hH
Optical Reflective Sensors
Technical Data
HBCC-1570
HBCC-1580
HBCC-1590
Features
• Focused Emitter and
Detector in a Single
Package
• TO-5 Miniature Sealed
Package
• Photodiode Output
• Choice of Resolutions
(0.13 mm, 0.178 mm, 0.33 mm)
• Two Wavelengths
Available; 655 nm, 820 nm
(see selection guide)
Description
The HBCC-15XX series sensors
are fully integrated modules
designed for applications requir-
ing optical reflective sensing. The
modules contain a 655 nm (or 820
nm) LED emitter and a photo-
diode. A bifurcated aspheric lens
is used to image the active areas
of the emitter and detector to a
single spot 4.27 mm (0.168 in.) in
front of the package. The output
signal is a current generated by
the photodiode.
Applications
The HBCC-15XX sensors are
intended for use with the Hewlett-
Packard HBCC-0500 and HBCC-
0600 low current digitizer ICs, or
Selection Guide
Sensor Part Number
LED Resolution
LED Wavelength
HBCC-1570
0.33 mm (0.013 in.)
655 nm
HBCC-1580
0.185 mm (0.007 in.)
655 nm
9.40 (0.370)
8.51 (0.335)
5.08
(0.200)
HBCC-1590
0.13 mm (0.005 in.)
820 nm
Package Dimensions
MAXIMUM SIGNAL POINT – MSP
REFERENCE PLANE
S.P.
R.P.
12.0
(0.473)
O.D.
8.33 (0.328)
8.12 (0.320)
C
L
1.14 (0.045)
0.73 (0.029)
Z
0.86 (0.034)
0.73 (0.029)
NOTES:
A. ALL DIMENSIONS IN MILLIMETERS AND (INCHES).
B. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.
C. THE REFERENCE PLANE (R.P.) IS THE TOP SURFACE OF THE PACKAGE.
D. NICKEL CAN AND GOLD PLATED LEADS.
E. S.P. = SEATING PLANE.
F. THE LEAD DIAMETER IS 0.45 mm (0.018 in.) TYP.
G. O.D. = OUTSIDE DIAMETER OF CAN MEASURED IN REGION ABOVE
WELD FLANGE TO MIDWAY OF CAN LENGTH.
5.08
(0.200)
4.27 ± 0.25
(0.168) ± (0.010)
15.24 (0.600)
12.70 (0.500)
11.50 (0.453)
11.22 (0.442)
5965-5942E
4-7
with suitable PCB assemblies
provided by HP for use with these
sensors. The HBCC-15XX sensors
have been characterized for use
only with Hewlett-Packard’s
digitizer IC technology. Use of
these sensors in designs or appli-
cations other than those stated is
at the customer’s risk.
HBCC-1570, 1580 Optical System
EMITTER
BAFFLE
EPOXY SEAL
Mechanical
Considerations
The HBCC-15XX series are
packaged in a high profile 8 pin
TO-5 metal can with a glass
window. The LED and photodiode
are mounted on a header at the
base of the package. Positioned
above these active elements is a
bifurcated aspheric acrylic lens
that focuses them to the same
point.
The sensor can be rigidly secured
by commercially available TO-5
style heat sinks or 8 pin 0.200 inch
diameter pin circle sockets. These
fixtures provide a stable reference
platform for affixing the HBCC-
15XX sensors to a circuit board.
In applications requiring contact
scanning (such as bar code
reading), protective focusing tips
are available. Focusing tips are
available in either metal or poly-
carbonate packages using a
sapphire ball as the contact
surface. The Hewlett-Packard part
numbers are HBCS-2999, HBCS-
4999, HBCS-A998, and
HBCS-A999.
GLASS
LENS
DETECTOR
SENSING
AREA
HBCC-1590 Optical System
SILICON
BAFFLE
EMITTER
0.089 mm DIA. JUNCTION
OPTICAL
APERTURE
BAFFLE
EPOXY SEAL
SENSING
AREA
GLASS
LENS
DETECTOR
0.406 mm SQUARE
Electrical Operation
The sensor detector is a pn
photodiode. The LED cathode is
physically and electrically con-
nected to the case-substrate of the
sensor.
The HBCC-15XX sensors are
characterized for use with Hewlett-
Packard’s low current digitizer
ICs. The digitizer IC part numbers
are HBCC-0500 and HBCC-0600.
Data Sheets including circuit
diagrams are available.
4-8
Absolute Maximum Ratings
T
A
= 25°C unless specified otherwise (unless specified separately, data applies to all sensors)
Parameter
Storage Temperature
Operating Temperature
Lead Soldering Temperature
(1.6 mm from Seating Plane)
Average LED Forward Current
Peak LED Forward Current
If
Ifp
125
100
40
5.0
2.5
-0.3
6.0
mA
mA
mA
V
V
V
Symbol
T
S
T
A
Min.
-40
-20
Max.
+75
+75
260
(for 10 seconds)
Units
°C
°C
°C
1
2
3 (HBCC-1570)
3 (HBCC-1580)
4 (HBCC-1590)
HBCC-1590 Only
5
Notes
Reverse LED Input Voltage
Photodiode Bias
Vr
Vd
Notes:
1. CAUTION: The thermal constraints of the acrylic lens will not permit conventional wave soldering procedures. The typical
preheat and post-soldering cleaning procedures and dwell times can subject lens to thermal stresses beyond the absolute
maximum ratings and can cause it to defocus.
