HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 1/4
HBC327
PNP EPITAXIAL PLANAR TRANSISTOR
Description
This HBC327 is designed for driver and output-stages of audio
amplifiers.
Features
•
High DC Current Gain: 100-600 at IC=100mA,VCE=1V
•
Complementary to HBC337
TO-92
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 625 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................ -50 V
VCEO Collector to Emitter Voltage ..................................................................................... -45 V
VEBO Emitter to Base Voltage ............................................................................................. -5 V
IC Collector Current ...................................................................................................... -500 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*hFE1
*hFE2
*VCE(sat)1
VBE(on)
fT
Cob
Min.
-50
-45
-5
-
-
100
40
-
-
-
-
Typ.
-
-
-
-
-
-
-
-
-
100
4
Max.
-
-
-
-100
-100
600
-
-0.7
-1.2
-
-
Unit
V
V
V
nA
nA
Test Conditions
IC=-100uA, IE=0
IC=-10mA, IB=0
IE=-100uA, IC=0
VCB=-30V, IE=0
VEB=-5V, IC=0
VCE=-1V, IC=-100Ma
VCE=-1V, IC=-300mA
IC=-500mA, IB=-50mA
VCE=-1V, IC=-300mA,
VCE=-5V, IC=-10mA, f=100MHZ
VCB=-10V, f=1MHZ, IC=0
V
V
MHZ
PF
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Classification of hFE1
Rank
Range
16
100-250
25
160-400
40
250-600
HBC327
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
1000
V
CE(sat)
@ I
C
=10I
B
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 2/4
Saturation Voltage & Collector Current
125 C
o
100
25 C
o
Saturation Voltage (mV)
hFE
75 C
o
100
125 C
o
o
hFE @ V
CE
=1V
10
1
10
100
1000
10
0.1
1
25 C
75 C
o
10
100
1000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
ON Voltage & Collector Current
1000
25 C
o
Cutoff Frequency & Collector Current
1000
Cutoff Frequency (MHz)
..
.
ON Voltage (mV)
75 C
125 C
o
o
V
CE
=5V
100
V
BE(ON)
@ V
CE
=1V
100
0.1
1
10
100
1000
10
1
10
100
1000
Collector Current-I
C
(mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100
10000
Safe Operating Area
PT=100ms
PT=1ms
Collector Current-I
C
(mA)
1000
PT=1s
Capacitance (pF)
Cob
10
100
10
1
0.1
1
10
100
1
1
10
100
Reverse Biased Voltage (V)
Forward Voltage-V
CE
(V)
HBC327
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 3/4
PD-Ta
700
600
Power Dissipation-PD (mW)
500
400
300
200
100
0
0
50
100
o
150
200
Ambient Temperature-Ta ( C)
HBC327
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Date Code
Spec. No. : HE6413
Issued Date : 1993.01.15
Revised Date : 2002.02.05
Page No. : 4/4
α
2
Marking:
H
BC
3 2 7
Control Code
α
3
C
Style: Pin 1.Collector 2.Base 3.Emitter
D
H
I
E
F
G
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*
0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*
1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*
0.1000
-
*
0.0500
-
*
5°
-
*
2°
-
*
2°
Millimeters
Min.
Max.
0.36
0.56
-
*
2.54
-
*
1.27
-
*
5°
-
*
2°
-
*
2°
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC327
HSMC Product Specification
stm32/stm8
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