32-STAGE STATIC LEFT/RIGHT SHIFT REGISTER
| HCC40100B | HCC40100BF | HCF40100B | HCF40100BM1 | HCF40100BC1 | HCF40100BEY | |
|---|---|---|---|---|---|---|
| 描述 | 32-STAGE STATIC LEFT/RIGHT SHIFT REGISTER | 32-STAGE STATIC LEFT/RIGHT SHIFT REGISTER | 32-STAGE STATIC LEFT/RIGHT SHIFT REGISTER | 32-STAGE STATIC LEFT/RIGHT SHIFT REGISTER | 32-STAGE STATIC LEFT/RIGHT SHIFT REGISTER | 32-STAGE STATIC LEFT/RIGHT SHIFT REGISTER |
| 是否Rohs认证 | - | 不符合 | - | 符合 | 符合 | 符合 |
| 零件包装代码 | - | DIP | - | SOIC | QLCC | DIP |
| 包装说明 | - | FRIT SEALED, CERAMIC, DIP-16 | - | SOP, DIP16,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 |
| 针数 | - | 16 | - | 16 | 20 | 16 |
| Reach Compliance Code | - | _compli | - | compli | compli | compli |
| 其他特性 | - | WRAP AROUND; CLOCK INHIBIT; OUTPUT CHANGES WITH THE FALLING EDGE OF SHIFT CLOCK | - | WRAP AROUND; CLOCK INHIBIT; OUTPUT CHANGES WITH THE FALLING EDGE OF SHIFT CLOCK | WRAP AROUND; CLOCK INHIBIT; OUTPUT CHANGES WITH THE FALLING EDGE OF SHIFT CLOCK | WRAP AROUND; CLOCK INHIBIT; OUTPUT CHANGES WITH THE FALLING EDGE OF SHIFT CLOCK |
| 计数方向 | - | BIDIRECTIONAL | - | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| 系列 | - | 4000/14000/40000 | - | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | - | R-GDIP-T16 | - | R-PDSO-G16 | S-PQCC-J20 | R-PDIP-T16 |
| JESD-609代码 | - | e0 | - | e3 | e3 | e3 |
| 负载电容（CL） | - | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | SERIAL IN SERIAL OUT | - | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT | SERIAL IN SERIAL OUT |
| 位数 | - | 32 | - | 32 | 32 | 32 |
| 功能数量 | - | 1 | - | 1 | 1 | 1 |
| 端子数量 | - | 16 | - | 16 | 20 | 16 |
| 最高工作温度 | - | 125 °C | - | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | - | -55 °C | - | -55 °C | -40 °C | -55 °C |
| 输出极性 | - | TRUE | - | TRUE | TRUE | TRUE |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | DIP | - | SOP | QCCJ | DIP |
| 封装等效代码 | - | DIP16,.3 | - | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | - | IN-LINE | - | SMALL OUTLINE | CHIP CARRIER | IN-LINE |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 3/18 V | - | 3/15 V | 3/15 V | 3/15 V |
| 传播延迟（tpd） | - | 720 ns | - | 720 ns | 720 ns | 720 ns |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 5.08 mm | - | 1.75 mm | 4.57 mm | 5.1 mm |
| 最大供电电压 (Vsup) | - | 18 V | - | 20 V | 15 V | 20 V |
| 最小供电电压 (Vsup) | - | 3 V | - | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | - | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | - | YES | YES | NO |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | - | MILITARY | - | MILITARY | INDUSTRIAL | MILITARY |
| 端子面层 | - | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | - | THROUGH-HOLE | - | GULL WING | J BEND | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | - | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | - | DUAL | - | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | - | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | - | 7.62 mm | - | 3.9 mm | 8.9662 mm | 7.62 mm |
| 最小 fmax | - | 1 MHz | - | 3 MHz | 1 MHz | 3 MHz |
嵌入式系统
Microchip MCU
模拟电子
微控制器 MCU
微控制器 MCU
ARM技术
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