2. These sensors are specified for use with the drive conditions provided by the HBCC-0500 and HBCC-0600 Digitizer IC ONLY.
3. When used with HBCC-0500 or HBCC-0600 digitizer ICs.
4. At all combinations of pulse width and duty cycle.
5. Voltage differential between Pin 1 and Pin 8 with Pin 8 taken as reference. Exceeding maximum conditions may cause permanent
damage to photodiode or to chip metallization.
REFLECTOR
REFERENCE
PLANE
8
Z
1
D ps
Rs
+
LED
3
4
CASE, SUBSTRATE
TOP VIEW
Rs = CHARACTERISTIC NOT DEFINED
SCHEMATIC DIAGRAM
CONNECTION DIAGRAM
5
7
PIN#
1
2
6
6
8
2
6
LED
D ps
Rs
1
8
FUNCTION
PHOTODIODE CATHODE
HEADER GROUND
LED ANODE
PHOTODIODE ANODE
2
4-9
HBCC-1570 and HBCC-1580: Electrical and Optical Characteristics
T
A
= 25°C
Parameter
Reflected
Photocurrent
Quality Factor
Maximum Signal
Point (MSP)
LED Forward
Voltage
LED Reverse
Breakdown Voltage
Photodiode
Dark Current
Photodiode
Capacitance
LED Peak
Wavelength
Ipr Temperature
Coefficient
System Optical
Step Response
(OSR)
HBCC-1570
(OSR)
HBCC-1580
Symbol
Ipr
<Q>
Z
Vf
BVR
Id
Cd
λ
Ke
d
0.82
4.11
(0.162)
1.5
5.0
–
–
–
–
–
Min.
Typ.
(see Bin Table)
0.95
4.27
(0.168)
1.75
–
60
100
60
650
-0.006
0.268
(0.0106)
1.0
4.42
(0.174)
2.0
–
1000
–
–
670
–
–
Max.
Units
nA
–
mm
(in.)
V
V
pA
pF
pF
nm
1/°C
mm
(in.)
Conditions
If = 70 mA
peak
If = 70 mA
peak
If = 70 mA
peak
If = 70 mA
Ir = 100
µA
Vd = 5 V
Vd = 0 V
Vd = 1 V
If = 35 mA DC
If = 35 mA DC
4.27 mm
(Target from
sensor)
4.27 mm
(Target from
sensor)
10
11
7A
Note
6,7
6,8
6,9
1, 4A, 4B
3
Figure
1,2A,
4A, 4B, 5
6A
d
–
0.154
(0.0061)
–
mm
(in.)
11
7B
Notes:
6. Measured from a reflector coated with 99% diffuse reflective white paint (Kodak 6080) positioned 4.27 mm (0.168 in.) from the
reference plane. Measured physically is the total photocurrent, Ipt, which consists of a signal (reflected from target) component,
Ipr, and a component induced by reflections internal to the sensor (stray), Ips. Ipt = Ipr + Ips. Specified is the reflected signal
component, Ipr.
7. See Bin Table
8. <Q> = Ipr/Ipt
9. Measured from reference plane (R.P.) of sensor.
10. Photocurrent variation with temperature varies with LED output which follows a natural exponential law:
Ip(T) = Ip(To)*exp[Ke(T-To)]
11. OSR is defined as the distance for a 10%-90% “step” response of Ipr as the sensor moves over an abrupt black-white edge, or from
opaque white to free space (no reflection).
4-10
HBCC-1590: Electrical and Optical Characteristics
T
A
= 25°C
Parameter
Reflected
Photocurrent
Quality Factor
Maximum Signal
Point (MSP)
LED Forward
Voltage
LED Reverse
Breakdown Voltage
Photodiode
Dark Current
Photodiode
Capacitance
LED Peak
Wavelength
Ipr Temperature
Coefficient
System Optical
Step Response
(OSR)
Symbol
Ipr
<Q>
Z
Vf
BVR
Id
Cd
λ
Ke
d
Min.
Typ.
Max.
Units
nA
1.0
4.62
(0.182)
1.8
–
1000
–
835
–
–
–
–
mm
(in.)
V
V
pA
pF
pF
nm
1/°C
mm
(in.)
Conditions
If = 30 mA
peak
If = 30 mA
peak
If = 30 mA
peak
If = 30 mA
Ir = 100
µA
Vd = 5 V
Vd = 0 V
Vd = 1 V
If = 35 mA DC
If = 35 mA DC
4.27 mm
(Target from
sensor)
10
11
7C
6B
Note
6,7
6,8
6,9
1, 4C
3
Figure
1,2B,
4C, 5
(see Bin Table)
0.82
4.01
(0.158)
1.3
2.5
–
–
805
–
–
–
0.95
4.27
(0.168)
1.45
–
60
100
60
820
-0.005
0.140
(0.0055)
REFLECTOR
REFERENCE
PLANE
Z
+Vf
6
If
Rs
2
CASE, SUBSTRATE
LED
D ps
8
1
Ipt
nA-METER
Figure 1. Photocurrent Test Circuit.
4-11
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