HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6625-A
Issued Date : 1994.10.04
Revised Date : 2000.10.01
Page No. : 1/2
HBD678
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBD678 is designed for use as output devices in
complementary general purpose amplifier applications.
Features
•
High Current Gain
•
Monolithic Constructor
Absolute Maximum Ratings
(Ta=25°C)
•
Maximum Temperatures
Storage Temperature ............................................................................................ -50 ~ +150
°C
Junction Temperature ................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 40 W
•
Maximum Voltages and Currents
BVCBO Collector to Base Voltage ...................................................................................... 60 V
BVCEO Collector to Emitter Voltage................................................................................... 60 V
BVEBO Emitter to Base Voltage ........................................................................................... 5 V
IC Collector Current .............................................................................................................. 4 A
IB Base Current .................................................................................................................... 1 A
Electrical Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICEO
ICBO
IEBO
*VCE(sat)
*VBE(on)
*hFE
Min.
60
60
5
-
-
-
-
-
750
Typ.
-
-
-
-
-
-
-
-
-
Max.
-
-
-
200
200
2
2.5
2.5
-
Unit
V
V
V
uA
uA
mA
V
V
Test Conditions
IC=1mA
IC=50mA
IE=1mA
VCB=30V
VCB=60V
VBE=5V
IC=1.5A, IB=30mA
IC=1.5A, VCE=3V
IC=1.5A, VCE=3V
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126ML Dimension
Marking :
Spec. No. : HE6625-A
Issued Date : 1994.10.04
Revised Date : 2000.10.01
Page No. : 2/2
A
B
D
E
F
3
2
I
G
1
J
M
L
K
O
H
HSMC Logo
Part Number
Date Code
Product Series
Rank
Ink Marking
C
Style : Pin 1.Emitter 2.Collector 3.Base
N
3-Lead TO-126ML Plastic Package
HSMC Package Code : D
*:Typical
DIM
A
B
C
D
E
F
G
H
Inches
Min.
Max.
0.1356
0.1457
0.0170
0.0272
0.0344
0.0444
0.0501
0.0601
0.1131
0.1231
0.0737
0.0837
0.0294
0.0494
0.0462
0.0562
Millimeters
Min.
Max.
3.44
3.70
0.43
0.69
0.87
1.12
1.27
1.52
2.87
3.12
1.87
2.12
0.74
1.25
1.17
1.42
DIM
I
J
K
L
M
N
O
Inches
Min.
Max.
-
*0.1795
0.0268
0.0331
0.5512
0.5906
0.2903
0.3003
0.1378
0.1478
0.1525
0.1625
0.0740
0.0842
Millimeters
Min.
Max.
-
*4.56
0.68
0.84
14.00
15.00
7.37
7.62
3.50
3.75
3.87
4.12
1.88
2.14
Notes :
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
嵌入式系统
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