HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6829
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 1/3
HBC857
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HBC857 is designed for switching and AF amplifier amplification
suitable for automatic insertion in thick and thin-film circuits.
Absolute Maximum Ratings
SOT-23
•
Maximum Temperatures
Storage Temperature .......................................................................................... -55 to +150
°C
Junction Temperature.................................................................................................... +150
°C
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 225 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................ -50 V
VCEO Collector to Emitter Voltage..................................................................................... -45 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current....................................................................................................... -100 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
*VCE(sat)1
*VCE(sat)2
*VBE(sat)1
*VBE(sat)2
VBE(on)1
VBE(on)2
*hFE
fT
Cob
Min.
-50
-45
-5
-
-
-
-
-
-600
-
110
-
-
Typ.
-
-
-
-
-90
-250
-700
-900
-
-
-
150
-
Max.
-
-
-
-15
-300
-650
-
-
-750
-800
800
-
6
Unit
V
V
V
nA
mV
mV
mV
mV
mV
mV
MHz
pF
Test Conditions
IC=-100uA
IC=-1mA
IE=-10uA
VCB=-30V
IC=-10mA, IB=-0.5mA
IC=-100mA, IB=-5mA
IC=-10mA, IB=-0.5mA
IC=-100mA, IB=-5mA
VCE=-5V, IC=-2mA
VCE=-5V, IC=-10mA
VCE=-5V, IC=-2mA
VCE=-5V, IC=-10mA
VCB=-10V, f=1MHz, IE=0
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Classification Of hFE
Rank
hFE
A
110-220
B
200-450
C
420-800
HBC857
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
10
Spec. No. : HE6829
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 2/3
Saturation Voltage & Collector Current
V
CE
=5V
Saturation Voltage (V)
100
1
hFE
10
0.1
V
CE(sat)
@ I
C
=20I
B
1
0.01
0.1
1
10
100
Collector Current (mA)
0.01
0.01
0.1
1
10
100
Collector Current (mA)
On Voltage & Collector Current
10
1000
Cutoff Frequency & Collector Current
Cutoff Frequnce (MHz)
1
V
CE
=5V
On Voltage (V)
V
BE(ON)
@ V
CE
=5V
100
0.1
0.01
0.01
10
0.1
1
10
100
1
10
100
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
10
Safe Operation Area
10000
PT=1ms
1000
PT=100ms
Cob
Collector Current-I
C
(mA)
Capacitance (pF)
1
100
PT=1s
10
0.1
0.1
1
10
100
1
1
10
100
Reverse-Biased Voltage (V)
Forward Biased Voltage-V
CE
(V)
HBC857
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6829
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 3/3
A
L
Marking:
3
B S
1
V
G
2
9 B
Rank Code
Control Code
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102
0.1204
0.0472
0.0630
0.0335
0.0512
0.0118
0.0197
0.0669
0.0910
0.0005
0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034
0.0070
0.0128
0.0266
0.0335
0.0453
0.0830
0.1083
0.0098
0.0256
Millimeters
Min.
Max.
0.085
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC857
HSMC Product Specification
模拟与混合信号
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