DUAL 64-STAGE STATIC SHIFT REGISTER

| HCC4517B | HCC4517BF | HCF4517BC1 | |
|---|---|---|---|
| 描述 | DUAL 64-STAGE STATIC SHIFT REGISTER | DUAL 64-STAGE STATIC SHIFT REGISTER | DUAL 64-STAGE STATIC SHIFT REGISTER |
| 是否Rohs认证 | - | 不符合 | 符合 |
| 厂商名称 | - | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | - | DIP | QLCC |
| 包装说明 | - | CERAMIC, DIP-16 | PLASTIC, LCC-20 |
| 针数 | - | 16 | 20 |
| Reach Compliance Code | - | _compli | compli |
| 其他特性 | - | OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER | OUTPUTS ALSO AVAILABLE AT 16TH, 32ND AND 48TH STAGE OF THE SHIFT REGISTER |
| 计数方向 | - | RIGHT | RIGHT |
| 系列 | - | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | - | R-GDIP-T16 | S-PQCC-J20 |
| JESD-609代码 | - | e0 | e3 |
| 负载电容(CL) | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT |
| 位数 | - | 64 | 64 |
| 功能数量 | - | 2 | 2 |
| 端子数量 | - | 16 | 20 |
| 最高工作温度 | - | 125 °C | 85 °C |
| 最低工作温度 | - | -55 °C | -40 °C |
| 输出特性 | - | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | - | DIP | QCCJ |
| 封装等效代码 | - | DIP16,.3 | LDCC20,.4SQ |
| 封装形状 | - | RECTANGULAR | SQUARE |
| 封装形式 | - | IN-LINE | CHIP CARRIER |
| 峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 5/15 V | 5/15 V |
| 传播延迟(tpd) | - | 400 ns | 400 ns |
| 认证状态 | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 5.08 mm | 4.57 mm |
| 最大供电电压 (Vsup) | - | 18 V | 15 V |
| 最小供电电压 (Vsup) | - | 3 V | 3 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V |
| 表面贴装 | - | NO | YES |
| 技术 | - | CMOS | CMOS |
| 温度等级 | - | MILITARY | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
| 端子形式 | - | THROUGH-HOLE | J BEND |
| 端子节距 | - | 2.54 mm | 1.27 mm |
| 端子位置 | - | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | - | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | - | 7.62 mm | 8.9662 mm |
| 最小 fmax | - | 3 MHz | 3 MHz |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved