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SRU5028-330Y

产品描述PCI Express / PCI Connectors 0.8MM PITCH MINI PCI TCH MINI PCI-E CONN.
产品类别无源元件    电感器   
文件大小238KB,共2页
制造商Bourns
官网地址http://www.bourns.com
标准
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SRU5028-330Y概述

PCI Express / PCI Connectors 0.8MM PITCH MINI PCI TCH MINI PCI-E CONN.

SRU5028-330Y规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明2020
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time18 weeks
大小写代码2020
构造Rectangular
型芯材料FERRITE
直流电阻0.203 Ω
标称电感 (L)33 µH
电感器应用POWER INDUCTOR
电感器类型GENERAL PURPOSE INDUCTOR
JESD-609代码e3
功能数量1
端子数量2
最高工作温度125 °C
最低工作温度-40 °C
封装高度2.8 mm
封装长度5.2 mm
封装形式SMT
封装宽度5.2 mm
包装方法TR, Embossed, 7 Inch
最大额定电流0.8 A
自谐振频率16 MHz
形状/尺寸说明RECTANGULAR PACKAGE
屏蔽YES
表面贴装YES
端子面层Tin (Sn)
端子位置DUAL ENDED
端子形状WRAPAROUND
测试频率0.1 MHz
容差30%
Base Number Matches1

文档预览

下载PDF文档
M
PL
IA
NT
Features
Available in E6 series
Unit height of 2.8 mm
Current up to 3.5 A
Applications
Input/output of DC/DC converters
Power supplies for:
*R
oH
S
CO
680
RoHS compliant*
Portable communication equipment
Camcorders
LCD TVs
Car radios
SRU5028 Series - Shielded SMD Power Inductors
Electrical Specifications
Bourns
Part Number
Inductance
@ 100 KHz
L (µH)
Tol. (%)
Q
Ref.
Test
Freq.
(MHz)
SRF
Min.
(MHz)
RDC
(mΩ)
I rms
Max.
(A)
I sat
Typ.
(A)
**K-
Factor
General Specifications
Test Voltage ....................................0.1 V
Reflow Soldering .. 230 °C, 50 sec. max.
Operating Temp. .........-40 °C to +125 °C
(Temperature rise included)
Storage Temp. ............-40 °C to +125 °C
Resistance to Soldering Heat
............................... 260 °C for 10 sec.
Materials
Core ....................Ferrite DR and RI core
Wire ............................Enameled copper
Terminal ....................................Ag/Ni/Sn
Rated Current..Ind. drop 35 % typ. at Isat
Temp. Rise.......40 °C max. at rated Irms
Packaging .................... 600 pcs. per reel
Product Dimensions
5.2 ± 0.2
(.205 ± .008)
SRU5028-1R2Y
SRU5028-2R2Y
SRU5028-3R3Y
SRU5028-4R7Y
SRU5028-6R8Y
SRU5028-100Y
SRU5028-150Y
SRU5028-220Y
SRU5028-330Y
SRU5028-470Y
SRU5028-680Y
SRU5028-101Y
1.2
2.2
3.3
4.7
6.8
10.0
15.0
22.0
33.0
47.0
68.0
100.0
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
±30
10
10
10
9
10
18
18
15
15
13
13
15
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
0.796
200
130
90
50
55
25
23
18
16
13
10
8
16.8
21.0
24.0
32.0
42.0
63.0
108.0
162.0
203.0
285.0
450.0
625.0
3.50
3.20
2.80
2.20
2.00
1.80
1.10
0.95
0.80
0.70
0.56
0.47
3.40
2.50
2.10
1.85
1.55
1.40
1.00
0.85
0.68
0.62
0.46
0.42
453
313
272
214
177
151
123
95
87
69
59
50
**K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x
Δ
I (peak-to-peak ripple current, A),
determine core loss from
Core Loss vs. Flux Density
plot.
Core Loss vs. Flux Density
1000
5.2 ± 0.2
(.205 ± .008)
2.8 ± 0.2
(.110 ± .008)
100
3.9
TYP.
(.154)
1.7
(.067)
TYP.
Core Loss (mW)
10
1 MHz
500 KHz
300 KHz
200 KHz
100 KHz
50 KHz
1
1.8
TYP.
(.071)
1.7
TYP.
(.067)
Recommended Layout
0.1
100
1000
10000
1.1
(.043)
REF.
1.1
(.043)
REF.
1.1
(.043)
REF.
Flux Density Bp-p (gauss)
3.7
(.146)
REF.
Electrical Schematic
Inductor Connection
3.7
(.146)
REF.
* RoHS Directive 2002/95/EC Jan. 27, 2003 including
annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data
sheet can and do vary in different applications and
actual device performance may vary over time.
Users should verify actual device performance in their
specific applications.
2.0
(.079)
REF.
1.1
(.043)
REF.
REF.
2.0
(.079)
LCR METER
DIMENSIONS:
MM
(INCHES)

SRU5028-330Y相似产品对比

SRU5028-330Y BLU1206-5360-CB5Q SRU5028-4R7Y MP220-8661-FT25W
描述 PCI Express / PCI Connectors 0.8MM PITCH MINI PCI TCH MINI PCI-E CONN. Fixed Resistor, Thin Film, 0.25W, 536ohm, 150V, 0.25% +/-Tol, 5ppm/Cel, 1206 Power Management Specialized - PMIC 5-CH IPS w/ Quad Buck Reg 200mA LDO Fixed Resistor, 20W, 8660ohm, 500V, 1% +/-Tol, 25ppm/Cel, 4018,
是否Rohs认证 符合 不符合 符合 符合
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
构造 Rectangular Chip Rectangular Molded
最高工作温度 125 °C 155 °C 125 °C 155 °C
封装高度 2.8 mm 0.5 mm 2.8 mm 19 mm
封装长度 5.2 mm 3.2 mm 5.2 mm 10.2 mm
封装形式 SMT SMT SMT Radial
封装宽度 5.2 mm 1.6 mm 5.2 mm 4.5 mm
包装方法 TR, Embossed, 7 Inch Bulk TR, Embossed, 7 Inch Tape
容差 30% 0.25% 30% 1%
JESD-609代码 e3 e0 e3 -
端子数量 2 2 2 -
最低工作温度 -40 °C - -40 °C -55 °C
端子面层 Tin (Sn) Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin (Sn) -

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