电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HIF3BA-30P-254PFA-271

产品描述Headers u0026 Wire Housings 30P PIN HEADER PRESS-IN CNG FINISH
产品类别连接器   
文件大小700KB,共29页
制造商Hirose
官网地址http://www.hirose-connectors.com/
下载文档 详细参数 全文预览

HIF3BA-30P-254PFA-271在线购买

供应商 器件名称 价格 最低购买 库存  
HIF3BA-30P-254PFA-271 - - 点击查看 点击购买

HIF3BA-30P-254PFA-271概述

Headers u0026 Wire Housings 30P PIN HEADER PRESS-IN CNG FINISH

HIF3BA-30P-254PFA-271规格参数

参数名称属性值
产品种类
Product Category
Headers & Wire Housings
制造商
Manufacturer
Hirose
RoHSDetails
节距
Pitch
2.54 mm
主体材料
Contact Plating
Gold
电流额定值
Current Rating
1 A
绝缘电阻
Insulation Resistance
1000 MOhms
工厂包装数量
Factory Pack Quantity
1
电压额定值
Voltage Rating
200 V

文档预览

下载PDF文档
Ribbon Cable connector Compliant with MIL Standard
HIF3B Series
sFeatures
1. Product Compliant with MIL Standard
HIF3B series has been developed as a product compliant with MIL
standard, and used for wide applications.
2. UL Approval Product
Dec.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
HIF3B series connectors are UL approved.
3. Mechanism to Prevent Mis-insertion
This connector is equipped with the mechanism to prevent Mis-
insertion as follows.
1
The system provides the convex area to insert the guide-key on the
pin header side, and to guide it in combination with the socket
convex area (MIL standard).
2
The system embeds and guides the polarizing key in the socket holes.
4. Applicable Cable AWG#28
The applicable cable is UL2651 AWG#28 flat cable (7 cores./
0.127mm, jacket dia. 0.9±0.1mm).
sProduct
Specifications
Rating
Current rating : 1A
Operating Temperature Range :
–55 to +85ç
(Note 1) Storage Temperature Range :
–10 to +60ç
(Note 2)
Storage Humidity Range : 40
to
70% (Note 2)
Condition
500V DC
650V AC/1 minute
0.1A
Voltage rating : 200V AC Operating Moisture Range : 40
to
80%
Item
1. Insulation Resistance
2. Withstanding voltage
3. Contact Resistance
4. Vibration
1000M
ohms
min.
Specification
No flashover or insulation breakdown.
15m
ohms
max.
No electrical discontinuity of 1µs or more
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.
96 hours at temperature of 40ç and humidity of 90% to 95%
(-55ç: 30 minutes
15
to
35ç: 5 minutes max.
125ç: 30 minutes
15
to
35ç: 5 minutes max.) 5 cycles
500 cycles
Solder bath:
260ç for 10 seconds
5.
Humidity (Steady state)
Insulation resistance: 1000M
ohms
min.
6. Temperature Cycle
No damage, cracks, or parts looseness.
7. Durability (Mating/un-mating) Contact resistance: 15m
ohms
max.
8. Resistance to Soldering heat
No deformation of components affecting performance.
Manual soldering: 360ç for 5 seconds
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and
Humidity range covers non conducting condition of installed connectors in storage, shipment or during transportation.
Note 3: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a
specific part number shown.
Note 4: Please note that there is a risk of deforming the lock when an excessive load is applied to the inside.
sMaterial
Part
Insulator
Socket Contact
Pin header contact
Material
PBT
Beryllium copper
Brass
Connection area
Finish
Black
Gold plated
Selective Gold plated
Remarks
UL94V-0
–––––––
–––––––
B15
参与HELPER2416开发板助学计划:收到板子
本帖最后由 hongyancl 于 2014-7-9 16:21 编辑 板子终于收到了,上裸照啊 论坛ID:hongyancl日期:2014年7月9日 ...
hongyancl 嵌入式系统
ATSAME54开发板摄像头接口
有没有人用过这个开发板的摄像头接口,我想问一下,start上面配置的12M时钟输出给摄像头用怎么不行呀。设置完后,示波器显示也是12M,但就是配置摄像头寄存器不起作用。但是我用其他方式给摄像 ......
zhuzd ARM技术
TI封装工程师与您讲述——印刷电路板冷却技术与IC封装策略
作者:Sandra Horton,德州仪器 (TI) 封装工程师摘要表面贴装 IC 封装依靠印刷电路板 (PCB) 来散热。一般而言,PCB 是高功耗半导体器件的主要冷却方法。一款好的 PCB 散热设计影响巨大,它可以 ......
莫妮卡 模拟与混合信号
自己做的usb键盘开机过程按键 系统起来之后键盘失效
平时正常使用没问题,测试过程中如果在开机过程中一直按键的话 开机完成后键盘就不能输入了,感觉很像没有被枚举正确,但是在设备管理器中能看到这个键盘的设备。 开机过程中最初的时间可以 ......
哦,小法 Microchip MCU
launchpad c2000 tms320f28027
launchpad c2000 tms320f28027 Example_2802xAdc_TempSensorConv.c中温度转换程序((sensorSample - getTempOffset())*(int32)getTempSlope() + FP_ROUND + KELVIN_OFF)/FP_SCALE - KELVIN;怎 ......
the_wanted 微控制器 MCU
谁会用MSP430编写一个输入密码的程序并要和另一个MSP430之间进行通讯
如题,密码通过一个4x3键盘进行输入,输入之后密码要通过MSP430F2121的p1.0口输出到另一个单片机中,在另一片单片机中与储存的密码比较,然后进行开锁,哪位大神知道啊...
chlmf 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2086  1917  2721  2634  73  35  10  8  26  28 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved