |
| 表面贴装 | NO | - | - | YES | YES | - | NO |
| 技术 | CMOS | - | - | CMOS | CMOS | - | CMOS |
| 温度等级 | MILITARY | - | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | - | - | J BEND | GULL WING | - | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | - | 1.27 mm | 1.27 mm | - | 2.54 mm |
| 端子位置 | DUAL | - | - | QUAD | DUAL | - | DUAL |
| 宽度 | 7.62 mm | - | - | 8.9662 mm | 3.9 mm | - | 7.62 mm |
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